#HPEDiscover

HPE Discover 2018

How Samsung, HPE and AMD are maximizing the
efficiency of HPE data center servers
Tom Koenig, Sr. Director, Customer Marketing DRAM @ Samsung
Adrian Salinas, Manager of Server Options @ HPE
Dilip Ramachandran, Director, Product Marketing @ AMD

CONFIDENTIAL
Please give me your feedback
Session ID: B6278 Speaker: Tom Koenig
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 Legal Disclaimer
This presentation is intended to provide information concerning SSD and memory industry. We do our best
to make sure that information presented is accurate and fully up-to-date. However, the presentation may be
subject to technical inaccuracies, information that is not up-to-date or typographical errors. As a consequence,
Samsung does not in any way guarantee the accuracy or completeness of information provided on this
presentation.

The information in this presentation or accompanying oral statements may include forward-looking
statements. These forward-looking statements include all matters that are not historical facts, statements
regarding the Samsung Electronics' intentions, beliefs or current expectations concerning, among other things,
market prospects, growth, strategies, and the industry in which Samsung operates. By their nature, forward-
looking statements involve risks and uncertainties, because they relate to events and depend on
circumstances that may or may not occur in the future. Samsung cautions you that forward looking statements
are not guarantees of future performance and that the actual developments of Samsung, the market, or
industry in which Samsung operates may differ materially from those made or suggested by the forward-
looking statements contained in this presentation or in the accompanying oral statements. In addition, even if
the information contained herein or the oral statements are shown to be accurate, those developments may
not be indicative developments in future periods.
Applications Drive Changes in Architectures
3

FPGA’s
GPU/TPU
x86 Apps Non-x86
processors
Processors Processors & platforms

CPU-centric Data-centric
NOW
4th Wave
3rd Wave AI
2nd Wave Mobile
1st Wave Internet
PC Era
MS-DOS
MS DOS...
Data Created Per Day
4

90 MB
30 MB
Smart Phone PC Autonomous Car Connected Plane
Data Created Per Day
5

50 TB

Content from new devices growing exponentially

4 TB

90 MB
30 MB
Smart Phone PC Autonomous Car Connected Plane
Hardware-centric Era → Data-centric Era
6

Memory demand constrained by units, whereas data has infinite growth

Hardware-centric “Physical” Era Data-centric “Non-Physical” Era

Devices → Exponential Data Growth

160
140
>160ZB by 2025
120
100
Technology 80
IoT
Adoption Curve 60
40
20
More connected devices
0
2005 2010 2015 2020 2025
Processing Data for the New Era
Artificial Intelligence  Mainstream Real Time Analytics Driving Memory Capacity
A/I Enabled Servers
Market Forecast
In-Memory On-Prem
For SAP Databases Database
General Cloud
>30%
>20%
17%
8% 10% A/I
‘17 ‘18 ‘19 ‘20 ‘21
Source: Samsung estimates Source: Goldman Sachs
Speech Deep Learning

Facial Recognition Autonomous Driving

HPE Scale-up Systems with up to 16TB Memory

Power Costs in the Data Center
Server power consumption impacting overall data center operation costs

Datacenter Operation Costs Power Usage Profile

Networking, 8% Power Distribution Distribution, 8%

& Cooling, 18% Networking, 7%

Storage, 12% Servers, 40%

Power, 13%

Servers, 57%
Other Infrastructure, 4%

Cooling, 33%

Source: Data from https://perspectives.mvdirona.com/2010/09/overall-data-center-costs/

DRAM Technology Trend
Samsung advanced process allows for Low Power, High Performance and High
Density memories
256Mb 512Mb 1Gb 4Gb 8Gb 16Gb Speed
Industry’s First 16Gb
100nm DIMM Component
90nm

80nm 3200Mbps

60nm

50nm
40nm 2133Mbps
30nm
20nm
667Mbps 1066Mbps
10nm class
400Mbps

Scaling
64GB (16Gb) RDIMM Benefits
10nm Class DRAM Improving TCO with Better Performance & Power

Power Performance Bandwidth/Power

Up to 19% Power Savings Up to 12% Better Performance Up to 37% Better Efficiency

32GB (8Gb4) 64GB (16Gb) 32GB (8Gb) 64GB (16Gb) 32GB (8Gb) 64GB (16Gb)
2DPC 2133Mbps 1DPC 2400Mbps 2DPC 2133Mbps 1DPC 2400Mbps 2DPC 2133Mbps 1DPC 2400Mbps

System Information: CPU: AMD EPYC 7601 32 Cores 2.2GHz, Memory: 8 CH

16Gb Based DRAM DIMM Solutions
64GB Solutions 128GB Solutions 256GB Solutions
 64GB RDIMM  128GB 2H 3DS RDIMM  256GB 4H 3DS RDIMM
 64GB DDP LRDIMM  128GB DDP LRDIMM  256GB 4H 3DS LRDIMM

DL325/385 Gen 10 Next Gen AMD Platform Future Platform

Up to 2TB Memory Up to 4TB Memory Up to 8TB Memory

Available Now Coming Soon Coming Soon

Note: 2P System
Server DRAM DIMM Portfolio
RDIMM LRDIMM System Memory (2P)
8GB 1Rx8 (8Gb) Up to 256GB Memory

16GB
1Rx4 (8Gb)
2Rx8 (8Gb)
Up to 512GB Memory

32GB 2Rx4 (8Gb) Up to 1TB Memory

64GB
2Rx4 (16Gb)
4Rx4 (8Gb)
4Rx4 (8Gb) Up to 2TB Memory

128GB
4Rx4 (16Gb)*
8Rx4 (8Gb)
4Rx4 (16Gb)*
8Rx4 (8Gb)
Up to 4TB Memory

256GB 8Rx4 (16Gb)* 8Rx4 (16Gb)* Up to 8TB Memory

* Coming Soon Qualified on HPE DL385
What’s new for Enterprise Servers?
Industry Leading Technology
HPE Server Options
HPE SmartMemory
Performance for faster
business decisions − HPE server memory combines
performance, reliability and efficiency
to provide the compatibility, capacity
and bandwidth to productively
manage your expanding workload
Reliable for less downtime regardless of computing and budget
requirements.
− Ideal for Enterprise, HPC and SMB
computing environments, with
capacities from 8GB to 128GB.
Efficient for lower TCO
HPE SSD Drives
− HPE Solid-State Drives (SSDs) offer
enterprise customers high
performance with consistently low
latency for faster business outcomes.
− Digitally Signed Firmware provides
security protection and secure
authentication of the firmware image.
Gives customer assurance that
firmware deployment comes from a
trusted source and will not harm data.
Key Benefits of the HPE – Samsung Partnership
High quality SSD and Memory for HPE Enterprise Platforms
Optimizing SSD TCO Newest
generation 72-layer 3D NAND provides
SSD performance with improved value
Mainstream Capacities Ranging
from 480GB to 3.84TB delivers the
capacities that customers are deploying
Time to Market Leading the market
with the first 72-layer 3D NAND SSD while
delivering on the promises of quality,
performance, reliability, and value
The world’s-best selling compute partnered with one of the industry’s
leading memory manufacturers
High Density Modules migration to Power Efficiency 16Gb components Full portfolio of server memory
16Gb enables production of even higher offer the lowest power consuming 64GB products supporting both RDIMM and
capacity memory DIMMs, up to 256GB! memory DIMM in the market LRDIMM
DRAM Market Leader with 45%
market share
HPE HPE HPE HPE Hyper
HPE Apollo
ProLiant Synergy BladeSystem Converged
• Dynamic Workloads Advanced Process 10nm class DDR4
is optimized for current and future IT
• Virtualization, Big data, Storage centric Apps, Collaboration, Data needs
Warehousing/Analytics, CRM, ERP, VDI, SAP
• Composable Infrastructure
Extending the world’s most secure industry standard server1 portfolio…
…back by popular demand the world’s best selling AMD server2, the HPE ProLiant
DL385, as well as the new HPE ProLiant DL325 server.

A new formula for server virtualization

HPE ProLiant DL385 Gen10 Server

Flexibility, performance and security with a better balance of resources to power the
datacenter
AMD EPYC™ Processor

World’s first 16Gbit 64GB DDR4 RDIMM, whose benefits include higher performance
and lower power consumption3 versus 64GB server LRDIMMs.
Samsung 64GB RDIMM

1 Based on external firm conducting cyber security penetration testing of a range of server products from a range of manufacturers, May 2017
2 IDC WW Quarterly Server Tracker 2017 Q2 Historical Release, September 12, 2017; Based on Units
3 Up to 46% improvement in Read/Write performance in comparison to 64GB 4Rx4 LRDIMM. Up to 54% decreased power consumption (versus 64GB 4Rx4 LRDIMM); savings of up to ~115 W of system memory power.
This is EPYC

THIS ISIS
POWER OPTIMIZE SECURE
Industry-Leading Core Count1 Industry’s First No-Compromise 1-Socket Secure Root of Trust

Industry-Leading Memory Capacity2 Unrestrained Product Stack Real-time Memory Encryption

Industry-Leading Memory Bandwidth3 Balanced System Design VM Encryption and Isolation

Industry-Leading I/O Capacity4

1 AMD EPYC 7601 processor includes up to 32 CPU cores versus the Xeon Platinum 8180 processor with 28 CPU cores
2A single AMD EPYC™ 7601 processor offers up to 2TB/processor (x 2 = 4TB), versus a single Xeon Platinum 8180 processor at 768Gb/processor (x 2 = 1.54TB)
3 AMD EPYC™ 7601 processor offers up to 33% greater memory bandwidth than the Intel Xeon Platinum 8180. AMD EPYC™ 7601 processor supports up to 8 channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667
4 AMD EPYC™ processor supports up to 128 PCIe® Gen 3 I/O lanes (in both 1 and 2-socket configuration), versus the Intel® Xeon® SP Series processor supporting a maximum of 48 lanes PCIe® Gen 3 per CPU, plus 20 lanes in the chipset

(max of 68 lanes on 1 socket and 116 lanes on 2 socket)

A new standard for scale and economics

1 AMD EPYC 7601 processor includes up to 32 CPU cores versus the Xeon Platinum 8180 processor with 28 CPU cores
2A single AMD EPYC™ 7601 processor offers up to 2TB/processor (x 2 = 4TB), versus a single Xeon Platinum 8180 processor at 768Gb/processor (x 2 = 1.54TB)
3 AMD EPYC™ 7601 processor offers up to 33% greater memory bandwidth than the Intel Xeon Platinum 8180. AMD EPYC™ 7601 processor supports up to 8 channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667
4 AMD EPYC™ processor supports up to 128 PCIe® Gen 3 I/O lanes (in both 1 and 2-socket configuration), versus the Intel® Xeon® SP Series processor supporting a maximum of 48 lanes PCIe® Gen 3 per CPU, plus 20 lanes in the chipset

(max of 68 lanes on 1 socket and 116 lanes on 2 socket)

The power of simplicity
Feature consistency and simplified product stack
EPYC - DESIGNED FOR SOFTWARE-DEFINED DATACENTER

DATA MACHINE SW-DEFINED

HPC CLOUD ANALYTICS LEARNING STORAGE
• CPU optimized for GPU • Higher core count to meet • High parallelism for • Highly parallelized CPU • Direct SATA & NVMe
acceleration SLAs complex analysis optimized for GPU Support
• Massive I/O for cluster • Large memory capacity for • Massive I/O bandwidth for acceleration • High parallelism for low
connectivity more VMs faster data loading • High parallelism for real latency More memory for
• Memory capacity for large • HW encrypted multi- • High integer and floating time data streams larger cache
datasets tenant security point capacity • High core count for • Memory encryption for
• Massive I/O bandwidth for • Massive I/O for scale-out • Security for business inference data security
NVMe drives environments critical data • Massive I/O bandwidth
for NVMe drives
Samsung @ the Heart of Your Data Center
DIMM MODULE
HIGH BANDWIDTH MEMORY
(RDIMM, LRDIMM)

ENTERPRISE SSD GRAPHICS MEMORY

Get more information

Visit Samsung’s Booth, #170 Visit these demos Follow us on Social Media

– Speaking sessions @ AMD’s Booth – DL385 DRAM Performance Demo – Twitter: @SamsungSemiUS
16Gb based RDIMM vs 8Gb based RDIMM – Facebook: SamsungSemiUS
– SSD Portfolio and Server Solution – Linkedin: Samsung Semiconductor, Inc.
Demos

Thank you for attending

Please give me your feedback
Session ID: B6278 Speaker: Tom Koenig
Use the mobile app to complete a session survey
– Access the app’s “My schedule” or “Session Schedule” and find the session
– Tap on the session title which presents the session detail page
– On session detail page, tap “Feedback” tab and enter your survey inputs
– Scroll down to bottom of “Feedback” tab and tap “Submit Feedback”

If you don’t have it, download the Discover event app by searching for: “HPE Discover 2018” (iOS & Android)

To access the survey online, go to the Agenda Builder in the event content catalog and click on your session

Thank you for providing your feedback, which helps us enhance content for future events.
Thank you!
Tom Koenig, t.koenig@samsung.com

CONFIDENTIAL