Cree Xlamp XM-L™ Leds: Product Description Features

CLD-DS33 Rev 11I
Product family data sheet
Cree® XLamp® XM-L™ LEDs
Product Description FEATURES Table of Contents

The XLamp® XM-L™ LED is the industry’s • Maximum drive current: 3000 mA Characteristics........................................ 2
highest performance, single‑die white • Low thermal resistance: 2.5 °C/W Flux Characteristics................................ 3
lighting‑class LED. The XLamp XM-L LED • Maximum junction temperature: Relative Spectral Power Distribution..... 4
is 20% more efficient than the XLamp 150 °C Relative Flux vs. Junction
XP-G LED at the same current, and can • Viewing angle: 125° Temperature............................................ 4
deliver 1000 lumens with 100 lumens per • Available in cool white, 80‑CRI Electrical Characteristics........................ 5
watt efficacy. The XLamp XM-L LED offers minimum neutral white and 80‑CRI, Relative Flux vs. Current......................... 5
Cree’s industry-leading features: wide 85‑CRI and 90‑CRI warm white Relative Chromaticity vs. Current (Cool
viewing angle, symmetrical package, • ANSI‑compatible chromaticity bins White)....................................................... 6
unlimited floor life and electrically neutral • Unlimited floor life at Relative Chromaticity vs. Temperature
thermal path. ≤ 30 ºC/85% RH (Cool White)............................................. 6
• Reflow solderable - JEDEC Relative Chromaticity vs. Current
XLamp XM-L LEDs can enable LED light J‑STD‑020C (Warm White).......................................... 7
into new applications that require tens • Electrically neutral thermal path Relative Chromaticity vs. Temperature
of thousands of lumens, such as high • RoHS and REACh compliant (Warm White).......................................... 7
bay and high-output area lighting. The • UL® recognized component Typical Spatial Distribution..................... 8
XM-L is also the ideal choice for lighting (E349212) Thermal Design....................................... 8
applications where high light output and Reflow Soldering Characteristics........... 9
maximum efficacy are required, such as Notes..................................................... 10
LED light bulbs, outdoor lighting, portable Mechanical Dimensions....................... 12
lighting, indoor lighting and solar- Tape and Reel........................................ 13
powered lighting. Packaging.............................................. 14
www.cree.com/Xlamp
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and Cree, Inc.
XLamp® are registered trademarks and XM-L™ is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp ® XM-L™ LED
Characteristics
Characteristics Unit Minimum Typical Maximum
Thermal resistance, junction to solder point °C/W 2.5
Viewing angle (FWHM) degrees 125
Temperature coefficient of voltage mV/°C -2.1
ESD withstand voltage (HBM per Mil-Std-883D) V 8000
DC forward current mA 3000
Reverse voltage V 5
Forward voltage (@ 700 mA) V 2.9 3.5
Forward voltage (@ 1500 mA) V 3.1
Forward voltage (@ 3000 mA) V 3.35
LED junction temperature °C 150
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks and XM-L™ is a
trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
Flux Characteristics (TJ = 25 °C)
The following table provides several base order codes for XLamp XM-L LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-
code nomenclature, please consult the XLamp XM-L LED Binning and Labeling document.
Minimum Luminous Flux @ Calculated Minimum

CCT Range
700 mA Luminous Flux (lm)*
Color Order Code
Min. Max. Group Flux (lm) 1000 mA 1500 mA 2000 mA
T5 260 360 511 643 XMLAWT-00-0000-0000T5051
Cool White 5000 K 8300 K T6 280 388 551 692 XMLAWT-00-0000-0000T6051
U2 300 416 590 742 XMLAWT-00-0000-0000U2051
T4 240 332 472 593 XMLAWT-00-0000-000LT40E4

Neutral White 3700 K 5000 K
T5 260 360 511 643 XMLAWT-00-0000-000LT50E4
T2 200 277 393 494 XMLAWT-00-0000-000HT20E7

80-CRI White 2600 K 4300 K
T3 220 305 433 544 XMLAWT-00-0000-000HT30F7
T2 200 277 393 494 XMLAWT-00-0000-000LT20E7

Warm White 2600 K 3700 K
T3 220 305 433 544 XMLAWT-00-0000-000LT30F7
S4 164 227 323 406 XMLAWT-00-0000-000PS40E7
85-CRI White 2600 K 3200 K S5 172 238 338 425 XMLAWT-00-0000-000PS50E7
S6 182 252 358 450 XMLAWT-00-0000-000PS60E7
S4 164 227 323 406 XMLAWT-00-0000-000US40E7
90-CRI White 2600 K 3200 K S5 172 238 338 425 XMLAWT-00-0000-000US50E7
S6 182 252 358 450 XMLAWT-00-0000-000US60E7
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 10).
• Typical CRI for Cool White (5000 K – 8300 K CCT) is 65.
• Typical CRI for Neutral White (3700 K – 5000 K CCT) is 75.
• Typical CRI for Warm White (2600 K – 3700 K CCT) is 80.
• Minimum CRI for 80-CRI White is 80.
• Minimum CRI for 85-CRI White is 85.
• Minimum CRI for 90-CRI White is 90
* Calculated flux values are for reference only.
3
Relative Spectral Power Distribution
100
80
Relative Radiant Power (%)
60
5000 K - 8300 K CCT
3700 K - 5000 K CCT
40 2600 K - 3700 K CCT
20
0
380 430 480 530 580 630 680 730 780
Wavelength (nm)
Relative Flux vs. Junction Temperature (IF = 700 mA)
100%
90%
80%
Relative Luminous Flux
70%
60%
50%
40%
30%
20%
10%
0%
25 50 75 100 125 150
Junction Temperature (ºC)
4
Electrical Characteristics
Electrical Characteristics (Tj =(T25ºC)
J
= 25 °C)
3000
2800
2600
2400
2200
Forward Current (mA)
2000
1800
1600
1400
1200
1000
800
600
400
200
0
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)

Relative Flux vs. Current (TJ = 25 °C)
350%
325%
300%
275%
Relative Luminous Flux
250%
225%
200%
175%
150%
125%
100%
75%
50%
25%
0%
0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000
Forward Current (mA)
5
Relative Chromaticity vs. Current (Cool White)

Cool White
0.020
0.015
0.010
0.005
ΔCCx
0.000
ΔCCy
-0.005
-0.010
-0.015
-0.020
0 500 1000 1500 2000 2500 3000
Current (mA)
Relative Chromaticity vs. Temperature (Cool White)

Cool White
0.020
0.015
0.010
0.005
ΔCCx
0.000
ΔCCy
-0.005
-0.010
-0.015
-0.020
25 50 75 100 125 150
Tsp (°C)
6
Relative Chromaticity vs. Current (Warm White)

Warm White
0.020
0.015
0.010
0.005
ΔCCx
0.000
ΔCCy
-0.005
-0.010
-0.015
-0.020
0 500 1000 1500 2000 2500 3000
Current (mA)
Warm White vs. Temperature (Warm White)

Relative Chromaticity
0.020
0.015
0.010
0.005
ΔCCx
0.000
ΔCCy
-0.005
-0.010
-0.015
-0.020
25 50 75 100 125 150
Tsp (°C)
7
Typical Spatial Distribution
100%
80%
Relative Luminous Intensity
60%
40%
20%
0%
-100 -80 -60 -40 -20 0 20 40 60 80 100
Angle (º)
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
Thermal Design
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
3500
3000
Maximum Current (mA)
2500
2000
1500
1000 Rj-a = 4 °C/W

Rj-a = 7 °C/W
500 Rj-a = 10 °C/W
Rj-a = 15 °C/W
0
0 20 40 60 80 100 120 140 160
Ambient Temperature (ºC)
8
Reflow Soldering Characteristics
In testing, Cree has found XLamp XM-L LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used,
and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP Critical Zone
TL to TP
Ramp-up
TL tS
Temperature
Tsmax
Tsmin
ts Ramp-down
Preheat
25
t 25˚C to Peak
Time
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax) 170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL) 217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classification Temperature (Tp) 235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25 °C to Peak Temperature 4 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
9
Notes
Measurements
The luminous flux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specifications only
and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number
of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated
values are provided for informational purposes only and are not intended or provided as specifications.
Pre‑Release Qualification Testing

Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XM-L LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Ecology section of the Cree website.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
10
Notes - Continued
UL® Recognized Component
This product meets the requirements to be considered a UL Recognized Component with Level 4 enclosure consideration. The LED
package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750.
Vision Advisory
WARNING: Do not look at an exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
11
Mechanical Dimensions
6 5 4 3 2 1
NOTICE REVISONS
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
6 5 4 3 2
REV DESCRIPTION BY DATE
CONTAINED WITHIN ARE THE PROPRIETARY AND NOTICE
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT A NEW RELEASE DC 4/15/10
Thermal vias, if present, are not shown on these drawings.
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION REV
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONTAINED WITHIN ARE THE PROPRIETARY AND
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT INFORMATION OF CREE, INC. THIS PLOT
CONFIDENTIAL B Added die outline DDS 10/22/1
OF CREE INC. A NE
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
All measurements are ±.13 mm unless otherwise indicated.
C ADDED DIMENSION FOR TOP OF FLASH DC 11/18/10
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT B Ad
OF CREE INC. D 3.02 WAS 3.09 DC 1/5/11
C ADDED DIMENSI
E ADDED DOME RADIUS DC 10/23/1
D 3.
F CORRECTED DOME RADIUS DC 11/15/1
D E ADDED
G CHANGED SOLDERPAD AND STENCIL DC 6/16/15
F CORRECTE
D
4.78 G CHANGED SOLD
3.02 3.78 4.78
3.02 2.78 3.78
5.00 .50 2.78
0.73
.50 .50
5.00
0.73
.50
5.00 4.78
5.00
C
R2.26
Top View Side View R2.26 Bottom View
4.78
4.78
.50 .50 .80 .50
.50 .50 .25 .80 .50
.25
.80
B .80
B
4.78 4.78
.25
4.78 4.78
.25
.97
2.78 4.78 .97
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
2.78 4.78
ALL DIMENSIONS ARE ± .13MM UNLES
RECOMMENDED STENCIL PATTERN DRAWN BY DATE
Recommended PCB Solder PadAREA IS OPENING) Recommended Stencil Pattern

UNLESS OTHERWISE SPECIFIED
A (HATCHED D. CRONIN 04/9/10 460
RECOMMENDED STENCIL PATTERN
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH. CHECK DATE DRAWN BY
Du
(HATCHED AREA IS OPENING)
(Shaded Area Is Open)
Pho
RECOMMENDED PCB
A SOLDER PAD TOLERANCE UNLESS SPECIFIED: -- -- DIMENSIONS ARE IN D. CRONIN Fax
.XX ± .25 APPROVED DATE MILLIMETERS AND AFTER FINISH. CHECK
RECOMMENDED PCB SOLDER PAD .XXX ±

X° ±
.125
.5 ° -- --
TITLE
TOLERANCE UNLESS SPECIFIED: --
THIRD ANGLE PROJECTION
FOR SHEET METAL PARTS ONLY MATERIAL OUTLINE DRAWING, 5050
.XX ±
.XXX ±
.25
.125
APPROVED
X° ± .5 ° --
.X ± 1.5
.XX ±
.75 -- SIZE
FOR SHEET METAL PARTS ONLY
DRAWING NO. MATERIAL
.XXX ±
X° ±
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.5 °
FINAL PROTECTIVE FINISH
.XC
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SURFACE FINISH: 1.6 -- SCALE
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16.000± .25 SHE
X° ± .5 °
6 5 4 3 2 1
SURFACE FINISH: 1.6 --
6 5 4 3 2
12
6 5 4 3 2 1
NOTICE REVISIONS
EE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
NTAINED WITHIN ARE THE PROPRIETARY AND REV DESCRIPTION BY DATE APP'D
NFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
Y NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
AUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
CREE INC. POCKET SIZE XLamp ® XM-L™ LED
Ao - 5.40mm [.213"] D
2.00[.079] +.10 +.0039
P2
Do1.50
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1.75[.069]
Ko - 3.35mm [.132"]
4.00[.157]
Po E1
Tape and Reel

3.0° 5.40[.213]
Bo
All Cree carrier tapes conform to EIA-481D,
5.50[.217]F
Automated
6
12.00[.472] Component Handling Systems Standard.
5
6
4
3 5 4
3
2
2
1
1
NOTICE NOMINAL C REVISIONS
REVISIONS
All dimensions in mm.

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
NOTICE
CONTAINED WITHIN ARE THETHIS
CREE CONFIDENTIAL. PROPRIETARY ANDINFORMATION
PLOT AND THE REV DESCRIPTION BY DATE APP'D
DESCRIPTION BY DATE APP'D
CONFIDENTIAL
MAY NOT
INFORMATION
CONTAINED WITHIN AREOF
10.25
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BE COPIED, INFORMATION
REPRODUCEDOF
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CREE, INC. THIS PLOT
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AND
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ANY
REV
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CONFIDENTIAL INC. THIS
UNAUTHORIZED PERSON
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WITHOUT MAX
THE WRITTEN
MAY NOT BE COPIED, REPRODUCED CONSENT
OR DISCLOSED TO ANY
OF CREE INC.
UNAUTHORIZED
OF CREE INC.
PERSON WITHOUT THE WRITTEN CONSENT
E2 W POCKET SIZE
D AoAo
- - 5.40mm [.213"]
5.40mm [.213"] D
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2.00[.079]
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- - 5.40mm [.213"]
5.40mm [.213"]
P2 -.00 -.0000 [ ]
1.50[.059]
1.75[.069]
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- - 3.35mm [.132"]
3.35mm [.132"]
D1 4.00[.157] .36[.014]
8.00[.315] 4.00[.157] E1 1.75[.069]
Po T
P Po E1
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B 3.0° 5.40[.213]
Bo
Bo
7.0° 12.00[.472]
6 5 4 3 5.50[.217]F 2 12.00[.472]
NOMINAL 1
C 5.50[.217]F C
NOTICE C NOMINAL
REVISONS C
NTIAL. THIS PLOT AND THE INFORMATION
THIN ARE THE PROPRIETARY AND
REV
10.25 12.30DESCRIPTION
[.484] BY DATE APP'D
3.35[.132] 12.30 [.484]
INFORMATION OF CREE, INC. THIS PLOT A [.404]10.25 MAX
Loaded pocket count was 750 DDS 11/8/10 BS
OPIED, REPRODUCED OR DISCLOSED TO ANY Ko [.404] MAX
WANODE
B E2
MADE CATHODE AND DC
W NOTE LARGER 2/26/12
D PERSON WITHOUTTHE WRITTEN CONSENT
E2
CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
5.40[.213]
Ao UNLESS OTHERWISE SPECIFIED
DRAWN BY DATE
D. CRONIN 4/23/10 4600 Silicon Drive

DIMENSIONS ARE IN INCHES Durham, N.C 27703
AND AFTER FINISH. CHECK DATE
1.50[.059]
Phone (919) 313-5300
TOLERANCE UNLESS SPECIFIED:
8.00[.315] D1 1.50[.059]
Fax (919) 313-5558 .36[.014] D
.XX ± .01 APPROVED DATE
8.00[.315] D1 T .36[.014]
.XXX ± .005 P TITLE
X° ± .5 ° P A T
MATERIAL XM 5050 CARRIER TAPE
.X ± .06 DRAWING NO. REV.
SIZE
.XX ± .03
B
B
.XXX ±
X° ±
.010
.5 °
A 2402-00011 A B
B
SCALE 7.0° SHEET OF
SURFACE FINISH: User Feed Direction
63
DRAWING SCALE 7.0° 1 /1
6 5 4 3 2 1
4
8 1.75 3.35
END CATHODE SIDE START 3.35[.132]
6 5 4 3.35[.132]
3
Ko 2 1
NOTICE Ko 2400-00009
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
CONTANED WITHIN ARE THE PROPRIETARY AND
5.40[.213] CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275
INDEX QTY ITEM COMMENTS
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY 5.40[.213]
Ao 12 1 1
DRAWN BY
2400-00009-CORE
DATE C
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT Ao UNLESS ARE
DIMENSIONS OTHERWISE
IN INCHES
2 D. CRONIN
SPECIFIED 2DRAWN BY2400-00009-REEL
4/23/10
DATE 4600 Silicon Drive
OF CREE INC. D. CRONIN 4/23/10 Durham,
4600 N.C 27703
Silicon Drive
DIMENSIONS
AND AFTER FINISH. ARE IN INCHESCHECK DATE
Durham,
Phone (919) N.C 27703
313-5300
TOLERANCE AND AFTERSPECIFIED:
UNLESS FINISH. CHECK DATE
Phone
Fax (919) (919) 313-5300
313-5558
TOLERANCE
.XX ± UNLESS .01 SPECIFIED: Fax (919) 313-5558
ANODE SIDE
APPROVED DATE
.XXX ± .XX ±
.005 .01 APPROVED DATE
TITLE
A X° ±.XXX .5± ° .005 A

XMXM
5050 CARRIER TAPE
TITLE
A THIRD ANGLE PROJECTION X° PARTS

± .5 ° A
5050 CARRIER TAPE
MATERIAL
D Trailer Loaded Pockets Leader THIRD ANGLE PROJECTIONFOR SHEET METAL ONLY MATERIAL
FOR.XSHEET
± METAL .06 PARTS ONLY
160mm (min) of (1000 Lamps) 400mm (min.) of .XX .X ± ±.03 .06 SIZE DRAWING NO. REV.
D
empty pockets empty pockets with
at least 100mm
.XXX .XX
X°
± ±
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±.XXX .5± ° .010
SIZE DRAWING NO.
A 2402-00011
A 2402-00011 A
REV.
A
sealed with tape X° ± .5 ° SCALE SHEET OF
(15 pockets min.) sealed by tape SURFACE FINISH: 63

SURFACE FINISH: 63
DRAWING SCALE
SCALE SHEET 1OF / 1
6 (405 empty pockets min.) 4 3 DRAWING SCALE 2 1 1 /1
6 5 4 3 2 1
12.4
+.2 C
.0
C MEASURED AT HUB
330
+.25 16.4
-.75 +0.2
1.9±.4
.0
MEASURED AT HUB
DRAWN BY DATE
DIMENSIONS ARE IN D. CRONIN 06/08/10 4600 Silicon Drive 21 ±.4
Durham, N.C 27703
MILLIMETERS AND AFTER FINISH. CHECK DATE
Phone (919) 313-5300
TOLERANCE UNLESS SPECIFIED: -- -- Fax (919) 313-5558
.XX ± .25 APPROVED DATE A
.XXX ± .125 TITLE

X° ± .5 ° -- --
13.1 ±.2 XM LOADING SPEC
MATERIAL
.X ± 1.5
.XX ± .75 -- SIZE DRAWING NO. REV.
.XXX ±
X° ±
.25
.5 °
C 2402-00012 B B
SURFACE FINISH: 1.6 -- SCALE
3.000
SHEET OF
1 /1
6 B 5 4 3 2 1
12.4
+1.0
-.5
MEASURED AT EDGE
60° 60°
REVISONS
REV DESCRIPTION BY DATE APP'D
trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. UNLESS OTHERWISE SPECIFIED
DRAWN BY DATE
D. CRONIN 09/29/09 4600 Silicon Drive

A DIMENSIONS ARE IN INCHES Durham, N.C 27703
AND AFTER FINISH. CHECK DATE
13
Phone (919) 313-5300
TOLERANCE UNLESS SPECIFIED: -- -- Fax (919) 313-5558
.XX ± .01 APPROVED DATE A
.XXX ± .005 TITLE
X° ± .5 ° -- --
FOR SHEET METAL PARTS ONLY MATERIAL REEL, 13" X 12MM, 3 PIECE SNAP
Packaging Humidity Indicator Dessicant

Card (inside bag) (inside bag)
Unpackaged Reel
Label with Cree Bin Code,

Quantity, Reel ID
Label with Cree Bin Vacuum-Sealed
Packaged Reel
Code, Qty, Lot # Moisture Barrier Bag
Label with Cree Order Code,

Quantity, Reel ID, PO #

Quantity, Reel ID
Label with Custo

Boxed Reel Code, Qty, Reel I
Label with Cree Order Code, Patent Label

Quantity, Reel ID, PO #

Quantity, Reel ID
Patent Label
14

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CLD-DS33 Rev 11I

Product family data sheet

Cree® XLamp® XM-L™ LEDs

Product Description FEATURES Table of Contents

Characteristics Unit Minimum Typical Maximum

Thermal resistance, junction to solder point °C/W 2.5

Viewing angle (FWHM) degrees 125

Temperature coefficient of voltage mV/°C -2.1

ESD withstand voltage (HBM per Mil-Std-883D) V 8000

DC forward current mA 3000

Forward voltage (@ 700 mA) V 2.9 3.5

Forward voltage (@ 1500 mA) V 3.1

Forward voltage (@ 3000 mA) V 3.35

LED junction temperature °C 150

Flux Characteristics (TJ = 25 °C)

Minimum Luminous Flux @ Calculated Minimum

T5 260 360 511 643 XMLAWT-00-0000-0000T5051

Cool White 5000 K 8300 K T6 280 388 551 692 XMLAWT-00-0000-0000T6051

U2 300 416 590 742 XMLAWT-00-0000-0000U2051

T4 240 332 472 593 XMLAWT-00-0000-000LT40E4

T2 200 277 393 494 XMLAWT-00-0000-000HT20E7

T2 200 277 393 494 XMLAWT-00-0000-000LT20E7

S4 164 227 323 406 XMLAWT-00-0000-000PS40E7

85-CRI White 2600 K 3200 K S5 172 238 338 425 XMLAWT-00-0000-000PS50E7

S6 182 252 358 450 XMLAWT-00-0000-000PS60E7

S4 164 227 323 406 XMLAWT-00-0000-000US40E7

90-CRI White 2600 K 3200 K S5 172 238 338 425 XMLAWT-00-0000-000US50E7

S6 182 252 358 450 XMLAWT-00-0000-000US60E7

Relative Spectral Power Distribution

40 2600 K - 3700 K CCT

Relative Flux vs. Junction Temperature (IF = 700 mA)

Junction Temperature (ºC)

Relative Intensity vs. Current (Tj = 25ºC)

Relative Chromaticity vs. Current (Cool White)

Relative Chromaticity vs. Temperature (Cool White)

Relative Chromaticity vs. Current (Warm White)

Warm White vs. Temperature (Warm White)

Typical Spatial Distribution

1000 Rj-a = 4 °C/W

Ambient Temperature (ºC)

Reflow Soldering Characteristics

Profile Feature Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax) 170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL) 217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classification Temperature (Tp) 235 - 245 °C

Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 - 6 °C/second

Time 25 °C to Peak Temperature 4 minutes max.

Pre‑Release Qualification Testing

Recommended PCB Solder PadAREA IS OPENING) Recommended Stencil Pattern

RECOMMENDED PCB SOLDER PAD .XXX ±

Tape and Reel

All dimensions in mm.

D. CRONIN 4/23/10 4600 Silicon Drive

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

A X° ±.XXX .5± ° .005 A

A THIRD ANGLE PROJECTION X° PARTS

(15 pockets min.) sealed by tape SURFACE FINISH: 63

THIRD ANGLE PROJECTION