10-16-2003 12:12PM FROM SMART SONIC CORP, 1481846107909 TECHNICAL ARTICLE =y Does Ultrasonic Cleaning of PCBs’ Cause Component Problems: An Appraisal By B.P. Richards, P. Burton and PK. Footner, GEC-Hirst Research Center, Middlesex, England Abstract ‘An investigation ofthe use of ultrasonic agit: tion for cleaning printed circuit boards vsing CFC-based solvens has shown that under standard conditions required 10 produce clean assemblies, no damage will occur tothe compo- ‘ents studied, Damage can ony be induced by use of anomalously longer times oF higher power densities. fn all cases in which damage has been induced, it is of a purely mechanical ature ve t0 fatigue, and st located on the device bond-wites and/or the package legs. ‘Cleaning using CFC-bated solvents under stan ard vittasonie conditions of power density and fume etc. is veadily achieved within 2 minutes ‘even with a minimum standoff heights, The pre liminary results obtained” using aqueous and semiraqueous solvents support the apparently benign nature ofthe ultrasonic agitation in cause ‘ng component damage. 4.0 Introduction thas long been recognized that effective clean ing of printed circuit boards (PCBS) presents major problem. especially with the advent of surface mount technology (SMT) and more complex package types. One of the most effec: love means of cleaning PCBS. especially under components where excess fax and flax residues ae held by capillary action, is 10 subject them to wlrasonic agitation. and its use has been sup- ‘ported [1.2} for many years. Indeed, the 1eeh- rique is used routialy in many market sectors, However. in the past. it has been suggested that the ultrasonic process might give rise 1 ice versble damage in the devices and soldered joins, and/or to long term reliability problems, ‘The two major effects 10 the components them selves were expected tobe breaking of internal ‘bond wires asa result of foreed vibration (pos: sibly exacerbated by resonance effects deter- ‘mined by lead length and ultrasonic requ), fod fatigue fractures of the legs or soldered js. (On these grounds the use of this technique the military context has been efectively prohi- (PG Technical Review / June 1990 ited 3.4]. These worries appear 10 have been based on eazly work (5.8) in which the data were obtained using. now obsolete ultrasonic ‘equipment operation at 25 KH, and on devices And boards of old technologies Ginelding ger ‘manium (ansstors). Since those eatly papers, there has been a dramatic improvement ia the Situation, with the introduction of improved bonding technologies, a general change 10 ai- minum bond wires, a much lighter distribution ofboth bond strengths and quality of joins, and replacement of ultrasonic cleaners with new ‘equipment operating t about 40 KHz. However apparently adverse reports have appeared (9.10) relatively rece. On the othar hand, extensive evalastions of fled components at vhe Hirst Research Cente Dave ot povided any unamigour dan op. portieg the notion that sensibly used ulirasonic {giao cases component problems. However, they have shown thats would highligh compe seat quality problems (eg. by enlarging pre existing mler-racks in passive component each untaustairy bonds). The idence in the erature is both Scan and ambiguous. So the question o be addressed was clear, "Does lrasonicagitsion damage component?” ‘in an auempt to assess the curtent situation therefore, a program as been catia out 10 busin data rlatng to poeta depraction of the device andor the sidered jit. The pro- om concerted in two complimentary ops: {he ienifcaion of any piyseal damage lea ing to device mathnctioncesuling (fom expo- sure to uasnis (the major topic) and the efficiency of cleaning using vltasone teh- niques (ihe secondary objective). The purpose OF this paper is 10 report Brey the rest of the investigation 2.0 Objectives ‘The program has comprised two tasks. The fist which has now been estentlly compleed ‘was wo explore the effect of ulrasomie agitation using CEC solvents, since these are extensively Ths paper nas ongialy resend by De Richards. ‘Manager of he Maerls fond Components Ass: rent Laboratory athe GEC Hire Reearch Con lee, daring the IBC Bed Armas Mecieg in Boson this year10-16-2003 12 3PM FROM SMART SONIC CORP. TECHNICAL ARTICLE ‘sed inthe indsty atthe present ime. The second ask com> rised a sudy of the use of aqueous and semiaqueovs 20+ ‘ens (likely CFC replacements for some applications). In both (asks the main aims were 3 follows: (4) to identify the type of matte of any damage induced ina chosen range of components by ultrasonic agitation sing (CEC based solvents (©) to asets the damage in those components and determine the effects of exponite time abd power densiy on the ‘secumulation of damage, (6) to assess the regimes of safe ultrasonic operation consistent with adequate cleaning, 3.0 Task Investigation 3.1. Equipment and Components Used ‘The full program schedule has been described elewbere 0.111. However inorder to reduce ensbly the "cleaning matrix” and fo provide useful dua in an acceptable timescale ‘number of decisions were made atthe outset: (0 concentrate on obtaining data relaing to any compo- rent damage. and 91 on aspects of cleaning: to use state-of the-art equipment which is currently used in the indsty i 0 use ooly One Frequency ie, 38 KHz which i indy Mandan) and estemively used: lower fequencies are Known 10 eavse cavitation damage more readily. and hence ate rarely wed. and higher frequencies (eg (00 AH) are seidom ased for cleaning operations “ iv) to use a ange of components iypical of that uted in the industry, mou vo aempt to identify those tht might be ‘most proné to Jamage on the Bass of unproven hypothe- (7) t0-use only oe representative CFC solver: (Le. Arkbone [AM), since the primary topic wat the study of damage ‘ccumulation and not axpects of cleaning. was expected ‘thatthe acoustic properties of CFC solvents would show Tie watson form each ote ‘Wah the fll cooperation ofthe suppliers. two different ulra- sonic cleaning unis have ben used. both operating at 38 Ke: 50 ICI Cleanline 2 (ype R2BI8UV2B. and a Kerry KS 431 tank witha class D river nit with variable power ouput Both are ste-of-he-t machines typical of those used in he microelectronics industry. The ICI machine operated at 3 mean output electrical power density of about 11 wattle stile the Kerty machine was capable of operation over a range ‘of power densities wih 4 maximum of 32 wate. Package ‘component ispet wd ih this investigation were: (Cs in DIL packages. th panic sod ceramic in large and seal sizes SOICs: PLCC: pin god arrays: SOT-23 diodes: SM LEDS: ‘hip resor and capacitors: and TO-18 packages translators, +#81846107909, P15, ‘Alten components used were from batches qualifies 1 eter MIL or commercial standards. Examinations were carrie out ‘on examples ofthe as-received component o ensure that he ‘ualty ofthe components was consistent with thei purchase ‘specifleations and tht any failures would not be due w ques onable quality.The componeris were stressed in three was. 138 appropnae: (9) mourted on west boards designed and fabricated 1 accom rmodae range of representative leaded and SM compo. ‘ens active ad pasive). The archcctre of this board was designed tallow self diagnosis, mounted on boards 19 give large numbers ofthe same device type on a particular board, “ (iid Yoose in a basket in the ulieasonic wank, in order 10 increase markedly the sess and, thecefoe, damage fora [iven exposure, and hence gather more information about the type of damage and its suisial distribution 3.2 Assessment Techniques Employed Astesament of the damage accumulation was mace sing ‘essentially electnical techniques and the slf.diagnosing test board (11.12). The nature and (ype of the damage ant 1s everation were established using a range of analytical and Imiroxcopical techniques a9 appropriate. Tn order 0 a5es5 the tifect of uiatoni agitation on weakening boad srengths. and hence onthe possibilty of compromising future Tie ie, the strengis of many (5000) bonds have been measured The Individual wirebond stengihe were measured using 2 spe- cially designed snd bu bond-wire puller (a modification of 3 GEC Menitcrograph wetting balance solerabiliy teste) which provided not only the ulimate failure strength, but 250 2 complete stress-strain curve for every bond studied. In ad tion in order to explore the possiblity thatthe ukrasonic3gi+ tation may have been inducing incipient damage that would hve manifested itself in Later life teasing to poor field perfor. mance. aceclerated testing was undertaken. Many devices ‘were baked at 150°C for 124 hous, fllowing 10 hous exper sure at high power desis For leaning studies, glass slides moveted ono special fu teat board with imerdigiatedparerns were usd allowing bor Surface conductivity and visual inspection to determine the degree of cleanliness. Moreover, following removal of the ‘hls, analytes! measurements ofthe cleanliness of both he sides and the coresponding areas on the board were under {akan wing Fourier iransform infrared (FTIR) and X-ray pho tecton spectroscopic (XPS) techniques 4.0. Task + Results and Discussion 1 became clear at un early stage of the investigation that present day components are robust and dificult 19 damage ‘sing vitatonic cleaning techniques under aormally acceptable capovure times and power densities (2 few minucs a 10-11 ‘earslire). In order 10 sigoifcanly sens the component10-16-2003 12:14PM FROM SMART SONIC CORP. 1481846107929 P16 TECHNICAL ARTICLE uch of the work has been undertaken ‘using power densities (op 1 32 watsfive) ‘nd times (greta than 100 hours) conde ‘erably in excess of hose sormally used for effective cleaning of PCBS. The reltion- Ship between power demsity 20d damage rate has also been investigated. 4.1 Individual Component Types 4.4.1 10-10 Transistors These devies were steed bth seed vo eveut boards an ying oo io wire age, for petiods vp 10 100 hours and power dendhes up © 32 watsfie. The ‘esl claly demonstrated that ever with igh power deny longterm exposure as requied o damage tee component For example, a soemal power density exposure (11 waive) has nt proved oe cause damage in TO-18 tans + afer continuous exposure for 27 hour. However, damage could be induced te shorer prods a tgh power desis, ray] Faloc Foam vosanow Wah pow doa Sed Figwe | shows the comaaive lure AT! Melee io ° {ecenage for bth mowed nd fos TO A contns of the frst te pois (For owe component) Te rancnors pled agains exposure ine. The curve forthe from Figure 1 pled om the assumption that hey repeat 3 looe devices consis of thre eparnte portions central lie gopultion conning # out ofthe 100 ranstors. Groep 8 ‘ar rgion bounded by wo cured regions. Iwas suspected Htewse cons of the next 15 failures and represents the tha these regions comprised separate populations of fires cena portion of Figure 1. The other 77 devices, group C. fed an amp wat mado separ them. In Figure 2. gp comprise third csribuion tn which > faire had ocurred afer Tour. nd 29 further fares up 10 100 hows Cie she time to 3 falter vas greater than 100 hours). The datibuions A aod B he on reasonably sight lines, the A population ening of tasstor bods whch ae he xin (9 Break with 3 mean life of abet TTS hours. and che B astibution being more robust with 2 mean life of about 25 Tours. However. the maorty of he devices (7H) hae avery lng fe font 2 bavng fled at 70 hours, and o more a 100 ours). impbying a men if fo this dt ‘aon of greater ta 1000 nous. Ina cas, examination of the fed bond wits confirmed that fase had occured, EB expered the heel of the bod do © ‘mechanical aig. The ses of the fae tere a either the wir-bond vo pad cn (Gee Figate 3. oF athe wire serminal pos iia. ‘a 3 % 0 » 2 g 5 : i 3 5 8 ues ssscesd Cumulative failure percentage &. e Fieare Pre of Once mort Righ poner denne 1 tame sand ”