| PCB & ASSEMBLY
Third-generation rework station is setting
a new standard in safe processing
The successful
predecessor topped
The repair station Ersa IRIPL 650 A is the latest addition to a world
renowned and tremendously successful IR (infrared) rework platform.
This third-generation IR rework system tops its award winning and
patented predecessors by offering three new technological
innovations which are called DynamicIR, Multi True Closed Loop
Control and intelligentiRS.
Benefiting from an in
sytem was specifi
m it rework applications on heavy-mass
PCBs and large-format SMT assembles (18 x 20
inch or 460 x 60m) ina lea-ree environment
Ease of use, fe times, wadest va
riety of reivork applications and lowest
ational costs of cost of ownership, respectively
these are the user advantages ofthese I rework
systems that can now be afforded to the most de
rmanding of customers
True temperature c
ponent isthe ulti
proaches the problematic of selective reflow for
Fevetk in a completely new and unique manne
led base worldwide of
‘mote than 5,000 IR rework systems, Esa’ latest
iy designed to handle the
with its R650 (figure 1). Thesafe and proven med-
lim wavelength I heating technology allows for
lnitorm heat distribution from the top and bottom
side across the PCB and. component. Ersa’s Dy
amici technology allows forthe fuly automatic
dynamic controle the top (1400W powver and sie
frm x 120mm) andl bottom (3200W power and
size 350mm x 450mm) IR heaters depending on
the actual temperature of the component and
vwhere itis in the temperature profile, The total
avaiable poiwer to the selective reflow sytem i
Spread across four separately sitchable heating
zones on the tp and five zones onthe bottom,
Depending on boerd size, the thermal massa the
substrate and com size, the Dynamic
technology guarantees that the required
energy is deivered at
in order to ensure that the component and board
actly follow the prescribed temperature profile
Combined withthe enhanced capabilty to run an
—30 err sunore wave 20
Pune rau
50% 75% Pulsed 100% 70% Puss OFF
Su Gt ng
fa
40
ee Ton ins Ge Snel OH
Dynamic Bottom IR: 3200 W
fy, TIT
Figure 2: The principe of Dynamic It Heating
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Figure 33b: Mut True Closed Loop Control for highest process safety
extended o flat peak this technology affords the
lowest temperatire-delta across the component,
and greatly reduces PCB warpage (igure 2).
Principle of true
closed-loop control
True temperature contol onthe board ad com
ponent isa strategic advanage afforded by Ess
IR rework sjstems. True Closed Loop Control
mers that the atl component temperate
acquted, using the patented non-contact are
{ensor, an used asthe primary control med
ani forthe heating system
The socalled ntligentR allows fora more pre
cis temperature measurement by choosing rom
componenttabl ory component spect ca
bration her te Esa ora T sensor of choice
Can be chosen to dive the Dynami heating
technology, us guaranteeing a perfect profe
ime Muli True Closed Loop Control bus
‘onand enhances ths pringple by using upto fout
aditional TC sensors. BY assqning threshold
values to these addtional sensors Gee figures
3aV30), they are used to prevent the fly auto
matie Oynami heating System fom undesired
Gieeheating of adjacent or bottom ie com
ponents. fstpassyeld for rework hereby
The result of lead-free
safe heating
True temperature control an the board and cam
ponents the key to a safe lead-free process. The
higher working temperature and the smaller neo
‘ess windows will make the lead-free rework pro
cedure a much greater challenge. The risk o
‘overheating adjacent or bottomside com
ponents during rework is greatly increased, The
Dynamiclk. and Multi True Closed Loop Canto!
principles afford. the highest level of rework
safety by literaliy makingit impossible overhea
beyond an assigned threshold value, Thus, it i
Impossible to work outside a specified lad fr
fe system is broken down into four
the [RGSO seectiverfiow module (as
modules:
escrived above, the RPC reflow-process camera
‘module, the PL550 preckion-placement maul,
‘and the RSoft software module. The RPC module
Uses a high-power (up to 300x enlargement
‘motor-zoom camera, a controlable LED ting igh
ing system and an’ extremely movable
stand, The reflow process can be visualized fron
multiole angles on even the smalest of