1. What are the main functions of opto-electronic packaging?

• The main functions can be broken down into two categories:

1. Interconnection: Three types of connection exist: input/output signal

distribution, input/output power distribution, and some form of mechanical
interconnection.

2. Environmental Factors: Heat dissipation, as well as the housing/protection

for the electronic packaging are additional functions as well.

2. List the various levels of interconnection in electronic packaging.

• Integrated Circuit comprise of electronic circuits set on a semiconducting material

• Integrated Circuit Packages connect via thin wires of gold, copper, or aluminum
• Printed Circuit Board connect packages with photo-etched conductor traces
• Connectors form connections between circuit boards via contacts on a backplane
• A Housing (or shelf) contain the backplane and circuit board(s)
• Cabinets hold a multitude of housings (our shelves)
• Multiple cabinets connected to one another form a system
• A collection of systems creates a network

3. Make a list of the opto-electronic packaging building blocks from the first or the
smallest level to the whole communication network.

• Level 0: Integrated circuit (IC) chip/die

• Level 1: Packaged Chip
• Level 2: Printed Circuit Board
• Level 3: Card-on-board (backplane)
• Level 4: Cabinet
• Level 5: System (network)
4. What are the key driving forces on electronic packaging design and manufacture?

• Cost
• Performance
• Size
• Reliability
• Manufacturability
• Industry standards & open interfaces

5. What is a through-hole IC package? List the various types of through-hole IC packages.

• Through-hole IC packages simply have holes drilled through the PCB, allowing for
component leads to be fed through the board and ultimately soldered in place.

• Single In-line Packages (SIPs)

• Dual In-line Packages (DIPs)
• Pin Grid Arrays (PGAs)

6. What is a surface mount IC package? List the various types of surface mount packages.

• The concept of surface mount techniques are as they sound: IC components are
mounted directly onto the PCB, removing the need for holes to be drilled through the
board.

• Leadless chip carriers

1. Quad Flat No-Leads (QFNs)
• Leaded chip carriers
1. Quad Flat Packs (QFPs)
2. Small Outline Packages (SOP)
• Ball Grid Arrays (BGAs)
• Tape Automated Bonding (TAB)

7. List the different types of IC packaging technologies commonly used in industry.

Number them in order of increasing cost, “1” being the lowest cost

1. Molded plastic
2. Multilayer plastic
3. Plastic Ball Grid Array
4. Co-fired multilayer ceramic
5. CERQUAD (Ceramic Quad-pack)
6. TAB (Tape Automated Bonding)
8. List the assembly sequence of the most commonly used IC packaging technology
starting with wafer saw to a shippable device. List the approximate temperature of each
process in the assembly sequence.

• Molded plastic packaging is the most commonly used IC packaging technique. The
following sequence describes the assembly operation:

1. Wafer Saw
2. Wafer Sort
3. Die Attach
• Cured at 175°C
4. Electronic Connection Chip to Package
5. Package Seal (or Encapsulation)
• Cured at ~175°C
6. Lead Finish
7. Visual Inspection
8. Electrical Test
9. Burn In
10. Final Electrical Test
11. Final Inspection & Ready to Ship

9. What are the advantages and disadvantages of through hole versus surface mount
package in circuit board design and assembly? What has been the industry trend?

Through Hole Surface Mount

Advantages Disadvantages Advantages Disadvantages
More durable, can Requires holes in Denser packaging Difficult assembly
withstand more PCB process
mechanical stress
Use physically Finer lead pitches
larger components,
reducing component
space on boards
Mountable on both
sides of PCB

• In general, there has been an increased use in surface mount packaging within the
circuit board industry due to its ability to lower production/assembly costs, while also
increasing the number of on-board components and improved chip capability.

10. What is a hermetic IC package? Non-hermetic IC package? Give examples.

• A hermetic IC package indicates that the IC is being sealed such that it is isolated
from external factors such as gases and liquids. An example of a hermetic IC are
multilayer ceramic packages.
• Non-hermetic IC do not properly seal the IC, allowing for potential exposure to gases
and liquids. For instance, molded plastic packaging is non-hermetic.
11. What are the consequences of using epoxy or any other organic substance as a chip
attach material in a hermetic IC package.

• Using epoxies or other hermetic materials allows moisture to effect the IC package.