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LM2903-Q1
SLCS141G – MAY 2003 – REVISED NOVEMBER 2018
Simplified Schematic
IN+
OUT
IN−
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2903-Q1
SLCS141G – MAY 2003 – REVISED NOVEMBER 2018 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................... 7
2 Applications ........................................................... 1 7.4 Device Functional Modes.......................................... 7
3 Description ............................................................. 1 8 Application and Implementation .......................... 8
4 Revision History..................................................... 2 8.1 Application Information.............................................. 8
8.2 Typical Application ................................................... 8
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3 9 Power Supply Recommendations...................... 10
6.1 Absolute Maximum Ratings ...................................... 3 10 Layout................................................................... 10
6.2 Handling Ratings....................................................... 4 10.1 Layout Guidelines ................................................. 10
6.3 Recommended Operating Conditions, LM2903-Q1.. 4 10.2 Layout Example .................................................... 10
6.4 Recommended Operating Conditions, LM2903E- 11 Device and Documentation Support ................. 11
Q1 .............................................................................. 4 11.1 Related Links ........................................................ 11
6.5 Thermal Information .................................................. 4 11.2 Receiving Notification of Documentation Updates 11
6.6 Electrical Characteristics........................................... 5 11.3 Community Resources.......................................... 11
6.7 Switching Characteristics .......................................... 5 11.4 Trademarks ........................................................... 11
6.8 Typical Characteristics .............................................. 6 11.5 Electrostatic Discharge Caution ............................ 11
7 Detailed Description .............................................. 7 11.6 Glossary ................................................................ 11
7.1 Overview ................................................................... 7 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ......................................... 7 Information ........................................................... 11
4 Revision History
Changes from Revision F (May 2018) to Revision G Page
D, DGK OR PW PACKAGE
Top View
1OUT 1 8 VCC
1IN− 2 7 2OUT
1IN+ 3 6 2IN−
GND 4 5 2IN+
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
1OUT 1 Output Comparator 1's output pin
1IN- 2 Input Comparator 1's negative input pin
1IN+ 3 Input Comparator 1's positive input pin
GND 4 Input Ground
2IN+ 5 Input Comparator 2's positive input pin
2IN- 6 Input Comparator 2's negative input pin
2OUT 7 Output Comparator 2's output pin
VCC 8 Input Supply Pin
6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
(2)
VCC Supply voltage 36 V
VCC Supply voltage, LM2903E-Q1 Only (2) 32 V
VID Differential input voltage (3) –36 36 V
VI Input voltage range (either input) −0.3 36 V
VO Output voltage 36 V
IO Output current 20 mA
Duration of output short-circuit to ground Unlimited
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
(3) Differential voltages are at IN+ with respect to IN−.
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
(1) Full range (MIN or MAX) for LM2903-Q1 is −40°C to 125°C and −40°C to 150°C for the LM2903E-Q1 . All characteristics are measured
with zero common-mode input voltage, unless otherwise specified.
(2) VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the VCC level; the
comparator provides a proper output state. Either or both inputs can go to 30 V (32V for V-suffix devices) without damage.
1 1
-40C -40C
0C 25C
25C
0.8 85C 0.8 125C
125C 150C
Supply Current (mA)
0.4 0.4
0.2 0.2
0 0
0 10 20 30 40 0 10 20 30 40
VCC (V) VCC (V)
Figure 1. Supply Current vs. Supply Voltage Figure 2. Supply Current vs. Supply Voltage
LM2903E-Q1 Only
70 70
-40C -40C
0C 25C
60 25C 60 85C
85C 125C
125C
50 50
40 40
30 30
20 20
10 10
0 0
0 10 20 30 40 0 10 20 30 40
VCC (V) lm29
VCC (V)
Figure 3. Input Bias Current vs. Supply Voltage Figure 4. Input Bias Current vs. Supply Voltage
LM2903E-Q1 Only
10 10
125C 150C
85C 125C
25C 25C
Output Low Voltage, VOL (V)
Output Low Voltage, VOL(V)
0C -40C
1 -40C 1
0.1 0.1
0.01 0.01
0.001 0.001
0.01 0.1 1 10 100 0.01 0.1 1 10 100
Ouptut Sink Current, IO(mA) Output Sinking Current , IO(mA)
Figure 5. Output Low Voltage vs. Output Current Figure 6. Output Low Voltage vs. Output Current
LM2903E-Q1 Only
7 Detailed Description
7.1 Overview
The LM2903-Q1 family is a dual comparator with the ability to operate up to 36 V on the supply pin. This
standard device has proven ubiquity and versatility across a wide range of applications. This is due to it's very
wide supply voltages range (2 V to 36 V), low Iq and fast response.
This device is AEC-Q100 qualified and can operate over a wide temperature range of –40°C to 125°C (LM2903-
Q1) or –40°C to 150°C (LM2903E-Q1).
The open-drain output allows the user to configure the output's logic low voltage (VOL) and can be utilized to
enable the comparator to be used in AND functionality.
VCC
80-µA
Current Regulator
10 µA 60 µA 10 µA 80 µA
COMPONENT COUNT
Epi-FET 1
Diodes 2
IN+ Resistors 2
OUT Transistors 30
IN−
GND
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
6 6
5 5
Output Voltage, Vo(V)
4 4
3 3
2 5mV OD 2
5mV OD
1 20mV OD 1
20mV OD
0 0
100mV OD 100mV OD
±1 ±1
-0.25 0.25 0.75 1.25 1.75 2.25 ±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec) C004 Time (usec) C006
Figure 9. Response Time for Various Overdrives Figure 10. Response Time for Various Overdrives
(Positive Transition) (Negative Transition)
10 Layout
Bypass
Capacitor
0.1PF
1OUT 1 8 VCC Positive Supply
1INí 2 7 2OUT
1IN+ 3 6 2INí
Negative Supply or Ground GND 4 5 2IN+
Only needed
for dual power
0.1PF
supplies
Ground
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 27-Nov-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2903AVQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
& no Sb/Br)
LM2903AVQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
& no Sb/Br)
LM2903AVQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
& no Sb/Br)
LM2903AVQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903AVQ
& no Sb/Br)
LM2903EPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 150 2903Q0
& no Sb/Br)
LM2903QDGKRQ1 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 KACQ
& no Sb/Br)
LM2903QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
& no Sb/Br)
LM2903QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
& no Sb/Br)
LM2903QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
& no Sb/Br)
LM2903QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903Q1
& no Sb/Br)
LM2903VQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1
& no Sb/Br)
LM2903VQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ1
& no Sb/Br)
LM2903VQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ
& no Sb/Br)
LM2903VQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2903VQ
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 27-Nov-2018
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Catalog: LM2903
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Nov-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Nov-2018
Pack Materials-Page 2
PACKAGE OUTLINE
PW0008A SCALE 2.800
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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