EPOXY BASED ADHESIVES

BY: ARJUN SATHEESH, ASWIN V T, BASIL THOMAS MATHEW

 EPOXY RESINS
• Epoxy/polyepoxides/epoxide resins are
a class of reactive compounds that are
characterized by the presence of 2 or
more epoxy (a.k.a oxirane/glycidyl
group)
• React with suitable hardeners to form
cross-linked matrices of great strength
and excellent adhesive properties.
• Unique characteristics
• Negligible shrinkage during cure.
• Excellent chemical resistance,
• Ability to bond nonporous substrates in
addition to excellent cohesive strength
• Serviceable temperature –157°C-204°C
 EPOXY BASED
ADHESVIVES

2-PART 1-PART
ADHESIVE S/M ADHESIVE S/M

RESIN
RESIN HARDENER (hardener
incorporated)

Epoxy-
Bisphenol Epoxy-
Polysulphide
Epoxy Resins Phenolic Resin
Resin
 ALIPHATIC EPOXY BASED
ADHESIVES
• Involves compounds based on bisphenols of ethers
• DGEBA was the first commercially viable resin adhesive and is the backbone
of many formulations produced today
• SYNTHESIS: Epichlorohydrin & Bisphenol-A
• Commercially useful grades: 0<n<4
• 0<n<1: Liquid adhesive application
• As n increases they tend to become solid & brittle. Solid grades find application
principally in paints
• 2 epoxy groups per molecule
• Greater functionality can be synthesized from polyols having more than 2
hydroxyl groups per molecule eg: Epoxy Novolac Resins
 TYPES OF HARDNERS
• Aliphatic polyamine hardeners:
• These are used in adhesive systems capable of curing at
normal or slightly elevated temperatures.
• Eg: Diethylenetriamine, triethylenetetramine &
diethylenepropylamine.
• Fatty polyamides:
• Condensation products of polyamines and unsaturated fatty
acids.
• Large amount of hardener required, however imparts flexibility.
• Most widely used epoxy curing agents.
• Aromatic polyamine hardeners:
• Solid hardeners
• Provide poorer bond strengths
• High Shrinkage.
• eg: metaphenylenediamine, diaminodiphenylmethane, and
diaminodiphenyl sulfone.
 TYPES OF HARDNERS
• Anhydride hardeners:
• Organic polycarboxylic anhydrides.
• Requiring severe curing cycles.
• Thermal stability superior to that of the amines.
• Often brittle and hence require a flexibility stabilizer,
which will result in reduced heat and chemical
resistance
• Boron trifluoride hardeners:
• Boron trifluoride monoethylamine melts at 95
°C and is used in one-part adhesives.
• Miscellaneous curing agents:
• Dicyandiamide, used in metal bonding.
• Melts at about 200 ° C and is non-reactive at RT,
convenient for use in a one-package adhesive in
the form of a powder or rod.
 EPOXY-PHENOLIC ADHESIVES
• Blends of thermosetting phenolic and
epoxy resins.
• Structural adhesives for military use,
designed for service between 149 °C and
260 °C.
• Supplied as viscous liquids, which may
contain solvents, or as glass-cloth or fabric-
supported films or tapes and often
modified with fillers and thermal stabilizers.
• Excellent shear & tensile strength over a
wide temperature range.
• Poor peel and impact strength. Films give
better strengths than liquid systems.
EPOXY-PHENOLIC ADHESIVES
• Epoxy-phenolic film and tape adhesives
have good resistance to weathering, aging,
water, weak acids, aromatic fuels, glycols,
and hydrocarbon solvents.
• The service-temperature: -60 °C - 200 °C.
Special formulations: -260 °C
• Applications
• High-temperature structural bonding of metals viz.
Cu and alloys, Ti, galvanized Fe and Mg, glass
and ceramics, and phenolic composites.
• In bonding honeycomb sandwich composites.
 EPOXY-POLYSULFIDE ADHESIVES
• Products of reaction between an epoxy resin and
liquid polysulfide polymer, usually catalyzed by an
additional 3° amine.
• Available as 2-part liquids or pastes
• Cured at RT or higher temperatures to rubbery solids
that provide bonds with excellent flexibility and
chemical resistance.
• Low shear strength and elevated-temperature
properties.
• Mediocre resistance to peel and low temperature.
• Cure time: 24 hrs at 20 °C, or up to 20 mins at 100 ° C
• Low bonding pressures 0.07 – 0.16 Mpa
• Resistance to water, salt spray, hydrocarbon fuels,
alcohols, and ketones isacceptable. Resistance to
weathering properties is excellent
 EPOXY-POLYSULFIDE ADHESIVES
• Epoxy-polysulfide adhesives are suitable for
used down to – 100 °C and lower
temperatures. C. The maximum service
temperature is about 50 °C to 71 – 82 °C.
• Epoxy-polysulfides can be heavily filled without
adversely affecting their properties
• Applications:
• Structural assemblies requiring some degree of
resilience.
• Used in bonding concrete for floors, airport
runways, bridges and other concrete structures,
metals, glass and ceramics, wood, rubber, and
some plastics.
• They are particularly durable in outdoor
applications where temperature extremes
(freeze – thaw cycles) will be encountered.
GALLERY
 REFERENCES
• ADHESIVES TECHNOLOGY HANDBOOK 2nd Edition, Sina Ebnesajjad
• Handbook of Adhesive Technology, 2nd Edition, Revised and Expanded and
edited by A. Pizzi & K. L. Mittal
• https://en.wikipedia.org/wiki/Epoxy
• Epoxy Resins: Chemistry and Technology Second Edition, Clayton May
THANK YOU….!