1.
ABSTRACT:-
 IN the project report titled:
ASTABLE MULTIVIBRATOR we
have discussed how it is essential
in our day to day life {like
generate square, ramp, fsk,
Schmitt trigger, rectangular,ect
waveform application}.it also
includes hardware description of
each used hardware and working Definition:-
of circuit. The PCB designing
procedure, circuit diagram and
layout are fully outlined.
2. KEYWORDS:-
 IC 555
 Resistor
 Capacitor
3. INTRODCTION:-
 In today’s fast paced life
electronics and digital circuit play
an important role. Our project
“ASTABLE MUTIVIBRATOR USING
Ic 555 has been made in view to
achieve this. This circuit is very
much useful for generating
square, ramp, fsk, Schmitt trigger,
rectangular, ect waveform.
 There are many ASTABLE
MUTIVIBRATOR CIRCIUT available
{like using transistor} but in this
circuit one of special component
is added like resistor, capacitor,
with timer Ic 555.which width
&length of the component is
0.2cm-0.4cm and the overall
project implementation into
length {3cm-4cm} PCB. The
circuit is as simple and straight
forward so that, it can be easily
implementation.
 The ASTABLE MUTIVIBRATOR has
two states both of which are
quasi stable. It does not have a
stable state at all. Its means this
will always keep changing its
states and no need to require any
external trigger to the circuit.
 This circuit is called as an
ASTABLE MULTIVIBRATRO
OR FEER RUNNING
MULTIVIBRATOR because the
output voltage does not have
any stable state. It keeps on
changing its state from low
to high and high to low.
4. DESING:-
  The circuit as shown in fig.1
below was designed in a way to
minimize cost and also be study.
In this circuit we have used one
single sided PCB, IC NE555 which
is timer IC and resistor and
capacitor. This phenomenon is
employed here for generating the
waveform.
 The NE555 is configured as a free
running oscillation at audio
frequency. The Resistor Ra and Rb
are used to charge capacitor and
discharged through Rb resistor.
WORKING:-
Working in the ON time (t1 to t2):
Working in the ON time (0 tot1):
 At instant t=0, the voltage on the
external capacitor Vc=0. This
voltage is applied to the threshold
as well as trigger input pin (pin
nos. 6 and 2).
 As V2=0 volts which is less than
1/3 Vcc, the output of the
comparator will be high . this will
reset the SR flif-flop. Qa output
will be low and Qb will be high.
 This will turn off the internal
transistor T1. Thus at t=0, the
output voltage becomes high the
capacitor start charging through
the series combination of Ra and
Rb.
 The capacitor charging through
(Ra & Rb) continues to takes place
upto t=t1.the output voltage
remains high during this time. The
ON time is called as capacitor
charging time Tc.
 As soon as Vc=2/3Vcc at t=t1,the
upper comparator output will
become high and it will set the RS
flip-flop.
 The Qa output of the flip-flop will
go high which will turn on the
transistor T1 and the Qb output
will go low which will bring the
output voltage to a low state. The
capacitor starts dis-charging
through Rb and T1.this period is
5. CRICUIT DIAGRAM:-
also called as the dis-charge time
of the capacitor.
 At instant t=t2, the capacitor
voltage Vc is equal to the 1/3Vcc.
As it tries to go slightly below
1/3Vcc, the lower capacitor will
reset the SR flip-flop to make the
output high and the operation
repeats itself.
6. COMPONENT DETAILS:
COMPONENT QUANTITY
  IC’s 555 1  PCB designing is the most
 Resistors 2 important and requires great care
Ra: during work. In this case great
Rb: care must be taken while the
 Capacitor 2 tracing the circuit or layout on the
C1: board .because once PCB is
C2: designed, it is a virtually
 wire 1 impossible to alter it. While
designing a circuit
 Designer a should take care to
avoid crossing of conducting path
7. IMPLEMANTATION:-
(tracks) as possible. Crossovers
 A printed circuit board (P.C.B) can are unavoidable then only of
be defined as an insulating base jumper can be used .a circuit
material to which permanently board carrying copper on both
attached a flat metallic network side can also help to solve this
of conducting paths whose problem when circuit is
dimension depend upon the complicated .some rule designing
current that can be handled by are listed below:
them. The P.C.B may be either  The space between the
single sided or doubled sided .The conductors must be strictly
P.C.B used for this project is controlled to avoid possibility of
single sided one. We have used electrical discharge or unwonted
copper clad PCB for this project. A capacitance. The by which the
PCB is found in every electronic master diagram is to reduce in
device. If you have electronic the size thus a critical design
components in a device, they are feature.
mounted on a PCB, big or small.  The minimum width of copper
Besides keeping the components should not generally be less than
in place, its purpose of a PCB is to about 1.5mm. This is related
provide electrical connection mechanical strength rather
between the components electrical properties and it also
mounted on it. ensures that strips remains
securely bounded to the base
BOARD DESIGN:- material.
 The point where the component
hole for component lead wire
 occurs must be sited to suit the possibility of common impedance
dimension between lead-out arising in earth returned. This can
wire, so that, the component can be totally eliminated by making
be situated correctly on finished
all earth as substantial as possible
board. The conductor is also men
large at the point of holes. consistent with nature if design.
8. PCB making:- In case of
simple need and requirement of
less number of PCB, it is
economical and advisable to use
the following lab method of PCB
making.

 Making Layout
 Cleaning of PCB
 Etching
 Drilling
 Soldering

The above steps are discussed as  Other factors that have to

follows:
1. Making layout:-
 This is not particularly difficult.
There are several important
factors that need to be taken into
account. We must also ensure
that conductors and components
carrying high frequency current
are well separated from these
parts of the circuit. We are also to
make sure that all components
need to return to earth are
properly connected and that
successfully studied include
availability of adequate return
points on board and it’s mounting
from accessibility of switch
connections made for mechanical
fixing ventilation effects of
vibration.
2. Cleaning of board:-
 The copper side of the board
must be thoroughly cleaned
before circuit plan is transferred
to it. This is very important
because even slightest trace of
 graze (from figure of instance)
will impure the etching process
and when the circuit plan has
been neatly transferred to copper
in this manner the board is held
under, running tap and the
allowed to dry before resist is
applied.
3. Transforming the plan:-
 Now, once cleaning is done, plan
has to transfer on copper surface
of PCB materials. A convenient
way to do this is simply put a
carbon paper between a copper
surface of the board and working
plan and carefully trace the lines
of original plan with a ball pen.
4. Resist:-
 Resist is nothing more than a
substrate that is unaffected by
presence etching chemicals. It is
usually colored so that, it can be
easily seen that copper surface.
When plan is clearly worked on
clean copper that are to be left in
fact as the copper conductors
must be covered when resists the
leaguer type of paints possess
good resist properties dis-
advantages of relatively long time
.It is essential to resist through
hardening etching is started. Nail
polished are better as quickly and
are less difficult to remove. To
some this drying effects and to
achieve the sharp of the trace on
PCB, now-a-days
 Etching taps with IC pads are
commonly used. To this,
processes of short circulating due
to paints are completely avoided.
Etching tapes and pads are
available in different sizes.
5. Correcting Errors:-
 When a result has been
thoroughly hardened any factors
that have been made can usually
be corrected urgently scratching
away with knife. To ensure out
lines round edges of copper
conductors on board the resist
must be applied with steady
band.
6. Etching:-
 Text comes etching of unwanted
copper and either a small single is
all that is required a quantity of
board to be produce certain
precautions must be taken before
operation is commenced the
 most used etch ant I ferric
chloride and to this is added small
quantity of HCL to accelerate but
not as lab construction is
concerned. Mixing 10 grams of
ferric chloride and 25 grams of
HCL with 5 grams of water can
produce a good etchant.
7. Agitation;-
 Small plastic bath is ideal for
storing the etchant process. The
Depth of liquid must be sufficient
to completely cover laminate, the
laminated board carrying the
resist pattern circuit is then
dropped into etchant bath and
the gentle agitation takes 5 to 20
minutes to complete depending
on the strength of the enchant
temperature and thickness of
copper foil.
8. Finishing Off:-
 When all unwanted copper is
dissolved from areas between
conductors, board should be
taken from an etchant and
washed in water. The resist must
be removed using proper solvent.
After this the copper surface must
be polished with any kind of
cleaner. It should be seen that
there is no slight incomplete
etching between the conducting
paths of the PCB. The PCB’s are
coated materials itself is a soldier.
This process is called tinning. This
process of coating involves tracks
with soldier. Advantages of
Tinning are less effect of
environment of conductors.
9. Drilling:-
 After the PCB is etched and
cleaned next step is drilling of
PCB. Drilling of PCB means to
drilled holes for filling and
mounting the components on
PCB. The holes are drilled with
suitable drill bit depending upon
component lead dimension.
Generally used drill bit is 0.5mm.
10. Soldering:-
 Soldering is the joining together
of two metals to give physical
bonding and good electrical
conductivity. It is used primarily
in electrical and electronic
circuitry.
 Solder is a combination of metals,
which are solid at normal room
 temperature and becomes liquid  In most soldering iron tips, base
at between 180 and 200 degrees metal is copper or some copper
Celsius. Soldering is accomplished alloys because of its excellent
by quickly heating the metals thermal conductivity. For proper
parts to be joined, and then soldering the tip of soldering iron
applying a flux and a solder to the must be cleaned.
mating surfaces.
 The finished solder joint  The right way to solder is as
metallurgic ally bonds the parts – shown below: diagram
forming excellent electrical
connections between wires and a
strong mechanical joint between
the metal parts.
 Heat is supplied with a soldering
iron or other means. The flux is a
chemical cleaner which prepare
the hot surface for the molten
soldier.
 The solder is a low melting point
alloy of non ferrous metals.
Solder is a metal or metallic alloy
used, when melted, to join
metallic surfaces together.
 The most common alloy is
combination of tin and lead
.Certain tin lead alloys have a
lower melting point than parent
metals by themselves.
 The soldering iron tip transfer  Thus to make proper soldering,
thermal energy from the heater following procedure must be
to the solder connection. followed:
 1. All parts must be clean and free and observed waveform of
from dirt and grease.
astable multivibrator which
2. “Tin” the iron tip with a small
amount of solder. Do this generate square wave with
immediately, with a new tips using any external triggering
being used for the first time. pulse. Also various steps for
3. Clean the tip of the hot soldering
iron on a damp sponge. PCB designing are
4. Heat all parts of the joint with the successfully studied. The
iron for under a second or so. designed circuit was
5. Continue heating, and then apply
sufficient solder only, to form an practically tested.
adequate joint.
6. Remove and return the iron
safely to its stand.
7. It only takes two or three second 10. REFERENDES:-
at most, to solder the average
PCB joint.  Analog & digital IC –design
8. Do not move parts until the & application=J.S Katre
solder has cooled. {Tech-max publication }
 Printed circuit board design &
technology =Bossart {TATA
McGraw hill publication }
 www.circuittoday.com
 www.google.com
 www.projectinfo.co.in

9. CONCLUSION:-

 Thus we have done the

designing and fabrication of
PCB for implementation of
analog circuit named as
ASTABLE MULTIVIBRATOR