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Crystal Surround Air

Track (Active Speaker


System)
Model Name HW-F450
Model Code HW-F450/ZC

SERVICE MANUAL
Crystal Surround Air Track Contents
(Active Speaker System)
1. Precaution

2. Product Specification

3. Disassembly & Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram

HW-F450

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.3. Specifications Analysis ............................................................................................................. 2 − 3
2.4. Accessories ............................................................................................................................ 2 − 5
2.4.1. Supplied Accessories ................................................................................................... 2 − 5
3. Disassembly & Reassembly ................................................................................................................ 3 − 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 − 1
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 1
4.1.2. No Sound output (Digital) ............................................................................................. 4 − 2
4.1.3. No Sound output (Analog) ............................................................................................ 4 − 6
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 9
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 − 9
4.2.2. Power Protection ......................................................................................................... 4 − 9
4.2.3. AMP Pre-Inspection relating to Power Protection .............................................................. 4 − 10
4.3. Initialization & Update ............................................................................................................. 4 − 11
4.3.1. How to check the Firmware version ................................................................................ 4 − 11
4.3.2. How to initialize.......................................................................................................... 4 − 11
4.3.3. USB Update procedure ................................................................................................. 4 − 12
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. MAIN PCB Top ...................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.2.2. Test Point Wave Form .................................................................................................. 5 − 4
5.3. MAIN PCB Bottom.................................................................................................................. 5 − 5
5.3.1. Pin Connection ........................................................................................................... 5 − 6
5.3.2. Test Point Wave Form .................................................................................................. 5 − 7
5.4. HDMI PCB Top ...................................................................................................................... 5 − 8
5.4.1. Test Point Wave Form .................................................................................................. 5 − 9
5.5. HDMI PCB Bottom.................................................................................................................. 5 − 10
5.5.1. Pin Connection ........................................................................................................... 5 − 11
5.6. VFD PCB Top......................................................................................................................... 5 − 12

i Copyright© 1995-2012 SAMSUNG. All rights reserved.


Contents

5.7. VFD PCB Bottom.................................................................................................................... 5 − 13


5.7.1. Pin Connection ........................................................................................................... 5 − 14
5.8. USB PCB Top......................................................................................................................... 5 − 15
5.9. USB PCB Bottom .................................................................................................................... 5 − 16
5.9.1. Pin Connection ........................................................................................................... 5 − 17
5.10. SMPS PCB Top....................................................................................................................... 5 − 18
5.11. SMPS PCB Bottom .................................................................................................................. 5 − 19
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 2
6.2. MAIN-1................................................................................................................................. 6 − 3
6.3. MAIN-2................................................................................................................................. 6 − 4
6.4. MAIN-3................................................................................................................................. 6 − 5
6.4.1. Test Point Wave Form .................................................................................................. 6 − 6
6.5. MAIN-4................................................................................................................................. 6 − 7
6.5.1. Test Point Wave Form .................................................................................................. 6 − 8
6.6. HDMI ................................................................................................................................... 6 − 9
6.6.1. Test Point Wave Form .................................................................................................. 6 − 10
6.7. VFD...................................................................................................................................... 6 − 11
6.8. USB ...................................................................................................................................... 6 − 12
6.9. SMPS .................................................................................................................................... 6 − 13

Copyright© 1995-2012 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning : Never alter or add to the mechanical or electrical design of the unit.
Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any
design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test :

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies
with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters
Laboratories (UL Publication UL1410, 59.7).

With the unit completely reassembled, plug the AC cord directly into a 120 V AC outlet. With the unit’s power switched
from the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - Screwheads, Metal Cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2012 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check :


(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON.
(3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example : Screwheads, Metal Cabinets, Antenna Port, etc. If any of the exposed metallic parts has a return path to
the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite”. If the resistance is outside these limits, a shock hazard might exist.
See Figure 1.2 Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas :
Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched,
out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the
AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice :


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original–even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or .
Use replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might create
shock, fire or other hazards.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 1-4


2. Product Specification

2. Product Specification

2.1. Product Feature

■ HW-F450
• 280 W (80 W x 2 + 120 W)
• 2.1CH, Wireless Subwoofer (active)
- Dolby Digital, DTS 2.0
- 1 Analog / 1 Optical
- HDMI OUT 1 / HDMI IN 1
- Smart Volume II
- Virtual Surround (Music / News / Movie / Drama / Game / Sports / Pass)
- 3D SOUND
- 2way 3spk
- BLUETOOTH
- USB HOST
- SoundShare
- One Control

2-1 Copyright© 1995-2012 SAMSUNG. All rights reserved.


2. Product Specification

2.2. Specifications

■ Basic Specification
Power supply 120 V, 60 Hz / 220 V, 50 Hz

Standby power consumption 0.45 W

Power Main unit 25.9 W


consumption Subwoofer 20 W

USB 5 V / 0.5 A

General Main unit 4.28 Ibs


Weight
Subwoofer 12.01 Ibs

Dimensions Main unit 35.67 x 1.77 x 2.76 inches


(W x H x D) Subwoofer 6.89 x 13.78 x 11.61 inches

Operating temperature range +41 °F to +95 °F

Operating humidity range 10 % to 75 %

Rated output Main unit 80 W/CH, 4 OHM, THD = 10 %, 1 kHz


power Subwoofer 120 W, 4 OHM, THD = 10 %, 70 Hz
Amplifier
S/N ratio (analog input) 65 dB

Separation (1 kHz) 65 dB

NOTE

• S/N ratio, distortion, separation and usable sensitivity are based on measurement using AES (Audio Engineering Society)
guidelines.
• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-2


2. Product Specification

2.3. Specifications Analysis

Model Name HW-F450 HW-E450

Photo

RMS (10% THD),


Output 280 W 280 W
REF: 1ch
Power
Output Power (ch) 80 W x 2 + 120 W 80 W x 2 + 120 W

Disc playback N/A N/A


Compatible
Media iPod Dock
- -
(selected region only)

Wireless Ready - -
Extra
USB HOST O O
Features
Bluetooth O O

DVD Progressive Scan


- -
(Video) (NT/PAL)

Virtual Surround O O

3D SOUND 3D Sound Plus 3D Sound

ASC - -
DSP
Smart Volume Smart Volume II Smart Volume II

Audio Up scale - -

Power Bass - -

Dolby Digital / Plus Dolby Digital 2.0 Dolby Digital 2.0

Audio Dolby True HD N/A N/A


Decoding
DTS / DTS-HD
DTS DTS
(HR/MA)

Component out - -

Video HDMI Out (CEC) O O

HDMI Input O O

Audio Mini Jack Audio In AUX1 (3.5φ) AUX1 (3.5φ)


In/Out
RCA Input - -

Optical
In (Digital In) O (1) O (1)
Jack

Headphone Headphone Jack (3.5Φ) - -

FM - -
Tuner
Preset Memory - -

2-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.


2. Product Specification

Model Name HW-F450 HW-E450

Photo

Internal Type Internal Type


Type (Sat/Tallboy) (Main Frame Built-In Type) (Main Frame Built-In Type)
Speaker 2 way 3 spk 2 way 3 spk

Active (Powered) S/W Wireless Active Wireless Active

TIP

O : Feature Included
X : Not Included

Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-4


2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code Remark


POWER TV PO WER

AUTO
SOURC E POW ER SPEAKER TV SO URCE

AirTrack On SoundSha re

TV VOL TV CH AUDIO SYNC

TV MUTE TV INFO TV PRE-CH REPE AT

SOUND EFFECT

S/W
LEVEL
VOL

MUTE
SMART VOLUME

S/W
LEVEL
Remote Control AH59-02547A
VOL
3D SOUND DRC
PLUS

AH59-02546A

Batteries (AAA size) 4301-000116

Bracket-Wall Mount AH61-02952A

Toroidal ferrite core 3301-000144 Local Samsung Dealer

USB Cable AH39-01178A

User Manual AH68-02615C

AUX Cable BN39-01286A

2-5 Copyright© 1995-2012 SAMSUNG. All rights reserved.


3. Disassembly & Reassembly

3. Disassembly & Reassembly

3.1. Overall Disassembly and Reassembly


CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 13 screws on the Rear.


: BH,+,-,B,M3,L10,ZPC(BLK)

CAUTION

Be careful not to make any scratches as you remove them.

2. Remove Cover Jack, Cover HDMI, AC Cord.

3. Remove Cover Rear.

4. Disconnect wire 4ea.

5. Unfasten 1 screws on the HDMI.


: BH,+,-,B,M3,L10,ZPC(BLK)BH,+,-

6. Remove HDMI PCB and disconnect FPC wire.

7. Unfasten 7 screws on the SMPS, MAIN-PCB.


: BH,+,-,B,M3,L8,ZPC(SILVER)
And remove SMPS and MAIN-PCB.

8. Unfasten 2 screw on the COVER-FRONT.


: BH,+,-,B,M3,L8,ZPC(SILVER)
Remove wireless and bluetooth PCB.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 3-1


3. Disassembly & Reassembly

Description Description Photo

9. Unfasten 2 screw on the SHIELD-PCB COVER-FRONT.


: BH,+,-,B,M3,L8,ZPC(SILVER)
Remove VFD PCB.

10. Unfasten 14 screw on the FRONT.


: BH,+,-,B,M3,L10,ZPC(BLK)
Remove ASSY SPK and BUTTON-PCB.

3-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values


Voltage/DIV 1 V/div
TIME/DIV 500 ms/div

4.1.1. No Power

The po we r doe s not turn on.

Che ck if 3.4V
Che ck if 3.4V Che ck the po we r
No is me a s ure d a t the No No
is me a s ure d on the MAIN PCB circu it of SMP S P CB TRANS Re place the S MP S .
Po we r P CB (S MPS) C N802
PCN1 PIN #3. (TA901) output.
pin #3.

Ye s Ye s Ye s

Main PC B P CN1 cha nge . Che ck AC cord conne ctor


a nd AC cor.

Check if "H(3.3v)
is measured at the pin #62
of the UIC1 when MAIN PCB Re pla ce the Mico m (UIC1).
power is turned on.

Ye s

Cha nge the MAIN PC B.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-1


4. Troubleshooting

4.1.2. No Sound output (Digital)

No output

Che ck S P DIF Output.

Check if 3.3V
power is measured a t No
Change the MAIN PCB.
pin 94 of IC3002 on the
MAIN P CB.

Ye s

Check if 3.3V
power is measured a t No Main to HDMI No
Change HDMI PCB.
pin 3 of opja ck1 on the conn ection check.
HDMI P CB.

Ye s

Che ck DS P.
A

(1)
Che ck if s igna l is
me a s ure d a t pin No. 69,70,71,74 No No
Replace IC3002. Change the MAIN PCB.
of IC3002 on the
MAIN P CB.
* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-1.

(2)
Check if s igna l is
No No
measured at pin No.39,40,35,32,27,28 Replace IC4002. Change the MAIN PCB.
of IC4002 on the
MAIN P CB.
* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-2.

S pe a ke r output che ck.

(3)
Che ck the Ma in P CB No No
ACN1, ACN2 s pe a ke r output Change speaker connector. Change the MAIN PCB.
sig nal .
* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-3.

Cha nge S pe a ke r L,R.

4-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

(1)
IC3006

IC3 0 07

IC 4 002
IC3002 (1)

* 5.3. MAIN P CB Bottom


R31 114

100N
10KOHM 1/16W
R31 0

C30 0
R30 32 392OHM

56KOHM

7 8 1/16W
R40 03
1/10W

100NF

1/16W

1 2 DGND
C30 04
47KOHM

AGND
R31 15

3 4 R3008
56KOHM
1/16W

R40 04

5 6 47OHM D+3.3V
1/16W

AVD3.3VS VC3.3V D+1.35V


7 8 1/16W
DGND
128
127
126
125
124
123
122
121
120
119
118
11 7
116
115
114
113
11 2
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97

R3009 BD300
47OHM VD3.3VPLL
USB_AGND

PAD_COMP
USB_VCCA

VDDAADC
USB_DM

PAD_RSET
VD33VDAC

VD33AADC
SYSCLK

VS33VDAC
VS33AADC
PAD_REF
VDAC
VDD

VDD

USB_DP
VD33

1/16W
DMA[2]

DMA[3]

DMA[9]
DMA[8]
DMA[7]
DMA[6]

DMA[5]
DMA[4]
DMA[11]

LINE_IN_R1

LINE_IN_R2

LINE_IN_R3
LINE_IN_L1

LINE_IN_L2

LINE_IN_L3

1 2 C30 11 100NF
3 4 1 96 16V
0.01OH
DMA[1] VS33PLL
5 6 2 DMA[0] VD33PLL
95
7 8 3 DMA[10] SPDIF_ IN
94 SPDIF_IN1
R3010
R301 0 47OHM BA1_ST 4 DRAS2_B VD33
93 E3SB27 .0000F18E35
R3011
R301 1 1/16W BA0_ST 5 92 R3045 150OHM X3001
DRAS1_B VID_XI
47OHM 6 91 1/16W
27MHZ
100KOHM

4 1
R3052

1/16W DCS1_B VID_XO Q3 Q0


1/16W

7 DCS0_B VDD
90
R3012
R301 2 100OHM RAS_PLL 2 8 DRAS0_B MCLK
89
R3013
R301 3 100OHM CAS_PLL 3 9 88 3 2
DCAS_B VSS /VS33 R3001 Q2 Q1
Q1
R3014
R301 4 100OHM DWE_PLL 1 10 DWE_B SR[05]
87 10KOHM
R3015
R301 5 47OHM 11 DSCK ES86 80 DSC SR[07]
86 10KOHM
1/16W C3014
12 VDD VSS /VS33
85 R3002
27PF
IC3002 C3009
R3016
R301 6 100OHM DQM_PLL0 13 DQM DAC_O6R
84 C3012 27P F
50V
1/16W 14 83 100NF 16V 50V
VD33 VS33ADAC AGND
1 2 15 DB[7] VD33ADAC
82
3 4 R3003 16 81 C30 13
100NF
MGND1

5 6 47OHM 17
DB[6] DAC_O6L
80 16V
DGND A+3.3V
DB[5] DAC_O5 R BD100
7 8 1/16W 18 79
DB[4] DAC_O5 L AUD3.3V
1 2 R3004 19 DB[3] DGND DAC_O4 R
78
3 4 47OHM 20 77 0.01OH
DB[2] DAC_O4 L
5 6 1/16W 21 76
DB[1] DAC_O3R
7 8 22 75
DB[0] DAC_O3L C30 15 BD300
23 VDD DAC_O2R
74 100NF R31 10
PWM_L-
1 2 24 73 16V 33OHM
DB[8] VS33ADAC AGND
3 4 R3005 25 72 0.01OH
DB[9] VD33ADAC
5 6 47OHM 26 DB[10] DAC_O2L
71 R31 11
PWM_L+
7 8 1/16W 27 DB[11] DAC_O1R
70 33OHM R31 12 PWM_R-
1 2
28
29
VD33 (1) DAC_O1L
69
68
33OHM
33OHM
R31 13
R31 08
PWM_R+
DB[12] SR[06]
33OHM EPROM_WP
3 4 R3006 30 DB[13] SR[32]
67
5 6 47OHM 31 66 R31 09
1/16W DB[14] SR[15]
33OHM D_CO _MI DATA_CRESCENDO OUT/MICOM IN
7 8 32 65
SPDIF_OUT

DB[15] VSS /VS33


RESET_B

SPI_CLK
SPI_CS2
SPI_CS3

R50 04
SPI_DO
AUX[7]
AUX[6]
AUX[5]
AUX[4]
AUX[3]

AUX[2]
AUX[1]
AUX[0]

SPI_DI

SR[10]
SR[11]
SR[12]
SR[13]
SP[21]
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
OP[5]
OP[6]
OP[7]
VD33

VD33

4.7KOHM
VDD

VDD

DGND
VC3.3V
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
R5005
R5001
R5002
R5006
R5007
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

R30 29

R30 30

H_SP DIF
33OHM

33OHM
33OHM

R31 01
10KOHM

1/16W

1/16W

1/16W
SPI _CS3

33OHM

C30 16
1/16W

1/16W

R50 03
4.7KOHM

10KOHM
R30 97

R302 3 33OHM
R40 02

100NF 16V
R30 53

R30 54
R30 84

VRP_ CTR
33OHM

2.2KOHM

2.2KOHM
1/16W

1/16 W
2.2KOHM

R302 2 1 8
R50 59
R50 58

100OHM

OTW
1/16W
100OHM1/16W

R302 4 33OHM
33OH M 1/16
1/16W
W A0 VCC
1/16W

MST_CAK 2 7
R30 99
R30 86
33OHM

R302 5 33OHM A1 WP
1/16W

CST_MA K 3 6
R30 51

D_MO_CI
100OHM

33OHM 1/16 W A2 SCL EP_SCL


CII_RES ET
1/16 W CRESCENDO_ STROBE/MICOM_ACK
4 VSS SDA
5 EP_SDA

* 6.4. MAIN-3

<Fig. 4-1>

Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-3


4. Troubleshooting

(2)

IC400 2
(2)

* 5.3. MAIN P CB Bottom


3.3OHM
AC2
10UF

1/10W
10V

AC20
100NF
50V

50V
AC17

AC16 50V
AC22

AC18
100NF

33NF
50V
10UF
10V

100NF

AR13
AR13
DGND

D+3.3 V

AC27
47KOH M
1/10W
AR2

AC25

AR1 TAS5614L ADDV


10UF

IC4002
10UF
AC14

100OHM 1/10W
25V

25VV

RST_P OWER AC13


25

1 GVDD_AB 44 33NF 50V


BST_A
AR3 2 43
AC28
VDD
30KOHM 1/10W 3 BST_B
42
AC26

DGND
AC15

OC_ADJ
10 UF

10UF

GND
AC1 100PF 4 41
25VV

25V

/RES ET
25

GND
50V 5 INPUT_A 40
OUT_A
6 INPUT_B 39
AR14

OUT_A
AC2 100NF 16V 7 C_S TART 38
PVDD_AB
AC3 8 DVDD 37
PVDD_AB
1UF 16V 9 GND 36
10 PVDD_AB
35 DGND DGND
GND
OUT_B
11 GND 34
AC4
12
13
GND
AVDD
FL/FR GND
GND
33
32
OUT_C
1UF 16V 14 INPUT_C 31
PVDD_C D
15 INPUT_D 30
PVDD_C D
SD_POWE R AR5 100OHM 1/10W 16 /FAULT 29
PVDD_C D
OTW AR6 100OHM 1/10W
1/10W 17 /OTW 28
OUT_D
18 27
AR15

/CLIP
10UF
AC5

OUT_D
AC10
10UF

19 26
25V

25V

M1
GND
AR7 20 M2 25
100O HM 21 M3 (2) GND
BST_C
24
22 23
AC11

AC12
10UF

GVDD_CD
AC9

AC29
10UF

BST_D
25V

333NF
3 NF 550V
0V
25V

DGND
33NF 50V
AC8

DGND

* 6.5. MAIN-4

<Fig. 4-2>

4-4 Copyright© 1995-2012 SAMSUNG. All rights reserved.


AC30 AC29 AR15 AR14 AC28 AC27 AR1
AR1
330PF 330PF 18OHM 18OHM 330PF 330PF 18OHM
50V 50V 1/16W 1/16W 50V 50V 1/16W

8.2UH
8.2UH
AL2

AL3
(3)
AC64 AC63 AC62 AC61

(3)
1UF 1UF 1UF 1UF
50V 50V 50V 50V

DGND DGND

AC39 AC38 AC37


AC N 1

100NF 100NF 100NF

AC N 2
50V 50V 50V

AC36 AC35 AR19 AR18 AC34 AC33 AR17


3.3OHM 10NF 10NF 3.3OHM 3.3OHM 10NF 10NF 3.3OHM
1/10W 50V 50V 1/10W 1/10W 50V 50V 1/10W

Copyright© 1995-2012 SAMSUNG. All rights reserved.


AC44 AC43 AC42 AC41
2.2NF 50V
50V 2.2NF 50V 2.2NF 50V 2.2NF 50V P CN1
AC46 AC45
100NF 50V 100NF 50V

<Fig. 4-3>
AC48
100NF 50V AC47
100NF 50V
AC55
100NF 50V AC53
100NF 50V
AC56
100NF 50V AC54

* 5.2. MAIN P CB Top


100NF 50V

SPK_F L-

SPK_ FR+

R(-)
L(-)

2
R(+)
L(+)

1
2

1
3
DGND
(3)

ACN1
SMW200-H03G
MGND1
MGND2
ACN2

MGND1
MGND2

DGND
SMW200-H02G

(3)

(3)
SP_ GND

* 6.5. MAIN-4

4-5
4. Troubleshooting
4. Troubleshooting

4.1.3. No Sound output (Analog)

No output

Check ANALOG OUTPU T.

Che ck if 3.3V
powe r is me a s ure d a t pin 94 of No
Cha nge the MAIN P CB.
CN3 002 on the
MAIN P CB.

Ye s

(1)
Che ck if s igna l is No Ma in to HDMI No
me a s ure d a t pin no. 2, 4 of AUX1 Cha nge the HDMI P CB.
conne ction che ck.
on the HDMI P CB.

* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-4.

Che ck DS P.

(2)
Che ck if s igna l is
me a s ure d a t pin No. 101,102 No No
Re pla ce IC3002. Cha nge the MAIN P CB.
of IC3002 on the
MAIN P CB.
* Re fe r to wa ve pa tte rn
ima ge of Fig. 4-5.

A Go to “No output(Digita l) - A”

4-6 Copyright© 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

(1)

(1)

* 5.4. HDMI P CB Top

AUX1 (1)
GCC02- 0139R

7 AAR1
6 AUX_SENS_H
5 470OHM AAR2 330OHM
1/16W
4 1/16W
AUX_R_H
3 AUX_L_H
2 AAR3
11

11

1 330OHM
1/16 W
VT1

VT2
MLVS-0603-E0 8

MLVS-0603-E0 8

AAC6
330P F

AAC8
16V

AABD2
33 0P F
AAC5

50V
100NF
100NF

50V
AAC4

0.01OHM
16V

AAR4

AAC10
AAR5

AAC9
50V
22 0KOHM

22 0KOHM

50V
1/16W

1/16W

330P F

0P F
330P
33

HAGND HDGND

AABD1
16V
AAC2
16V
AAC1

100NF

16V
100NF

0.01OHM
100NF
AAC3

AAC7 OP JACK1
100NF RFR-4112HP
RFR-41 12HP
16 V
HAGND MGND1 1
VCC
C1000
OP R100 OP C10

2
GND
HDGND
MGND2 3
VOUT
33OHM

HDGND

* 6.6. HDMI

<Fig. 4-4>

Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-7


4. Troubleshooting

IC 3 0 0 7
(2)

IC30 0 2

(2)

* 5.3. MAIN P CB Bottom


R31 14 47KOH
1/16W

4 R3007 10UF
100NF
10KOHM 1/16W

6 47OHM
R31 02

C30 03

12,23,48,58,90,116,127
R30 32 392OHM

56KOHM

8 1/16W
R40 03
1/10W

100NF

1/16 W

2 DGND
C30 04
47KOHM

AGND
R31 15

4 R3008
56KOHM
1/16W

R40 04

6 47OHM
1/16W

AVD3.3VS VC3.3V D+1.35V D+3.3V


8 1/16W
DGND BD300

0.01OHM
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100

VC3.3V
99
98
97

R3009 BD3003
47OHM VD3.3VPLL
USB_AGND

PAD_COMP
USB_VCCA

VDDAADC
USB_DM

PAD_RSET
VD33VDAC

VD33AADC
SYSCLK

VS33VDAC
VS33AADC
PAD_REF
VDAC
VDD

VDD

USB_DP
VD33

1/16W
DMA[2]

DMA[3]

DMA[9]
DMA[8]
DMA[7]
DMA[6]

DMA[5]
DMA[4]
DMA[11]

LINE_IN_R1

LINE_IN_R2

LINE_IN_R3
LINE_IN_L1

LINE_IN_L2

LINE_IN_L3

2 C3011 100N F
4 1 96 16V
0.01OHM
DMA[1] VS33PLL
BD300
6 2 DMA[0] VD33PLL
95
8 3 94 SPDIF_IN1
47OHM BA1_ST 4
DMA[10] SP DIF_IN
93 0.01OHM
1/16W DRAS2 _B VD33 E3SB27 .00 00 F18E35
BA0_S T 5 DRAS1 _B VID_XI
92 R3045 150 OHM X3001
6 91 1/1 6W
27 MHZ
(2)
100KOHM

4 1
R3052

DCS1_ B VID_XO Q3 Q0
1/16W

7 DCS0_ B VDD
90
100OHM RAS_PLL 2 8 DRAS0 _B MCLK
89
100OHM CAS_PLL 3 9 88 3 2 BD3006
DCAS_ B VSS/VS33 R3001 Q2 Q1
Q1
100OHM DWE_PLL 1 10 DWE_B SR[05 ]
87 10KO HM
47OHM 11 DSCK ES86 80 DSC SR[07 ]
86 10KO HM
1/16W 12 85 R3
R3002
002 C3014 0.01OHM
VDD VSS/VS33 27PF
IC300 2 C3009
100OHM DQM_PLL0 13 DQM DAC_O6R
84 C3012 27PF
50V
1/16W 14 83 100NF 16V 50V
VD33 VS33 ADAC AGND
2 15 DB[7] VD33ADAC
82
4 R3003 16 81 C3013
100NF
MGND1

6 47OHM 17
DB[6] DAC_O6L
80 16V
DGND A+3.3V AUD3.3V
DB[5] DAC_O5R BD1003
8 1/16W 18 79
DB[4] DAC_O5L AUD3.3V
2 R3004 19 DB[3] DGND DAC_O4R
78
4 47OHM 20 77 0.01OHM
DB[2] DAC_O4L
6 1/16W 21 76
DB[1] DAC_O3R AVD3.3VS
8 22 75
DB[0] DAC_O3L C3015 BD3009
23 74 100NF R31 10
VDD DAC_O2R
16V 33OHM PWM_L-
2 24 DB[8] VS33 ADAC
73
AGND
100NF

4 R3005 25 72 0.01OHM
C30 28

DB[9] VD33ADAC
6 47OHM 26 DB[10] DAC_O2L
71 R31 11
PWM_L+
8 1/16W 27 DB[11] DAC_O1R
70 33OHM R31 12 PWM_R-
28 69 33OHM R31 13
VD33 DAC_O1L
33OHM PWM_R+
2 29 DB[12] SR[06 ]
68 R31 08
EPROM_WP
4 R3006 30 67 33OHM AGND
DB[13] SR[32 ]
6 47OHM 31 66 R31 09
1/16W DB[14] SR[15 ]
33OHM D_CO _MI DATA_CRESCENDO OUT/MICOM IN
8 32 65
SPDIF_OUT

DB[15] VSS/VS33
RESET_B

SPI_CLK
SPI_CS2
SPI_CS3

R50 04
SPI_DO
AUX[7]
AUX[6]
AUX[5]
AUX[4]
AUX[3]

AUX[2]
AUX[1]
AUX[0]

SPI_DI

SR[10]
SR[11]
SR[12]
SR[13]
SP[21]
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
OP[5]
OP[6]
OP[7]
VD33

VD33

4.7KOHM
VDD

VDD

DGND
VC3.3V
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
R5005
R5001
R5002
R5006
R5007
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

R30 29

R30 30
33OHM

33OHM
33OHM

R31 01
10KOHM

1/16W

1/16W

1/16W
SPI _CS3

33OHM

C30 16
1/16W

1/16W

R50 03
4.7KOHM

10KOHM
R30 97

R3023 33OHM
R40 02

100NF 16V
R30 53

R30 54
R30 84
33OHM

2.2KOHM

2.2KOHM
1/16W

1/16 W
2.2KOHM

R3022 1 8
R50 59
R50 58

100OHM
1/16W
100OHM1/16W

R3024 33OHM
33OH M 1/16
1/16W
W A0 VCC
1/16W

2 7
R30 99
R30 86
33OHM

R3025 33OHM A1 WP
1/16W

CS T_MAK 3 6
R30 51
100OHM

33OHM 1/16 W A2 SCL EP_SCL


1/16 W CRESCENDO_ STROBE/ MICOM_ACK
4 5

* 6.4. MAIN-3

<Fig. 4-5>

4-8 Copyright© 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

• Protection Circuit operates when power problem occurs in the SMPS.


Protection Circuit Operation
Part Location Pin No. Remark
Open Short
SMPS
PS+3.6V ○ ○
CN802
PVDD+25.5V ○ ○

4.2.2. Power Protection

The Condition of Power Protection Active.

1) Voltage of SMPS's PVDD(+25.5V) is higher than standards.

2) Normal Condition Voltage Range : PVDD(+25V): about +25V

Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-9


4. Troubleshooting

4.2.3. AMP Pre-Inspection relating to Power Protection

If you think there are problems at the AMP PCB, you can check the PCB without disassembling the set by following
the test below.

CAUTION

Do not connect the power cord during the test!

Resistance using Tester


F/R CH 200Kohm

• If there is a large difference than the value listed above then the AMP PCB has a problem.

S ET CH AS S I S
S P E AK E R O U T P U T

GND

4-10 Copyright© 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4.3. Initialization & Update

4.3.1. How to check the Firmware version

1) Turn the power off.

2) Press the “DRC” button on the remote control.

3) After 5 seconds, the version will be displayed on the LED.

4.3.2. How to initialize

Using the remote control

1) Turn the power off.

2) Press the "MUTE" button on the remote control for 5 seconds.

3) "ID SET" will be displayer on the LED.

Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-11


4. Troubleshooting

4.3.3. USB Update procedure

1) Step 1 : Power on the device. You can see the following VFD display.

VFD HELLO D-IN

2) Step 2 : Prepare the USB disk with update files then plug-in to the USB port. You can see the following VFD display.

UPD ATE DONE

3) Step 3 : Progressing update.


In case Micom, DSP, HDMI and Wireless update, you can see the following VFD display.
Cas e 1 : Micom Update .

M UP D M UP D DONE

Cas e 2 : DS P Update .

D 0% D 1 00% DONE

Cas e 3 : Wire le s s Update .

W 0% W 1 00% DONE

Cas e 4 : HDMI Update

H 0% H 1 00% DONE

4-12 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

US B BLUETOOTH VFD AS S 'Y

1 2 3 4 5 6 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10

1 2 3 4 5 6 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10
U_5V
U_DM
U_DP
DGND
ADC
DGND

BT_RST
D+3.3V
BT_TX
BT_RX
DGND
BT_SCL
BT_SDA
DGND

D+12V
VFD_DATA
M+3.3V
VFD_CLK
D+3.3V
VFD_CE
REM_DATA
VFD_RST
DGND
ECO
1 1 D5V
2 2 D5V CN3002
3 3
4 4 CN3003 CN103 DGND 1 1
5 5 W_IRQ DGND 2 2
6 6 DARR_RS T P S +3.6V 3 3
7 7 W_S CL P OWER_VR 4 4
8 8 W_S DA DGND 5 5
9 9 DGND 6 6
10 10 DGND 7 7
11 11 DGND DGND 8 8
WIRELESS 12 12 DGND MAIN ASSY P VDD+25 9 9 S MP S AS S Y
13 13 W_BCK P VDD+25 10 10
14 14 W_LRCK P VDD+25 11 11
15 15 P VDD+25 12 12
16 16 W_S DATA
17 17 P CN1
18 18
19 19
20 20

CEC_MICOM
21 21

AUX_SENS
MAIN_SDA

MAIN_SCL

SPDIF_IN1
22 22
TV_LRCK

TV_DATA

H_SPDIF
TV_BCK
HPD_A

M+3.3V
AUX_R
23 23 /WP
H+1.8V
H+1.8V

AUX_L
H_INT
DGND

DGND

DGND

DGND
AGND

AGND
D+5V
24 24 DGND
WCN1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CN101
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

HDMI ASSY

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-1


5. PCB Diagram

5.2. MAIN PCB Top

(1) WC N 1 CN3004 CN3003 (6)

(5)
AC N 1
TP2
PIC9

P CN1
(4)
CN1 0 1

IC30 0 6

(2)
AC N 2 TP2

(3)
CN1021

5-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2.1. Pin Connection

1) WCN1 2) CN101 5) PCN1


WIRELESS CONTROL HDMI CONTROL POWER SIGNAL CONNECTOR

Pin No. Signal Pin No. Signal Pin No. Signal


1 D+5V 1 H+1.8V 1 DGND
2 D+5V 2 H+1.8V 2 DGND
3 3 TV_LRCK 3 PS+3.6V
4 4 DGND 4 POWER_VR
5 W_IRQ 5 TV_DATA 5 DGND
6 DARR_RST 6 HPD_A 6 DGND
7 W_SCL 7 TV_BCK 7 DGND
8 W_SDA 8 H_INT 8 DGND
9 9 H_SPDIF 9 PVDD+25
10 10 MAIN_SDA 10 PVDD+25
11 W_MCLK 11 CEC_MICOM 11 PVDD+25
12 DGND 12 MAIN_SCL 12 PVDD+25
13 W_BCK 13 D+5V
14 W_LRCK 14 AUX_L 6) CN3003

15 15 AUX_SENS BLUETOOTH CONTROL

16 W_SDATA 16 AGND Pin No. Signal


17 17 DGND 1 BT_RST
18 18 AUX_R 2 D+3.3V
19 19 DGND 3 BT_TX
20 20 AGND 4 BT_RX
21 21 DGND 5 DGND
22 22 SPDIF_IN1 6 BT_SCL
23 /WP 23 M+3.3V 7 BT_SDA
24 DGND 8 DGND
3) ACN2
FRONT L-CH OUTPUT

Pin No. Signal


1 L-
2 L+

4) ACN1
FRONT R-CH OUTPUT

Pin No. Signal


1 R-
2
2 R+

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-3


5. PCB Diagram

5.2.2. Test Point Wave Form

TP2

5-4 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.3. MAIN PCB Bottom

IC3006

P IC 2

IC 3 0 0 7
CN103
(2)

IC 4 0 0 2
U IC 1
IC30 0 2
CN3 0 0 2

(1)

TP1

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-5


5. PCB Diagram

5.3.1. Pin Connection

1) CN3002
USB CONTROL

Pin No. Signal


1 D5V
2 USB_CON_DM
3 USC_CON_DP
4 DGND
5 SW_ADC
6 DGND

2) CN103
VFD CONTROL

Pin No. Signal


1 D+12V
2 VFD_DATA
3 M+3.3V
4 VFD_CLK
5 D+3.3V
6 VFD_CE
7 REM_DATA
8 VFD_RST
9 DGND
10 ECO

5-6 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.3.2. Test Point Wave Form

TP1

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-7


5. PCB Diagram

5.4. HDMI PCB Top

HIC2

O P J AC K 1 HCN1

HIC1

TP 3

AU X1 HCN2

5-8 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.4.1. Test Point Wave Form

TP3

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-9


5. PCB Diagram

5.5. HDMI PCB Bottom

(1)
HCN4

5-10 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.5.1. Pin Connection

1) HCN4
HDMI CONTROL

Pin No. Signal


1 EP1.8V
2 EP1.8V
3 TV_LRCK_H
4 HDGND
5 TV_DATA_H
6 HPD_A_H
7 TV_BCK_H
8 I2C_INT_H
9 H_SPDIF_H
10 MAIN_SDA_H
11 CEC_MICOM_H
12 MAIN_SCL_H
13 H5V
14 AUX_L_H
15 AUX_SENS_H
16 HAGND
17 HDGND
18 AUX_R_H
19 HDGND
20 HAGND
21 HDGND
22 OPTICAL_0_H
23 HM3.3V

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-11


5. PCB Diagram

5.6. VFD PCB Top

5-12 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.7. VFD PCB Bottom

(1)
FCN1

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-13


5. PCB Diagram

5.7.1. Pin Connection

1) FCN1
VFD CONTROL

Pin No. Signal


1 D+12VV
2 VFD_DATA_V
3 M+3.3VV
4 VFD_CLK_V
5 D3.3VV
6 VFD_CE_V
7 REM_DATA1
8 VFD_RST_V
9 V_DGND
10 ECO_V

5-14 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.8. USB PCB Top

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-15


5. PCB Diagram

5.9. USB PCB Bottom

(1)
SC N 1

5-16 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.9.1. Pin Connection

1) SCN1
USB CONTROL

Pin No. Signal


1 USB_5V
2 USB_DM
3 USB_DP
4 DGND
5 SW_ADC
6 DGND

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-17


5. PCB Diagram

5.10. SMPS PCB Top

DANGER High Volta ge


12P IN

5-18 Copyright© 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.11. SMPS PCB Bottom

Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-19


6. Schematic Diagram

6. Schematic Diagram

6-1 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.1. Overall Block Diagram

• Main System uses Digital Signal Processor which is ESS Crescendo2+ (ESCD8680)
Blo c k Dia g ra m (HW-F450 = E450 Ca rry Ove r)
• The Crescendo2+ include DIR, ADC, DAC, PWM IC.
Se ria l
DRAM
Fla s h • All displays is registered by VFD.
• Serial Interface between I2S is operated with various protocol over the whole system.
˜ • ‰ Ž‹
— ®¬ ­ ¹
O p t ! In p u t ! 1
† ³ ¦ ±´ ¬ ew ¨ ­
• DSP (ESD8680) implement DSP AUDIO DECODING function by 12s.
TAS5614LA
A n a l o g ! In p u t
80W + 80W (4Ω ) • Power, proper for each part, will be generated by SMPS.
š ˜ ‡ e ” ˜ ™
‘ ª «¹
• Power On/Off by Micom port is possible.
U SB ES S
Crecen d o II +
Žw ˜ em ˜ º § e ¼ ´ ´ « ª ·n
• Function and sound field can be controlled by remote controller and keys.
T X - M o d u le w s y Œ e† › “ Š — †
• HDMI repeater IC includes internal HDMI Micom.
š † —™

y ‘ ®³ ª eˆ ´ ² • The active subwoofer operate with wireless system.


ˆ ˜— VFD
DISPLAY
˜ • ‰ Ž‹ m † — ˆ n
Main Mico m
˜ • ‰ Ž‹ m ‘ ª ¬ ¦ ¨ ¾ n ˜ • ‰ Ž‹ m ‹ ´ · e™ › n R5F100LG Re m o c o n
IR

Žw ˆ CEC
HDMI IN1 Fu n ctio n TACT
HDMI Rep eater ˆ Šˆ in clu d ed Ke y

In tern al
HDMI
Mico m
HDMI OUT
S MP S

Blo c k Dia g ra m (HW-F450/550/750 : S u b Wo o fe r(S WA-6000)

P WM Mo d u lato r P o wer AMP


IRS 2092+IRF6645 (BTL 1 CH, 4Ω 120W ˜ º § eœ ´ ´ «ª ·
UB2130
Žw ˜ e 3Ω 150W)
(UBI)

R X - M o d u le w s y Œ e† › “ Š — †

† ’ • e• › ‰ ‰

DC-DC co n verter

S MP S ( AC 110V/220V Cap . ÿ ÿ )

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-2


6. Schematic Diagram

6.2. MAIN-1
D+5V
POWER PBD15

AUDIO 0.01OHM

WIRELESS_5V
USB_5V
HDMI_5V

D+3.3V
PBD11

MGND1
AP1117E 33G Z-13-89
OVER5.3 0.01OHM AP7361-Y
D+12V PIC5 A+3.3V A+1.35 V
GVDD+12 V D+12V PBD4
PIC7 PBD7
2.2UH PBD5 PBD6
UNDEFINED PL2 1 OUT 3 1 5

3.3KOHM
10UH 10UF 10UF 10UF 10U
10UFF 10UF IN OUT EN OUT
PL1 2

120K OHM 2.2KOHM


25V 25V
25 V 25V 25V 25V GND
0.01OHM

PR29
0.01OHM 0.01OHM 3 4 0.01OHM

PR22
PR10
GND

1OHM
PR7 ADJ/NC IN
PIC1 1.5OHM

SS3P 4
PR15 100K OHM1/16W
100NF
PC4

PC5

PC7

PC8

PC9

PC10
PSD3
DDC+25V TPS54331D

100NF
PR16 1/4W

100NF
2
47P F
50V

47UF/6.3V X 2
PC49

PC24
40
1 8

PC20

PC29
100NF

47UF
BOOT
BOO T

100NF

10UF 10V
1.5OHM

10UF
TPS54327DD AR

PC21
2 PH
7 PR3

10V

4.7KOHM
VIN
10KO HM 1/4W

PC22
PIC2

C1004
PR9
GND 22PF

PR6
PC50
3 6 PC54 1/10W

10UF
50V 8 1

1/16W
EN COMP

PC23
VIN EN
4 5

C87

C89
PC2

PC3 SS VSENSE 7 2
10UF

VBST VFB
10UF
25V

PC56 PR13 PR14


PR14 6 3

0V
25V

10V
10V
110V
10V
10V
10V
PC53 390P F
390PF 56
56KOHM
KOHM 1.6KOHM
1.6KOHM SW VREG5
VREG5

47KOHM
5 4

MGND1
100NF 50V 1/10W 1/10W
DGND GND SS
SS

10UF
50V

PC12

10UFF
10UF
10UF
0 UF
PC51

PC52

110UF
10UFF
1UF

10UF
10UF

4.7NF

10U
DGND

10U
10UF PR4
25V

AGND
25V 680OHM

22KOHM
PR8
DGND 1/10W
POWER_ON
PR2 PR5

PC13

PC16
PC17
PC18
PC19
PC46
PC47
10UF
470OHM 1/10W

PR12
PR1

PC11
20OHM

100NF

PC15
10KOHM

PC14
1/16W 1/10W

OVER5. 3
DGND DGND
DGND DGND
DGND DGND

PCN1 H+1.8V PVDD+25V DDC+25V GVDD+12V


25043HR-H12BF
PVDD+25V 2.2UH BD1002 M+3.3V
MGND1
12

UDZS16B-TE-17
PL3

UDZ6.8B-TE-17
PVDD+25V
11

D102

D103
0.01OHM

30KOHM 100OHM
10

PR37
PR33
9 R3066 100K OHM
OHM1/16W
1/16W

MGND1
PS+3 .6V
8 22KO HM R235
1/16W R231 R234

47P F
220O HM

50V
PC30
7

100NF
TPS54327DD AR 220O HM

D
E
R236 1/16W

S
6 PIC9 12KOHM 1/16W 1/16W IC2007

MGND1
Q106

PR36
M+3.3V Q110 B
1/10W

C1006
5 2SA1980S-Y
C
ZXMP6A17G 1KOHM

G
8 VIN EN 1 KIC7S 32F U(RTK)
R3067
4 PBD2 22KO HM 7 2 M+3.3V
270KOHM

POWER_VR VBST VFB R232


3 1/16W 6 3 5 1
R3068

PS+3 .6V 12KOHM R237 R238

10V
10V
10V
10V
SW VREG5
VREG5 VCC B
2 1/10W 2 1KOHM

47KOHM
5 4 1KOHM
1/10W

GND SS
SS A 1/16W

4.7 NF
1/16W

10UF
1 0.01OH M R233 4 3

PC32
22UF

22UF

10UF
10UF
10UF
10UF
6.3V

10KOHM Y GND

1UF
6.3V

MGND2 C 1/16W
PC1

PC6

POWER_VR B

PR39

22KOHM
VRP_CTR C

PR34
PC35
PC34
B
Q111 E PL_SHUTDOWN
DTC114EU Q1 05 E
GND1

P_VR

+25V

DTC114E U

PC33

PC36
PC37
PC38
PC48
10UF
ST_3.6V

PVDD+25V

PC31
DGND DGNDDGND
DGND

100NF
DGND
DGND
PL_DETECT
DGND
DGND

DGND DGND

D+1.35V
D5V_1

WR12 2.2UH BD1001


10OHM PL2 3
1/4W
D+5V
WBD1 0.01OHM

15KOHM 2KOHM
PR25
WR13 PR23
10OHM 100K OHM 1/16 W
100NF 16V

10NF 16V

1/4W
0.01OH M
WC1

PC28

47P F
50V
1NF 50V

100NF
WCN1 TPS54327DD AR
100NF
WC6
WC5
330UF

PIC6
MGND1
WC7

PR24
WC4

WC2
6.3V

16V

C1008
330UF WR14
1 8 1
WR1

VIN EN
DGND
470KOH M

6.3V 10OHM 7 2
1/4W 2 VBST VFB
1/16 W

6 3

0V
10V
10V
10V
110V
DGND 3 SW VREG5
VREG5

47KOHM
4 5 GND SS
SS 4
4.7 NF
4.7NF
10UF
PC26

10UF
110UF
0 UF
10UF
10UF
5

1UF
W_IRQ WR2 33OHM
DARR_RST WR3 33OHM 6
PR28

22KOHM
PR26
7
WIRELES S CONNECTOR

PC40
WR4 33OHM
PC39

W_SCL
W_SDA WR5 33OHM 8
PC27

PC41
PC42
PC43
PC44
WC8
10UF

WR6 33OHM 9
PC25

100NF

SUB_MICOM_RX 100N F 16V


100NF
SUB_MICOM_TX WR7 33OHM 10
11
12
W_BCK WR8 33OHM 13
W_LRCK WR9 33OHM 14
DGND DGND
15
W_SDA TA WR10 33OHM 16
17
18
W_MCLK
W_SDATA

W_BCK
W_LRCK

W_SDA

DARR_RS T
W_SCL

19
W_IRQ

20
WP 21
WR11 22
33OHM
/WP
23
24
10PF

10PF

PBD14
D5V_2
WC9
WC10
WC11
WC12
WC13
WC14
WC15

0.01O HM DGND

AGND
DEVIDE GND
DGND
OP EN
OP EN

OP EN
OP EN
OP EN

DGND

6-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.3. MAIN-2

POWER
AUDIO
NEC_64 P MICOM

SUB_MICOM_RX
SUB_MICOM_TX
Q101 M+3.3V M+3.3V
2S A1980S -Y 6.3V
D+3.3V 1UF

C
POWER_ON

E
M+3.3V C2017

22KOHM
B

1/16W
C2018

R134

1/16W
R133 IC2004
100NF

10KOHM
M+3.3V

10KOHM

10KOHM
16V

R11 7

R116
6 1

R121
R117
R2097
4.7KOHM USB_DM

1/16W

1/10W
S B2
1/16W DGND 5 VCC GND
2 33OHM
D+3.3V USB_CON_DM
4 A B1
3 R2098
DEBUG_MT_DR
33OHM

10KOHM
R136
CN102 ECO D_MT
SW_ADC C2019

4.7KO HM
MGND1 IC2005

1/16W

100NF
R149
1 100NF

C110
DEBUG _RX_TX 6 1 R2099

16V
/WP 16V USB_DP
2 DARR_RST 5
S B2
2 33OHM
3 UPDATE_RESET SD_POWER
DGND 4
VCC GND
3 R2100
AUX_S ENS

100OHM
100OHM
4 USB_CON_DP A B1 DEBUG_MR_DT

1/16W
1/16W
33OHM
FANET_CTL

2
4
6
8
D+1.35V D_MR

100O HM
MGND2 DGND

R205
2012.08.13
A+1.35V
CHANGE H+1.8V

7
DGND DGND

1
3
5
R126
R125
PL_SHUTD OWN
R2002 1KOHM
M+3.3V PL_DETECT R2003 1KOHM
R2004 1KOHM

57
56
55
54
53
52
51
50
49
64
63
62
61
60
59
58
10KOHM
R104
UPDATE_RESET

1/10W
40

P01/TO 00

P130

P21/A NI1/AVREFM
P22/A NI2
P23/A NI3
P24/A NI4
P25/A NI5
P26/A NI6
P27/A NI7
2012.08.22

P140/PC LBUZ0/INTP6
P141/PC LBUZ1/INTP7

P04/S CK10-/S CL10

P20/A NI0/AVREFP
P00/TI00

P02/A NI17/SO 10/TxD1


RB751V-40T E-17

P03/A NI16/SI10/RxD1/S DA10


R206 R158
M+3.3V FOR VFD ( HW-F450) 100OHM 33O HM D105
VFD_CE 1 2 1 P120 /ANI19 P147/ANI18
48 RS T_POWER
3 4 2 P43 47
10KO HM

VFD_RST P146 FANET_CTL


VFD_DATA
5 6 3 P42/TI0 4/TO04 46 R2101 100O HM
M_RST
1/10W

P10/SCK00-/SCL00
M+3.3V RT9818C- 29PV
R102

VFD_CLK
7 8 4 P41/TI0 7/TO07 P11/SI00/RxD0/TOOLRxD/SDA00
45 R2073 33O HM
DEBUG_MR_DT
UIC2 R103 DEBUG _RX_TX
R146 100OHM 5 P40/TOOL 0 P12/SO00/TxD0/TOOLTxD
44 R2074 33O HM
DEBUG_MT_DR
3 VDD
/RESET,R ESET 1 1/16W
6 /RESE T P13/TxD2/SO20
43
0OHM M+3.3V 7 P124 /XT2/EXCLKS P14/RxD2/SI20/SDA20
42
GND
8 P123 /XT1 R5F 100LGA FB 41
R101

P15/SCK20-/SCL20
9 P137 /INTP0 40
1/16W

UIC1
0OHM

R145 100OHM
W_IRQ P16/TI01/TO01/INTP5
100NF

1/16W
10 P122 /X2/EXCLK 39
2

R94 100O HM
P17/TI02/TO02 REM_DATA
C102

16V

11 P121 /X1 38 R162 100O HM


USB_FAULT

32 P30/IN TP3/RTC1HZ/SC K11-/SCL11


P55

1MOHM
R107 C105 1UF 12 REGC 37 R163 100O HM
USB_E N
1/10W
100NF

24 P75/K R5/INTP9/SCK01-/S CL01


P54
25V 13 VSS 36
C1011

R4/INTP8/SI01/SDA01
25 P74/K R4/INTP8/SI01/SDA01
C10

16V

P53
14 EVSS 0 35 R164 100O HM

R0/SCK21-/S CL21
29 P70/K R0/SCK21-/SCL21
P52 OPT_DET1

21 P31/TI03/TO 03/INTP4
100NF

28 P71/K R1/SI21/SDA21
C107 16V 15 VDD P51/INTP2/SO11
34
16 EVDD0 33

22 P77/K R7/INTP11
23 P76/K R6/INTP10
C106 100NF R119 100O HM

26 P73/K R3/SO01
27 P72/K R2/SO21

30 P06/TI06/TO 06
31 P05/TI05/TO 05
16V P50/INTP1/SI11/SDA11
1/16W
H_INT

P61/S DAA0
CLA0
C108 10UF

18 P60/S
DGND 10V M+3.3V H+1.8V

19 P62
20 P63

10KOHM
10KOHM
R105

R106
1/10W
D+3.3V

1/10W
17

33P F
33P F
33P F
33P F
DGND D+3.3V DGND
BD2003

100OHM
4.7KOHM

33P F
33P F
33P F
0.01OHM

R20 2
100OHM
4.7KOHM
R108

1/16W
1/16W DGND 1.8V

100OHM 1/16W
1/16W
R109

4.7KOHM

C2004
C2005
C2006
C2007
4.7KOHM
2
4
6
8
3
D+12V

100O HM
7
5
1

R120
R110

C2009
1/16W
100OHM CEC_MICOM

1/16W
R201

R132
MAIN_SCL

R131
M+3.3V 1/16W
W_SCL H_SPDIF
MAIN_SDA

C2001
C2002
C2003
CN10 3

100NF
D+3.3V TV_BCK CN101

1
5
7
3
R2001
W_SDA

8
6
4
2
20047HS-H24 13BC I2C_INT

16V
R111 CEC_MICOM TV_DATA
1 2 100OHM
HPD_A TV_LRCK HPD_A
12V VFD_DATA 1/16W
1 2 DD_GND_1
M3.3V 3 4 VFD_CLK CII_RE
CII_RESET
SET
5 6 D_MO_CI MAIN_S CL 3 4 DGND
3.3V VFD_CE DATA_MICOM OUT/CRESCENDO IN TV_LRCK 5 6
7 8 VFD_RST DATA_CRESCENDO OUT/MICOM IN D_CO _MI MAIN_S DA TV_DATA HPD_A
100N F 50V

7 8
100N F 16V

9 10
100N F 16V

MICOM_STROBE/CRESCENDO ACK CST_MAK TV_BCK H_INT


ECO M+3.3V 9 10
CRESCENDO_S TROBE/MICOM_ACK MST_CAK H_S PDIF MAIN_S DA D+5V
11 12
C117

C116

C118

CEC_MICOM MAIN_S CL
REM_DATA 13
AUX_L 14 15 AUX_S ENS

R114

R113
* NC
16 17

* NC
AUX_SENS_1
AUX_R
18 19
M+3.3V
DGND5

20 21
V_RST
ECO_1

V_DATA
R_DATA

V_CE
V_CLK

DGND DGND
DGND DGND DGND BD102
22 23

33P F
33P F
SPDIF_IN1
0.01OHM

R142
AUX_L1
4.7KOHM

4.7KOHM
R141 M+3.3V_1 D+5V_1
R113 R114 R141 R142 P7.2 P7.3 AUX_R1
DD_GND

10NF
10NF
10NF
F350 X 4.7K X 4.7K 1 0 OP TICAL_1

10NF
33P F
F450 X X 4.7K 4.7K 0 0 AA_GND

NC

NC
C1001
C1002
F550 4.7K X 4.7K X 0 1
F750 4.7K 4.7K X X 1 1
OPR3 OPC2
OPC 2 OPR4
OPR4 OPT_DET1 DGND
270OHM 100NF 4.7KOHM

C1010
C1011
C1013
C1003
C1005
C1007
C1009
1/16W 16V 1/16W C SBT42
OPTIC AL_1 B OPQ1
E
100PF 50V

AGND
1N4148 WS

DGND
10NF 25V

47KO HM

DGND
22KO HM

75
OP R1

1/16W
OP D1
1/16W
0OHM

OP R5
OP C3
OP R2
OP C1

SPDIF_IN1
DGND

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-4


6. Schematic Diagram

6.4. MAIN-3
D+3.3V
POWER
BLUETOOTH

BD3007

0.01OHM
D+5V
AUDIO CN3002
12507WR-H06G
MGND1
CRES CENDO 2+ VC3.3V

0V
10UF 10V

0 UF 110V
U_5V
1
U_DM
2 USB_CON_D M
TP3002 C202 C203 C204 C205 C206 8 MGND2
R4016

C4003

110UF
C4004
U_DP 3 33O HM 7
USB_CON _DP A+1.35V EP_SDA BT_SDA

100N F

100N F

100N F

100N F

100N F

100N F
C201
4 VC_USB_3. 3V 6

6
5
4
R4017
DGND EP_SCL BT_SCL
5

16V

16V

16V

16V

16V

16V
ADC
33O HM 5 BT_GND
1 5 R4018

USB_DM
6 OUT
4

USB_DP
R4005 IN C4002 BT_RX 33O HM

100NF
2 110UF
0 UF 110V
0V BT_RX

100NF
10UFF 10V
GND
100OHM R4007 3

C4005
DGND BT_TX
MGND2 1/10W 3 /FLT 4 USB_EN
R3033 14,28,45,64,93,117
BT_TX 33O HM 2

C4006
EN/EN# 75OHM B5V
1/10W R4008 1

SW_ADC

10U
C3002 BT_RS T BT_RST

100NF
100NF DGND 33O HM MGND1
TPS2069CD BVR

100NF
10P F
10P F
10P F
C4007

10P F
USB_FAULT D+1.35V

R5008
1 0
IC4001

16V
CN3003

R3106

R3105
2
3

33OHM

33OHM
DGND C208 C209 C210 C211 C212 C213

1/16W

1/16W

10UF
D3005 C1020 12507W S-H08G

NC
RCLAMP0504F VC3.3V VD3.3V 10UF

100N F

100N F

100N F

100N F

100N F

100N F

100N F
C207
AGND

R3114 47KOHM
DGND AUX_R

C8004
C8003
C8005
C8006
16V

16V

16V

16V

16V

16V

16V
DGND

C122
1/16W
DGND AUX_L

C8001
C8002
ADD4
1 2 C1021 DGND
ADD5
3 4 R3007 10UF

100NF
5 6 47OHM

10KOHM 1/16W
R3102

C3003
12,23,48,58,90,116,127
ADD6

R3032 392OHM

56KOHM
7 8 1/16W

R4003
1/10W
ADD7

100NF
DGND DGND

1/16W
1 2 DGND

C3004
AGND

47KOHM
ADD8
3 4 R3008

R3115

56KOHM
1/16W
ADD9

R4004
5 6 47OHM D+3.3V VC3.3V

1/16W
ADD11 AVD3.3VS VC3.3V D+1.35V
ADD3
7 8 1/16W VC_USB_3.3V
DGND BD3004

10UF
100NF
0.01OHM D3004

C3018

C3019
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
VC3.3V

99
98
97

R3074
RB551V-30TE-17

10KO HM
10KO HM
20

R3071
R3009 BD3003 IC3009
47OHM VD3.3VPLL W25Q 16B VSSIG

USB_AGND

PAD_COMP
USB_VCCA

VDDAADC
USB_DM

PAD_RSET
VD33VDAC

VD33AADC
SYSC LK

VDAC

VS33VDAC
VS33AADC
PAD_REF
VDD

VDD

USB_DP
VD33
1/16W
DMA[2]

DMA[3]

DMA[9]
DMA[8]
DMA[7]
DMA[6]

DMA[5]
DMA[4]
DMA[11]
1 /CS 8

LINE_IN_R1

LINE_IN_R2

LINE_IN_R3
LINE_IN_L1

LINE_IN_L2

LINE_IN_L3
ADD2
1 2 C3011 100NF DGND VD3.3V SF_CS
3 4 1 96 16V
0.01OHM
BD3005 SF_DI
2 DO(IO1) VCC 7
ADD1 DMA[1] VS33PLL 3 /WP(IO2)
/HOLD(IO3)
6
5 6 2 95 SF_CK
ADD0 DMA[0] VD33PLL 4 GND CLK
5
7 8 3 94 SPDIF_IN1 SF_DO

10UF
100NF
ADD10

C3021
/FLASH_WP DI(IO0)
4
DMA[10]
TP1 SP DIF_IN
93 0.01OHM

C3020
BA1 R3010 47OHM BA1_ST
E3SB27.0000F 18E 35 0 PROTECTED

R3073
DRAS2_B VD33
1/16W

10KO HM
92

C3041
R3011 BA0_ST 5 R3045 150OHM

100N F
X3001

C3038
BA0 47OHM DRAS1_B VID_XI 1/16W
1 WRITE ENABLE
91

10NF
6 27MHZ

100KO HM
4 1

16V
R3052
1/16W DCS1 _B VID_XO Q3 Q0
7 90

1/16W
/DR_CS DCS0 _B VDD
R3012 100OHM RAS_P LL2 8 89
/RAS DRAS0_B MCLK DGND VD3.3VPLL
/CAS
R3013 100OHM CAS_P LL3 9 88 3 2 BD3006
DCAS_B VSS/VS33 R3001 Q2 Q1
Q1
DR_SCK /DR_WE
R3014 100OHM DWE_P LL1 10 DWE_B SR [05]
87 10KOHM DGND
R3015 47OHM 11 ES8680DSC 86 10KOHM

10UF
DSCK SR [07] C3014 0.01OHM
1/16W 12 85 R3002

C3025
27P F
50V

R3016 100OHM DQM_P LL0 13


VDD
IC3002 VSS/VS33
84 C3009 50V IC3006
C3062

L_UDQM C3012 27P F VC3.3V VC3.3V


1/16W 14
DQM DAC_O6R
83 100NF 16V 50V K4S281632F-TC60
VD33 VS33ADAC AGND
1 2 15 82
12PF

1 54
DATA7 DB[7] VD33ADAC
C3013 VDD VSS
DATA6
3 4 R30 03 16 81 2 53
DB[6]
MGND1 DAC_O6L 100NF DGND A+3.3V AUD3.3V DGND DATA0 DQ0 DQ15 DATA15
DATA5
5 6 47OHM 17 DB[5] DAC_O5 R
80 16V 3
VDDQ VSSQ
VSSQ
52
7 8 1/16W 18 79 BD1003 4 51
DGND DATA4 1 2 R30 04 19
DB[4] DAC_O5 L
78 AUD3.3V DATA1
5
DQ1 DQ14
50
DATA14
DATA3 DB[3] DGND DAC_O4 R DATA2 DQ2 DQ13 DATA13
3 4 47OHM 20 77 0.01OHM 6 49
DATA2 1/16W DB[2] DAC_O4 L VSSQ
VSSQ VDDQ
DATA1
5 6 21 76 7 48
DB[1] DAC_O3R AVD3.3VS DATA3 DQ3 DQ12 DATA12
DATA0
7 8 22 75 C3015 BD3009
8 47
DB[0] DAC_O3L DATA4 DQ4 DQ11 DATA11
23 74 100NF R3110 9 46

DATA8
1 2 24
VDD
DB[8]
TP1 DAC_O2R
VS33ADAC
73 16V 33OHM PWM_L-
DATA5
10
VDDQ
DQ5
VSSQ
VSSQ
DQ10
45
DATA10

10UF
AGND

100NF
3 4 R30 05 25 72 0.01OHM 11 44

C3029
C3028
DATA9 DB[9] VD33ADAC DATA6 DQ6 DQ9 DATA9
DATA10
5 6 47OHM 26 DB[10] DAC_O2L
71 R3111
PWM_L+
12
VSSQ
VSSQ VDDQ
43
7 8 1/16W 27 70 33OHM R3112 13 42
DATA11
28
DB[11]
VD33
TP1 DAC_O1R
DAC_O1L
69 33OHM R3113
PWM_R-
PWM_R+
DATA7
14
DQ7
VDD
DQ8
VSS
41
DATA8
1 2 29 68 33OHM R3108 15 40 VC3.3V
DATA12 DB[12] SR [06]
33OHM EPROM_WP L_UDQM LDQM NC
DATA13
3 4 R3006 30 DB[13] SR [32]
67 AGND /DR_WE
16
/WE UDQM
39
L_UDQM
5 6 47OHM 31 66 R3109 17 38
DATA14 1/16W DB[14] SR [15]
33OHM D_CO_ MI DATA_CRESCENDO OUT/MICOM IN /CAS /CAS CLK DR_SCK
DATA15
7 8 32 65 /RAS
18 37
SPDIF_OUT

DB[15] VSS/VS33 /RAS CKE


R3075 4.7KOHM
RESET_B

19 36
SPI_CLK
SPI_CS2
SPI_CS3

R5004 /DR_CS
SPI_DO

/CS NC 1/16W
AUX[7]
AUX[6]
AUX[5]
AUX[4]
AUX[3]

AUX[2]
AUX[1]
AUX[0]

SPI_DI

SR[10]
SR[11]
SR[12]
SR[13]
SP[21]
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
OP[5]
OP[6]
OP[7]
VD33

VD33

4.7KOHM 20 35
VDD

VDD

VC3.3V BA0 A13 A11 ADD11


DGND 21 34
BA1 A12 A9 ADD9
VC3.3V 22 33
ADD10 A10/AP A8 ADD8
23 32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64

ADD0 A0 A7 ADD7
R500 5
R500 1
R500 2
R500 6
R500 7
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

DQM_PLL0 R3058 24 31
4.7KOHM ADD1 A1 A6 ADD6
25 30
R3059 ADD2 ADD5
R3029

R3030

/DR_WE A2 A5
FRO M HDMI REPE ATER & ARC H_SP DIF
33OH M

33OH M
33OH M

26 29
10KOH M

4.7KOHM
R3101
1/16W

1/16W

1/16W

ADD3 A3 A4 ADD4
SP I_CS3

33OH M

C3016 /RAS R3060 27 28


1/16 W

1/16W

R5003

VDD VSS

10KO HM
R3023
4.7KOHM

33OHM
R3097

100NF 16V 4.7KOHM


R4002

R3053

R3054
R3084
VRP_CTR
33OH M

2.2KOHM

2.2KOHM
1/16W
1/16W

R3061

2.2KOHM
R3022 1 8 GPIO17
100O HM

OTW
R5059
R5058

4.7KOHM
1/16W

R3024 33OHM
33OH M 1/16W
1/16W A0 VCC
HM1/16W

MICOM_STR OBE/CRES CENDO ACK


DGND DGND
1/16W

MST_CAK 2 7 SPI_CS3 R3062 VC3.3V


33OH M

R3099

R3025
R3086

DATA_MICOM OUT/CRES CENDO IN 33OHM A1 WP


CST_MAK 3 6 4.7KOHM
D_MO_CI R3051
1/16W

100O HM

33OHM 1/16W A2 SCL EP_SCL


CII_RE SET
1/16W CRES CENDO_STR OBE /MICOM_ACK
4 VSS SDA
5 EP_SDA

100NF

100NF

100NF

100NF

100NF

100NF

100NF
/CAS R3063

C3030

C3031

C3033

C3035

C3036

C3039

C3043
IC3007 4.7KOHM
S-24CS02AFJ-TB-GE BA1
R3026 DGND R3065
100N F 16V

DGND 4.7KOHM
GPIO17

33OHM
SF_DO
SF_CK

EP_SCL EPROM_WP BA0


SF_DI

R3064
C121

1/16W
SPI_CS3

VC3.3V
SPI_CS2

4.7KOHM
EP_SDA 1,3,9,14,27,43,49
R3027 DGND
33OHM TO FLASH R3100 R3076 R3055
1/16W 10KOHM DGND
BT_REST DGND 1/16W SPI_CS2 BOOT STRAP(148M HZ)
BT_RST 0OHM 1/8W
1/8W * NC
BT_RX UART_RX R3017 R3077 CN3004
UART_TX 4.7KOHM
BT_TX SF_CS 12507WR-H06G
R3036 0OHM 1/8W
1/8W R3056
TV_BCK TO HDMI REPETER R3078
33OHM 1/16W 33OHM 1/10W 1
R3037 W_BCK TO WIRELES S CON MGND1
33OHM
33OH M 1/16W
1/16W SPI_CS3 2
0OHM 1/8W
1/8W SF_CK
R3079 3
SF_DI 4
R3039
33OHM
33OH M 1/16W
1/16W
TV_LRCK TO HDMI REPETER
0OHM 1/8W SF_DO 5
R3040 W_LRCK TO WIRELES S CON 6
33OHM 1/16W VC3.3V
MGND2
DGND AGND R3057 C3023
R3042 10KOHM 100N F 16V
100OHM
100OH M1/16W
1/16W
TV_DATA TO HDMI REPETER
R3043
100OHM 1/16W W_SDATA TO WIRELES S CON

DGND

6-5 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.4.1. Test Point Wave Form

TP1

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-6


6. Schematic Diagram

6.5. MAIN-4

POWER
AUDIO
GVDD+12V AR11
2CH_TI T AS5614LA AMP
ABD1 3.3OHM
1/10W
PVDD+25V
0.01O HM
AR12

AC21
3.3OHM AL1

10UF
1/10W 8.2UH

10V
SPK_FL+

AC20
100N F
50V

50V
AC17
100N F

AC16 50V
AC22

AC18

33NF
50V
10UF
10V

100N F

18OHM
AR13
AR13
1/16W
DGND

3.3OHM
AC37
100N F

AR17
1/10W
D+3.3V

50V

100N F 50V

100N F 50V

100N F 50V

100N F 50V
AC27
330P F
47KOHM

50V
50V
1/10W
AR2

AC41

AC45

AC47

AC53

AC54
AC61

AC33
AC25

2.2NF
AR1 TAS5614LADDV

10NF
1UF
50V
10UF
IC4002 DGND

50V
AC14
10UF
100OHM 1/10W

25V

25V
RST_POW ER 1 44 AC13

DGND
GVDD_AB 33NFF 50V
33N
BST_A
AR3 2 43

AC28

50V
330P F
VDD
30KO HM 1/10W

50V
BST_B
3 42

AC26

AC34
DGND

AC15
OC_ADJ
ACN2

AC42
AC62

10NF
10UF

10UF
GND
4 41
AC1 100PF
TP2

50V
25V

1UF
25V

50V
/RESE T
SMW200-H02G
50V TP1
5 GND
40

2.2NF
L(+)

AC38
100N F
INPUT_A
PWM_L+ OUT_A
6 39

50V
INPUT_B

AR14
PWM_L-

18OHM
OUT_A
7 38

3.3OHM
1/16W
AC2 100NF 16V C_START 2

AR18
MGND2

1/10W
PVDD_AB
AC3 8 DVDD 37 1
1UF 16V 9 PVDD_AB
36 AL2 MGND1
10TP1 GND
GND
PVDD_AB
35 DGND DGND 8.2UH
SPK_FL-
OUT_B
11 GND 34 L(-)

TP1 FL/FR
GND
12 GND 33 TP2
GND R(+)
AC4 13 AVDD 32 SPK_FR+
OUT_C
1UF 16V 14 31
PWM_R+ INPUT_C
PVDD_CD AL3 3
15 INPUT_D 30 8.2UH MGND2

3.3OHM
PWM_R-

AR19
PVDD_CD
100OHM 1/10W 16 29

1/10W
SD_PO WER AR5 /FAULT 2 SP_GND
OTW AR6 100OHM
100OH M 1/10W
1/10W TP1
17 /OTW
PVDD_CD
28 MGND1

18OHM
OUT_D
18 27 1

AR15

50V
1/16W
/CLIP

10UF
AC5
OUT_D

AC10
10UF
19 26

25V

25V

AC43
M1
R(-)

AC35
AR7 20 GND
25 ACN1

10NF
AC39
100N F
M2
SMW200-H03G

2.2NF
50V
GND
100OHM 21 24

50V
M3
BST_C
22 23

AC11
AC12

10UF
GVDD_CD

AC9

AC29
330P F

AC63
10UF
BST_D
333NF
3 NF 550V
0V

25V

AC46

AC48

AC56
25V

AC55
1UF
50V
50V

50V

100N F 50V

100N F 50V
100N F 50V
50V
DGND

DGND

2.2NF 50V
AC44
DGND

33NF 50V

100N F
AC64
1UF
50V
AC8
DGND

AC36
10NF
50V
GVDD+12V

AC30
330P F
AR9
3.3OHM

50V

3.3OHM
ABD2 1/10W DGND

AR20
1/10W
100N F
AC40
50V
0.01O HM DGND
AC23

100N F
10UF

AC6
50V
10V

18OHM
AR16
1/16W
AL4
8.2UH
AC24
10UF

SPK_FR-
10V

DGND

DGND PVDD+25V PVDD+25V

POWER OFF MUTE


PVDD+25V D+5V

220U F
220U F

220U F
220U F
AC49

AC52
TTR1

AC51
AC50

35V
35V

35V

35V
22KO HM
R1001 E 1/16W
R1104 47KO HM
1/16W
B
22KOHM C
Q54
1/16W 2SA1980S-Y
D101 SD_PO WER
1N4148 WS 75 E RST_POW ER TTR2
B
SBT42 47KO HM
C 1/16W
Q103 C TTR17 DGND
2SA1980S-Y Q55 B 22KO HM
22KOHM

C
1/16W
TTR19
22KOHM

B E
TTR18

R1103
1/16W

E
1/16W

12KO HM Q109 TTR25


1/16W SRC1203S 33KOHM
1/16W SPK_FL+
TTR30
SPK_FR+
C C TTC5 33KOHM
B B 47UF TTC6 1/16W
E Q57 E 6.3V 47UF TTR11
SBT42 TTC4 TTR20 6.3V
Q56 1NF 1KOHM 33KOHM
2SA1980S-Y 50V 1/16W
1/16W SPK_FL-
TTR16
DGND 33KOHM SPK_FR-
DGND 1/16W

6-7 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.5.1. Test Point Wave Form

TP1

TP2

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-8


6. Schematic Diagram

6.6. HDMI
H5V EX3.3V EP3V H3V EP1.8V H1.8V
POWER
AP7361-Y

1/16W
1/16W 240OHM 1/16W
HIC2 HD3 HBD1 HBD2
HD9
AUDIO 1 EN
2 GND
OUT
5 RB551V-30TE-17 0.01OHM 0.01OHM

HR180
0OHM
HR178
B260A-13-F

1/16W
AUX1 HR9 3 ADJ/NC 4

HC133

HC164

HC167
IN

HC125

HC129

HC169
10V
10V

10V
HC135

HC166

HC171
GCC02-0 139R

100NF

100NF

100NF
HC127
100NF

10V
10V

10UF

47UF
10UF

47UF
6.3V
6.3V

6.3V

6.3V
10V

1UF
1UF
NC
TP3

0V
0 UF 110V
*

HC142

HR179

HC118

HC120
7

10V
AAR1

100NF
6 AUX_SENS_H

110UF
5 470OHM AAR2 330OHM
1/16W
4 1/16W LOW ESR LOW ESR

75OHM
AUX_R_H
3 AUX_L_H 47UF
2 6.3V
AAR3

11

11
1 330OHM HDGND HDGND HDGND HDGND HDGND HDGND HDGND
1/16W

VT1

VT2
LOW ESR CAPACITOR SHOULD BE PLACED AS CLOSE TO PIN80, 81 AS POSSIBLE

MLVS-0603-E 08

MLVS-0603-E 08

AAC6
330P F

AAC8
AABD2 H3V

330P F
16V

AAC5

50V
100NF
100NF

50V
AAC4
0.01O HM DON'T NEED WHILE POWER OFF MODE

16V
EX3.3V PH3.3V EX3.3V AH3.3V
AH3.3 V EP1.8V
EP1.8V AH1.8V

10KOHM
AAR4

AAC10
AAR5

AAC9

NC10KOHM

1/16W
1/16W
50V
220KOHM

220KOHM

50V

HR250

HR251
330P F

330P F
1/16W

1/16W

HC122

HC162
HC136

HC138
PIN114 PIN115 SUPP ORT MAX FS

1UF

10V

10V
10V

10V

10V
47UF
10V
HC124

HC160
10UF

10UF

47UF
100NF

100NF
HBD4

HC141

HC155

HC158
6.3V

6.3V
100NF
HBD3

6.3V
100NF
HAGND HDGND 0.01OHM HBD5
0 0 PCM5.1/ AC3/DTS 96KHZ OP1 0.01OHM 0.01OHM

10KO HM * NC
OP2
AABD1 1 0 PCM7.1/ AC3/DTS/DD+/ DTS-HD/TRUE HD 192K HZ

16V
AAC2
16V
AAC1
HM3.3V

100NF

10KO HM
16V
0.01OH M
100NF

HR157
100NF

HR156
PIN 1-32 PIN 33-64

AAC3
AAC7 0 1 PCM7.1/ AC3/DTS 96KHZ

* NC
100NF OPJ ACK1
16V RFR-4112HP OPB D100
HAGND 1 1 PCM2.1/ AC3/DTS 96KHZ
MGND1 1

OPC101
VCC

16V
OP R100 OPC100
0.01O HM

10V
2

100NF

10UF
HDGNDHDGND HDGND HDGND HDGND
GND
HDGND
MGND2 3

100NF
H3V AH3.3V H1.8V AH1.8V AH1.8V

100NF

100NF

100NF

100NF

100NF

100NF

100NF
H3V

10UF
VOUT

10V
10V

10V

10V

10V

10V

10V

10V

10V
33OHM
1/10W

100NF
HDGND HDGND

100NF

100NF

10UF
10KO HM

HR151
FOR TX

10V

10V
10V

10V

HC161

HC163

HC165
* NC
0XD8/0XDA

10V
10V

10V
HC148

HC150
10V
100NF
HC116

HC117

HC119

HC123

HC143

HC144

100NF
HC126

HC128

HC137

HC139

HC152

HC156
100NF

100NF
HC132

HC134
100NF
10V
100NF
10V
IICA

10KOHM
HR152
1/16W
HD_INPORT0

OP TICAL_0_H
0XC8/0XCA
P0_5V OPEN P5V HDGND HDGND HDGND HDGND
HDGND
HD2
HCN1 HDGND
PLACE ALL DECOUPLING CAPACITORS AS CLOSE TO THE PIN AS POSSIBLE
DC1R 019JA 8 EP1.8V
HC112

RB551V-30TE-17
MGND4
10V
10UF

RP T_RS T FROM HMCU_BLK


MGND2

TO HMCU_BLK
HD7 1.8V
1 HDGND AOZ8804DI
2 HDGND PH3.3V

HR105
510O HM 1/16W
MA_SCL

HC140
3 1 10

1UF 6.3V
OUT_LINES CEC_MI MA_SDA
IN_LINES HS0_R2+ H_SP D
4 2 9 HS0_R2- HCN4 I2C_INT

HBD6
IN_LINES OUT_LINES
5 3 8 T_BCK 20043WS- H2413D HPD_A

HR106

HR107

HR108

HR109

HR112
GND

0.01OHM
GND

510O HM

510O HM

510O HM
T_DATA H5V

510O HM

510O HM
6 4 7

HMCU_XOUT

1/16W

1/16W

1/16W
1/16W
H_SPDIF_H
HS0_R1+

1/16W
IN_LINES OUT_LINES
7 5 6 T_LRCK 1 2
HS0_R1- HDGND

RP T_INT
IN_LINES OUT_LINES
OUT_LINES
8 TV_LRCK_H
3 4 H_T2+
9 5 6

IICA
TV_DATA_H HPD_A_H H_T2-
10 HDGND HD8 HDGND TV_BCK_H
7 8 I2C_INT_H H_T1+

HC130
11 9 10

REMOVE NEXT
AOZ8804DI H_T1-

50V 6.3V
H_SPDIF_H MAIN_SDA_H

2.2UF
12 11 12 TO HDMI_OUT

100N F 10V
CEC_MICO M_H MAIN_SCL_H HDGND H_T0+

0OHM
0OHM
0OHM
68OHM
13 1 10 13

1/16W
H_T0-

100PF 50V
OUT_LINES
IN_LINES HS0_R0+ 5V-1

100N F
100N F

100N F
100N F
14 2 9 14 15 EP1.8V

10V
50V
AUX_SENS_H H_TC+

10V

10V
HS0_R0-

10V
IN_LINES OUT_LINES AUX_L_H

HC121
15 3 GND 8 16 17 AUX_SE NS H_TC-
GND EP3V
16 4 IN_LINES OUT_LINES
7 HS0_RC+ AUX_R_H
18 19 HM3.3V
17 5 6 HS0_RC-
20 21

HC131

HC145
HC146

HC149
HC151

HC153
HC154
IN_LINES OUT_LINES
OUT_LINES P5V

HR232
18 22 23

2.2KOHM
OPTICAL_0_H H3V H1.8V
H1.8V AH1.8V H3V

4.7NF
HR192

HR196
HR198
HR199

10V
HDGND

100N F
1/16W
19 P0_5V
AUX_L
H5V
HDGND

HMCU_SDA
AUX_R

HMCU_SCL
10KOHM 1/16W

MGND1 H3.3V

HR165 2KOHM

HR1772KOHM
OPTI CAL_0

1/16W

1/16W
HA_GND HD_GND HBD7
47KOHM
HR18
HR16

1/16W

HR218

0.01OHM
HR217

* NC

* NC

96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
MGND3
HDGND HDGND
HVT10 HR111 0OHM

HC168

HC170
ASES 12U030R2 12
CEC_A

10V
100NF
COMR

1UF
REG_VO2
REG_VO1
MCLK

EXT_RSTB
VDD_PLL
HVT11 HR219 0OHM

AVDD18

AVDD18
VSSE
PLL_XFC_A
HDGND AH1.8V

REG_VIN
VDD18

TXC+
AVSS

AVSS

AVSS
TXC0+
TX2+

TX1+

TXC-
SPDIF

TXC0-
INTB
X_IN
HAGND

TX2-

TX1-

6.3V
IIS_SCK
IIS_WS
ASES 12U030R2 12
12
HDGND

IIS_SD0

IIS_SD1
IIS_SD2
IIS_SD3
HS0_S CL
HVT12 ASES 12U030R2 12 HR113 0OHM
HVT13 HS0_S DA HR160 0OHM 97 SDA2/SDA3
64 HBD8
HR209 0.01OHM
PVSS
ASES 12U030R2 12
12
H0_PWR5 HMCU_SDA
1KOHM HMCU_SCL HR161 0OHM 98 SCL2/SCL3 PVDD18 63 270OHM HR114
1/16W 99 62 1/16W
NC
C

HR120
HR206

VSSE SWING
*N

FROM_DSP 61 SELECTED RPT_IN TO 2ND SW


1KOHM

P0_5V 100 VDD18 DDCR_SCL


HR115 22OHM
HR11

SEL_RPT_SCL
1/16W

HQ1 HR162 0OHM 101 IIS_SCK_IN DDCT_SCL


60 0OHM 1/16W
HDGND 2S A1979S -Y TV_BCK_H DDC_S CL TO HDMI_OUT
HR163 0OHM 102 IIS_WS_IN DDC2_SCL
59 HR116 0OHM BEND_S CL
TV_LRCK_H
C

HR164 103 58 HR117 SELECTED RPT_IN TO 2ND SW


HDGND TV_DATA_H 0OHM IIS_SD_IN DDCR_SDA
0OHM SEL_RPT_SDA
HR17

104 57
B
HR12

56KOHM

VDDE DDCT_SDA
56KOHM

DDC_SDA TO HDMI_OUT
1/16W

H3V
1/16WW

105 ARC+ DDC2_SDA


56 HR118 0OHM
ARC+ BEND_S DA
1/16

HR154 106 ARC- VDDE


55
10KOHM 1/16W ARC-
107 VSSE DDC1_SCL
54

HR153

HR155
10KOHM
4.7KOHM

10KOHM
108 53

1/16W

1/16W
MCU_XIN DDC1_SDA
HMCU_XIN FROM RPT_IN TO 1ST SW
HR13

109 MCU_XOUT DDC0_SCL


52 AH1.8V
HDGND HMCU_XOUT HS0_SCL
AH3.3V SELDECTED RPT'S DDC 110 MCU_VDD DDC0_SDA
51
HPD_A_H HS0_SDA
HR166 0OHM 111 MCU_P 20
MCU_P20 VSSE
50
SEL_RPT_SCL EP92A2S4
HQ2 HR110 HR167 0OHM 112 MCU_P 21
MCU_P21 AVDD
49
SEL_RPT_SDA HIC1
C SRC1203S 10KOHM 1/16W 113 48

HR142
MCU_P22
MCU_P 22 RXC2-
B I2C_INT_H

4.7OHM
1/16W
H0_HPD 114 MCU_P 23
MCU_P23 RXC2+
47
OP 1

1N4148 WS
E
6.3V

115 MCU_P 24
MCU_P24 AVSS
46
200K OHM

OP 2

HD_OUTPORT
AH3.3V
HR19
HC11

1/16W

HD6
HR168 0OHM 116 MCU_P 25
MCU_P25 RX02-
45
HR139 TO RPT_IN & BEND H0_HPD
117 44

HR143
MCU_P 26
MCU_P26 RX02+

51OHM

HR144
47KOHM 1/16W
470NF

51OHM
1/16W
118 43

1/16W
MCU_P 27
MCU_P27 AVDD33

HCN2 H5V
121005 4K OPTION 119 VSSE RX12-
42
DC1R 019JA 8 HDGND
MGND4 HC110 120 MCU_P 10
MCU_P10 RX12+
41
HDGND RP T_RST
66.3V
. 3 V 11UF
UF 121 40

100KOHM
MCU_P 11
MCU_P11 AVDD

HR148
HDGND

HR147
HD11 HEAC- ARC- 122 MCU_P 12
MCU_P12 RX22-
39
MGND2 AOZ8804DI 38
HEAC+ ARC+ HR172 0OHM 123 MCU_P 13
MCU_P13 RX22+

4.7KOHM
1/16W
HC111 11UF
UF 66.3V
. 3V H0_PWR5
1 1 10 124 MCU_P 14
MCU_P14 AVSS
37
IN_LINES OUT_LINES
H_T2+ AS CLOSE TO EP 94A3 AS POS SIBLE HR174 0OHM 125 MCU_P 70
MCU_P70 EXT_RES
36
2 2 9 HMCU_P70
35
3 3
IN_LINES OUT_LINES
8 H_T2-
HMCU_P71
HR175 0OHM 126 MCU_P 71
MCU_P71 AVSS
HR119 HR121
4 4
GND GND
7 H_T1+ 127 MCU_P 40
MCU_P40 RX21+
34 470OHM 0OHM
IN_LINES OUT_LINES H_T1- RP T_INT 128 MCU_P41
MCU_P 41 RX21-
33 1/16W
5 5 6

MCU_RSTB
HDGND

MCU_P30
MCU_P31
MCU_P34
MCU_P35
MCU_P36
MCU_P37

MCU_P45
IN_LINES OUT_LINES
OUT_LINES

MCU_OP
50V FROM RPT_BLK

200KOHM

AVDD33

AVDD33
6

RXC0+

RXC1+
HR149

RX00+

RX10+

RX20+

RX01+

RX11+
RXC0-

RXC1-
RX00-

RX10-

RX20-

RX01-

RX11-
AVDD

AVDD

AVDD

AVDD
VSSE

AVSS

AVSS
7 30PF

1/16W
HC18
8 HMCU_XIN HDGND
HDGND
9 HDGND HDGND EX3.3V
HD12 18.432MHZ

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
10 N.C AH1.8V
4

AOZ8804DI
3

11 HR181 * NC
NC 2KOHM
10MOHM
HR140

AH3.3V
Q3

Q2

12 1 10 HDGND HDGND
1/16W

HR182
HX1

OUT_LINES *NNC
C 2KOHM
IN_LINES H_T0+
13 2 9 H_T0-
HR183 2KOHM
Q0

Q1

IN_LINES OUT_LINES
14 3 GND 8 HR124 HR184 1/16W
GND 0OHM H_TC+

HR188
15 4 7 2KOHM
1

0OHM
0OHM
0OHM

0OHM
0OHM
IN_LINES OUT_LINES H_TC- 1/16W
16 5 IN_LINES OUT_LINES
OUT_LINES
6
17 50V HDGND

HR186
HR125 30PF HDGND

0OHM
18 0OHM
19 HMCU_XOUT

HS0_RC+

HS0_R0+

HS0_R1+

HS0_R2+
HS0_RC-
HDGND HDGND HC19

HS0_R0-

HS0_R1-

HS0_R2-
HMCU_S CL
HMCU_S DA

HR195
HR197
HR191
HR193
MGND1 HDGND
ARC & XTAL
H5V MGND3
HDGND

HMCU_RS T

HMCU_OP
HPD_A_H
HVT14

BEND_S CL
TR_RE SET_OP TION

MAIN_SDA_H
ASES 12U030R2 12

MAIN_SCL_H

BEND_S DA
CEC_A
HVT15 ASES 12U030R2 12
12

HVT16 HR123 H3V


510KOHM

ASES 12U030R2 12
12 TX_P5V 0OHM H5V

TO RPT_BLK
HVT17 HM3.3V HM3.3V
1/10W

ASES 12U030R2 12
12
BAT54A

HD5 HR260
TX_P5V RB751V-40TE-17
DEBUGGING
10V
HR10

TPS2553DBVR
10UF 10V
HC180

FROM MAIN
FROM HDMI_OUT
CEC 1)5V 4.7KOHM
HD10

HIC4
30

HDGND
120K OHM
HR13 2

1/16W

HMCU_OP 2)HMCU_OP

FROM MAIN

FROM BEND
1 6 HR261
27KOHM
HR126

1/16W

IN OUT 3)DGN D 0OHM


2 GND ILIM
5 B
C

3 4 HMCU_P71 4)HMCU_P71 HMCU_RST


EN /FAULT 5)HMCU_P70
HR205

HC181

HMCU_P70 E
2KOHM
HR204
2KOHM

16V

CEC_MICO M_H
HD15

CEC_A
1N4148WS
1/16W
56KOHM

1/16 W

100NF
S
100NF

HQ4
10UF

10UF

SRC1203S
1KOHM
1/10W

HC13 16V

HC14 10V

10V

HR207
HR23 1

BSN20
1/16 W
100NF

0OHM HQ5
G
22 0NF
16V
16V

HC12

DDC_S CL HR261 HR262


HR14

DDC_S DA 15K->10K (110428) FOR CEC CURRENT HDGND


HC10
HC15

HR208 HDGND HDGND HDGND STBY_RST 1 0


0OHM HEAC+ STK7002->B SN20 FOR LOW CEC CAP.
HDGND MAIN_RST 0 1
HEAC-
HDGND
HDGND

6-9 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.6.1. Test Point Wave Form

TP3

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-10


6. Schematic Diagram

6.7. VFD
FVFD1
POWER M+3.3VV D+12VV 6-BD-02INK
FCN1

/RESET
IC(1G)

IC(2G)

IC(3G)

IC(4G)

IC(5G)

IC(6G)
IC(6G)

LGND
PGND
20047WS-H10

VDD
D3.3VV

TSA
TSB

OSC
/CS
DA

VH
CP

F+
F+
F-
F-
VFD- VFD+
1 2

11
12
13
14
15
16
17
18
19
20
21
22
2
3
5
6
7
8
9
10
D+12V VFD_DATA_V
M+3.3V
3 4 VFD_CLK_V
D3.3V
5 6 VFD_CE_V VFD- VFD+
REM_DATA1 7 8 VFD_RST_V
9 10 FC7 FC8

100NF 50V
100NF

100NF 16V
ECO_V 100NF D3.3V_1

100NF 16V
50V

FC17
100NF
50V
VP-_1

REM_DAT
VP-

50V
FC30

FC22
OS C

FC24

33KOHM
FR9 FR10

1/10W
VP-

FR8

100NF 50V

100NF 50V
10OHM 10OHM
1/10W 1/10W

FC18

FC19
V_DGND

ECO
DGND2
D3.3VV FC20

VFD_DATA
VFD_CLK
VFD_RST
VFD_CE
V_DGND V_DGND
V_DGND V_DGND FC16 1UF
FBD2 100NF 50V
50V
0.01OHM

VFD_DATA_V FR4 VFD_DATA_1


VFD_C
VFD_CLK_V
LK_V 100OHM 1/10W
1/10W V_DGND
FR5 VFD_CLK_1
100OHM 1/10W
VFD_C
VFD_CE_V
E_V FR6 VFD_CE_1
100OHM 1/10W
VFD_R
VFD_RST_V
ST_V FR7 VFD_RS T_1
VFD_RST_1
100OHM
1/10W

VT2001
FC9 FC13 FC14

MLVS-0603-E08
68PF 100NF 10UF
50V 16V 10V

FC15
FC10
FC11

100NF
16V
68PF
50V
68PF FC12
50V 100NF
16V

V_DGND
V_DGND

ECO_V
D+12VV

33OHM
R2001 1/4W
FD3

FBD1
0.01O HM
FR1 R2003 33OHM
3.9KOHM 1/4W VFD+
1/10W R2004

1SR 154- 400T E25


FR2
B260A-13-F
47OHM (+)4.73V

FD1
FC1 C 1/4W
B FC25
1NF 47UF
50V E 10KOHM
1/10W FR12 5 6 B260A-13-F
FD4 FC4 6.3V
FQ1 1O HM OPTION
OPTION 4 7 47UF 6.3V
KTC4378 FR13 VFD-
3 8
FC3 2 9 FR14 (+)2.4V
M+3.3VV 100NF 1 10 FZD1 1KOHM
50V FR16 V_DGND 10O HM 1/8W V_DGND

1SR 154- 400T E25


60
E

FD2
EYE1 V_DGND FC2 B 1OHM
1O HM FD5
Z02W2.4V-X
1/8W 1.5KOHM
346HF12A 1NF 1/4W FT1 R2002 1/10W VP-
C
FR17 50V STDCDC 1265-006B R2005
1 FQ2 FC21 B260A-13-F
REM_D ATA1 OUT KTC4378 10UF
25V
FC5
10UF
1.5KOHM
1/10W FR15
(+)23.3V
FR11 22OHM
1/10W
MGND1
25V FC26
10O HM
2 V_DGND 10UF FR3
VCC 25V 33KOHM 1/10W
47OHM 1/10W
FVD1

MGND2 FC27
FVD2

10UFF 10V

1/10W 3
MLVS-0603-E08
MLVS-0603-E08

10UF
FC28

GND 25V FC6 FZD2


10UF SDZ24VG
60 25V
10U

FD6

B260A-13-F

V_DGND V_DGND

6-11 Copyright© 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.8. USB

POWER

USB & TACT SW


USB J ACK
USB1 SCN 1
USB-23-LCP-B-ANI-30-CU1 12507WR-H 06G

MGND1 1 1 SR 1 1 MGND1 USB_5V


2 2 0OHM 2
MGND3 USB_DM
3 3 1/16W 3
USB_DP
4 4 SR 2 4
MGND2 0OHM
6
5

4
5
1/16W SW_ADC
10NF 16V
6

SC 2
SVT10

RCLAMP0 504F

16V

10UF
MGND2

100NF

SC 3
10V
ASES12U030R2

STV1
SC 1

12

0
SR 3 U_DGND SR 4 SR 5
1.2KOHM 1.5KOHM 1.8KOHM
1
2
3

U_DGND U_DGND 1/10 W 1/10 W 1/10W


U_DGND
SW1 POWER SW2 MODE SW3 VOL_UP SW4 VOL_DN
MGND1 MGND1 MGND1 MGND1
U_DGND 1 2 1 2 1 2 1 2
3 4 3 4 3 4 3 4
MGND2 MGND2 MGND2 MGND2

DHT-1187AC DHT-1187AC DHT-1187AC DHT-1187AC


U_DGND

Copyright© 1995-2012 SAMSUNG. All rights reserved. 6-12


6. Schematic Diagram

6.9. SMPS
EER3019V(6*6) LA841

2.9uH(0.8P I)

P ITCH : 10.0mm
P ITCH : 15.0mm
: CA801 [33uF/500V]
CA802 [33uF/500V]
220V : CA801 [33uF/450V]
CA802 [33uF/450V]
FLV420060 110V : CA801 [47uF/250V]
TR16 TR14 L : 6mH CA802 [47uF/250V]
L : 14mH

5 4
8 7
2 3

1 6:NC

6-13 Copyright© 1995-2012 SAMSUNG. All rights reserved.


GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site

Europe, MENA,
https://gspn1.samsungcsportal.com
CIS, Africa
E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
China, Japan
N.America, S.America https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics


Co.,Ltd.
© 2012 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea

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