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Abstract
In this study, the crack growth behaviour of an aluminium plate
cracked at the tip and repaired with a bonded boron/epoxy
composite patch in the case of full-width disbond was
investigated. This effect is the imperfection which could result
during the bonded patch of the repaired structure. Disbonds of
various sizes and situated at different positions with respect to
the crack tip as well as the effect of adhesive and patch thickness
on repair performance were examined. An analysis procedure
involving the efficient finite element modelling applied to
cracked plate, adhesive and composite patch was used to
compute the stress intensity factors. The crack growth rate is
dominated by the stress intensity factor near the location and
size of the pre-existing disbonds. The cracked plate and disbond
propagation result in an increase in the patch deformation. The
patch does not have an influence on the crack growth when the
ratio 2a/dR exceeds 0.8.
Keywords
B. Adhesion;
B. Fracture;
B. Stress concentration;
Disbonding composite patch
Nomenclature
a
crack length
σ
applied stress
τ
the shear stresses in adhesive
Ga
adhesive shear modulus
ρR
radius of boron/epoxy composite patch
dR
diameter patch
e
R
adhesive thickness
height of disbond
2. Geometrical model
Fig. 1 shows an edge cracked aluminium plate, which is
adhesively bonded with a boron/epoxy composite patch. The
thin rectangular aluminium plate has the following dimensions:
200 × 100 × 2 mm3. The length of the crack is a and the cracks
are assumed to occur in the x-direction, i.e., only mode I crack is
considered. The plate with a crack is subjected to a remote
uniaxial tensile load of σ = 120 MPa The mechanical and
geometrical characteristics of the plate and the patch are noted
respectively by subscripts p and R (Fig. 1).
Fig. 1. Geometrical model and mesh of the structure (plate and patch),
(a) edge crack, (b) bonded patch on the crack and (c) cracked plate.
–
The layers may be assembled with an adhesive layer.
–
The adhesive layer is homogeneous, linear, elastic and
isotropic.
–
The adhesive works only in shear and the deformation is
uniform throughout the adhesive thickness.
The shear stresses in the adhesive are given by the relation [6]:
(1)
3.1. Validation
Krep and Knrep are SIF for repaired crack and non repaired crack,
respectively.
9. Disbond effect
The SIF for the patched crack exhibits an asymptotic behaviour
as the crack length increases. This asymptotic value is
approximated by the following formula [20]:
(6)
Kd and K are stress intensity factors for a repaired crack with and
without presence of the disbond, respectively. To show the
influence of disbond on the amplification of the stress at the
level of the crack tip, we plotted the variation of the reduction of
the SIF as a function of the adhesive film thickness (ea) for
various heights of disbond. The diameter of the patch is equal to
four times the length of the repaired crack. From Fig. 9, it can be
observed that a reduction of the adhesive thickness increases
the value of the reduction rate , which means that a small
adhesive thickness is recommended for repaired cracks. The
curves show two distinct regions. In the first part, the factor
decreases quickly towards the adhesive thickness,
approximately ea = 2 mm. This part can be described by the
relation where α and β are coefficients. In the second
part of the curve ea > 2 mm, varies linearly versus adhesive
thickness. The reduction is amplified by increasing disbond
height Hd. In this case; it appears clearly that the disbond
involves an amplification of the SIF and consequently the
increase in the crack growth rate.
Fig. 10. Variation of the reduction of the SIF vs. the patch thickness.
10. Conclusions
A finite element analysis is proposed to investigate the stress
intensity factor (SIF) of cracked aluminium plate patched with a
boron/epoxy composite patch in the presence of FW disbond.
The following conclusions can be drawn from the present study:
•
The reduction of the SIF of the boron/epoxy patch of 0°
fibre in the y-direction compared to a 0° fibre in the x-
direction is on the order of 50%.
•
The stress concentration factor increases indefinitely with
the increase in the repaired edge crack with only one
boron/epoxy patch; for the double patch the stabilization
of the factor Kt appears from the ratioa/ρR = 0.3.
•
The gain in thickness decreases with patch thickness
increase and it decreases with crack length decrease. When
the patch thickness is twice as large as that of the plate, the
gain is about 20%.
•
The reduction of the SIF takes importance when the
adhesive thickness tends to a zero value. There should be
an optimum value. An inverse behaviour occurs for large
patch thicknesses, which in this case decrease the negative
disbond effect.
•
The reduction of the SIF increases with patch thickness for
disbond width higher than crack size. An inverse behaviour
occurs when the crack length exceeds the width of FW
disbond.
•
For a width of FW disbond higher than crack length Hd ⩾ a,
the reduction of the patch exceeds 50% when the patch
thickness is higher than 1 mm.
•
The patch has no influence on the crack propagation when
the ratio 2a/dR exceeds 0.8.
Acknowledgements
The supports are gratefully acknowledged and special thanks are
to the Pr. M.S.E. Seddiki, Rector of Mostaganem University. The
Authors extend their appreciation to the Deanship of Scientific
Research at King Saud University for funding the work through
the research group N° RGP-VPP-035.
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