Professional Documents
Culture Documents
ITI provides an internship training for students to get to know about their knowledge, about their
subject practically and individually. They also teaching and training in different department like
Transmission Defence Production (TDP)
Moulding
1. Company profile
2. About departments
2.7 GPON
2.8 Moulding
3. Conclusion
4. Reference
1. Company Profile
ITI limited is an Indian Telephone Industry limited is public sector undertaking of country which
was established in 1948. From small beginning, it was grown into a mammoth multiunit
enterprise with manufacturing units at Dooravaninagar and electronic city in Bangalore in
Karnataka.
In 1964 the company started manufacturing of cross bar automatic exchange and get started in
Noini and Srinagar of J and K. Later company started plants in the Raebareilly in UP, Palkkad in
Kerala and Manakapur.
The company has sales network and service officer comprising regional officers located at
Bangalore, Mumbai, Kolkata, Delhi, Lucknow, Chennai, and no of sub officers under each
region, to represent company in every significant town in line with business strategy. The entire
activities of company are now re-organized as independent business group with manufacturing
facility at Bangalore, Manakapur and Pallakad.
The company has R&D infrastructure attached to the independent business group. Then main
R&D Division are at Bangalore and Noini. Forward looking at technology. The R and D is
engaged in continuous development and absorption of technology.
The company lays a strong emphasis on quality which taken as corporate management function
under in independent execution director. A large no of company products are covered under the
self-certification scheme by majors customer i.e., department of telecommunication,
International quality management system. The company has adopted ISO 9000, taking it as a
Tool for organization change and work redesign.
Human resource development is another thrust in company involving professional and
organizational development activities.
The company products range includes all that is required to equip National and International
telecommunication network, Satellite with simple telephone to state to the art digital
switching,satellite communication and optical communication.
95% of company product are supplied to department of telecommunication now as BSNL, other
significant customers of company are Defence and Railways, for even few special turkey
projects has also been executed.
Highlights:
ITI is telecom pioneer in India since 1948 contributor of more than 70% of Indian telecom
network. World’s 9th largest telecommunication company.
US $400 million company.
High impact turkey specialist for total telecom and IT solutions
An ISO 9000 company with compony with store of art manufacturing facilities.
Customer Profile:
Post Offices
ISRO (Indian Space Research Organization
TASK PERFORMED
CHAPTER 1
ITI mainly manufactures defence products that are used for communication purpose.
Communication devices must be rigid, resistance or withstand to all kind of environment,
temperature and pressure.
2. Simplex communication:
Type of communication in which information is send only in one direction through channel.
They can draw power from their own battery of telephone exchange.
4. 5C telephone:
There are 4 operating modes,
I .Magneto mode : To provide point to point communication.
IV. Line man short : Four LED condition are provided which gives information about the
in ring, out ring, line man short and battery low.
A 4.5 battery is provided and it can work under 2.8 volt condition.
When voltage fall below 2.5 volt, the low charge LED glows.
It is used in bunkers.
I. Power
II. Ringing
I. DTMF mode
I. I - Intercom
II. X - Exchange
III. F - Reset
IV. R - Radial
When phones are in exchange, that time out source person holds with music.
When we press any digit there is a beep sound in machine which confirms the DTMF is
working properly.
If we select the digit, the row and column frequency will be displayed on the display
screen.
There are different frequencies for different dial number.
The study or use of system computers for storing, retrieving and sending information.
Information technology is the use of any computers, storage, networking and other physical
devices infrastructure and processes to create, process, store, secure and exchange all forms of
electronic data. It is considered to be subset of information and communication technology. It is
the oldest technology of information.
Anything that render data, information or perceived knowledge is any visual format via any
multimedia distribution mechanism, is considered part of the domain space is called information
technology.IT professionals performs variety of function that range from installing application to
designing computer network and information data bases. A few of the duties that IT perform may
include data management, networking, engineering computer hardware, data bases and software
design as well as management and distribution of entire system.
In earlier days we use assembly level language, but now we use high level languages. A high
level language can easily understand by programmer, but machine have to decode this languages.
Storage
Speed
Safety
Improved accuracy
Faster processing
Graphic software
Electronic fund transfer
Online banking
Social media
Online business
Security
Self-learning
Image processing
Increased functionality:
Computerised accounting systems have also improved the functionality of accounting
department by increasing the timeliness of accounting information. By improving the timeliness
of financial information, accountant can be prepare report and operational analysis that give
management an accurate picture of current operation.
Storage:
Before inventing modern storage devices, the storage devices were very big in size and consume
more area, but now we have SD cards that can store up to 2 to 256 GB.
Speed:
Now a day’s speed internet is in Gbps and before when speed was too low, it was measured in
kbps.
Safety:
The use of internet is safe. No other users can interference in between.
Improves accuracy:
Most computerised accounting system has internal checks and balance measures to ensure that
all transaction is properly balanced.
Faster processing:
Most computerised accounting system allow users to process large amount of financial
information shortening the time period of aids companies in cost central, which improves
overall company efficiency. Using IT, the time consumed will reduces and provide fast process.
Graphic software:
Graphic can be prepared by using graphic software. Graphic can be printed on the papers pr
displayed on slides, transparencies and photos.
Online banking:
Online banking is possible through internet. There is no need to go banks to do transaction. We
can use through net banking via smartphones, computers etc.
Social media:
it has made to possible to connect people around the around. It helpful to seek information it is
possible through some social applications like Twitter, Facebook, Whatsapp, telegram etc.
Self-learning:
We can get to know the information just by using Google or other search port. We can access
information that we need officially.
Image processing:
Creating, storing and updating papers from document take time. In addition it is costly to process
and store document. Fortunately, these costs can be eliminated with the help of document
imaging system.
Security:
Because of IT, the information is stored and secured in clouds.
Motherboard chipset
Embedded processor
Graphic processor
3. Microsoft windows:
It is a group of several graphical operating system families. All of which core device developed
is marketed and sold by Microsoft.
Windows family includes windows MS, windows 1.0 to 2.0, windows 3.0 to 3.1, windows 95,
windows 98, windows me, windows NT 31, windows 2000, windows XP, windows vista,
windows 7, windows 8, windows 8.1, windows 10.
The important difference between DOS and windows OS are, windows have GUI i.e. graphical
user interface. GUI is more users friendly and can be understand by any version of OS.
4. Linux:
Linux is an open free service OS, I is compatible with any device and any OS. There are
different version of Linux,
Red hot
Fedora
Cent
Open SUSE
Mandriva
Ubuntu etc
CHAPTER 3
The interconnection via the internet of computing devices embedded in everyday objects,
enabling them to send and receive.
The internet of things is the new of physical devices, vehicles, home appliances and other items
with electronics, software, sensors, actuator and connectivity which enables these things to
connect and exchange data, creating opportunities for more direct integration of the physical
world into computer based system, resulting in efficiency improvements, economic benefits and
reduced human excursion.
IOT verticals:
Smart environment
Lighting
Waste management
Parking management
Energy health
Intelligent transport system
E-governance
Smart education
Smart agriculture
SCADA solution in waste gas and electricity
RFID based solution
Smart industry etc.
Weather information
E- tolling
Congestion management
Emergency response
Intersection safety
E-challan system
3-D printing:
Smart education:
Video conferencing
IRIS connect
Smart environment:
Testing IOT we can identify the following:
Soil pollution
Air pollution
Ocean pollution
Smart parking:
Guidance
Reporting
Alerting
Asset management
Access control
Payment
Product tracking
SCADA solution in water gas: They streamline and integrate our dispersed assets access the gas
wall pad, pipeline and terminal, market from measurement to host system.
CHAPTER 4
Mechanical testing
Chemical lab of ITI consists of various equipment’s for studying any raw material and analyzing
it. The raw materials which are going to use in manufacturing and fabrication process are
examined in this lab. All the impurities are checked for various tests, we need various
equipment’s they are as follows,
e) PH meter:
Chemical substances have their own pH level which decides whether the solution is acidic or
basic with its pH value.
f) Titration method:
To check upon the chemical response we do titration where small-small amount of one chemical
is added to another and their response is checked, the amount is controlled using titration pipe.
There are 2 types of titration are present those are, Acid based titration and Oxidation based
titration.
Three main analysis are carried out as,
i. Volumetric Analysis: In this amount of chemical added will affected the response and will be
responsible for chemical changes depending upon the volume of chemical added. This is
commonly used in qualitative analysis.
ii. Polymetric Analysis: the working of polymers depends upon their both physical and
chemical characteristics. This polymetric analysis helps to keep data of polymers working
efficiency.
iii. Gravimetric Analysis: The mass of any substance or compound in material decides its
performance. Hence the performance of material can be prejudge depending upon its using
gravimetric analysis.
2. Electrical Lab:
The components used for PCB are firstly go through various tests to check their ability to
withstand critical conditions they are as follows,
(a) Micro meter:
(b) Precision LCR Meter:
These are the instruments used to determine the Inductance, Resistance, Capacitance.
3. Mechanical Lab
Mechanical components which are part of manufacturing plants design are first tested for their
physical characteristics by using various methods as follows, these various methods are carried
out using various machines as,
Universal testing machine: This machine checks overall physical characteristics of given metal
such as, tensileness, elongation, compression, bending capacity of the materials.
Brinell Hardness tester: It Checks how hard is the raw material by applying load.
Hot air Oven: Telephonic connecting are usually made underground where temperature
effect on wire, whether they can withstand any climate changes, maxi
temperature=3000C (99 days testing will continue)
.
Drill machine: Hand Operated drilling machines is use to make hole in sheet or metal
plate. Hole size can be controlled using drill bits manually. Drill bit is actually a rotating
cutting tool. The drill bit is pressed against the work piece to make hole.
ASTM Stamp Machine: This machine created the dumbbell shape sheet by punch
pressing on normal sheet. This is also hand pressing machine. If we want to decrease
thickness then it can be done using filling.
All Cut Machine: It cuts all type of sheets also handled manually. But sheet thickness is
limited to 5mm only.
Bending Machine: To bend any sheet or metal road manually we use this machine.
Weighing Machine: Small sheets can be weighed in this machine weighing limits goes
from 5mg to 200g.
Solder Bath Machine: Solder metal used for Soldering is should be tested first to cross
check its conductivity. The purity of solder affects conductivity hence is solder bath test
all these things must be calculated for final use.
CHAPTER 5
2.5 Surface Mounting Technology (SMT)
In PCB manufacturing section we produce only bare boards which consists of holes and
routes. After that, for mounting purpose we differentiate into two categories as, Surface
Mounting (which can not be done manually without machine) and another one is through
hole component mounting (Where we put components on PCB manually and solder to
their connecting legs).
Process Chart:
2. Automatic Solder Paste Printer (Model SERIO 4000/EKRA): Automatic solder paste
printer designed to apply solder paste using a device called ‘Stencil’. The solder paste is mainly
composed of Tin & Silver. This paste is smeared on the parts of bare PCB where we are going to
implant the components.
4. Automatic Pick and Place Machine (model NXT-8 + XPF-W FUJI): After completing the
inspection of the solder paste the board is passed to the Automatic pick and place unit. Each
component is picked from the packaging using either a vaccume or gripper nozzle, checked by
the vision system and placed on the PCB which is previously programmed. Typically the pick &
place machine place 49,600 components per hour.
6. SMT Reflow Oven (model SOLTEC XPM 3m-1240/ Vitronics): This unit provide the
mechanical strength to the components that are implemented on the board. In this step the board
consisting of components is passed to the different temperature zones, which are maintained
different temperatures. Typically board is passed from low temperature zone to high temperature
zone, and it is followed by cooling zone. In this paste is heated to melt and to that some other
materials are added to provide the strength to the components later it is cooled.
7. PCB Unloader: This is the last unit in manufacturing the PCB. Through this unit we are going
to get the complete PCB.
8. X-Ray Inspection (model XTY-160/Nikon): This is an optional unit in manufacturing the
PCB, through which we can detect whether ther is bridging between the holes in BGM
components.
CHAPTER 6
It deals with a lot of experimentation as well, where the professionals try to develop something
totally new, or significantly improve already existing technologies.
Sub departments of R&D
1. Power supply
2. Reliability testing lab
3. PCB section
Regulated: it provides a constant output voltage, independent of the output current and power
supply is regulated (varied).
Unregulated: it provides certain voltage at a particular current, fixed power supply.
The main aim of this supply is to provide the required level of DC power to the load.
The DC power supply uses an AC supply as the input.
Different applications require different levels of attributes voltages.
Nowadays the DC power supplies provide an accurate output voltage
This voltage is regulated by an electronic circuitry
So that it provides a constant output voltage over a wide range of output loads.
Input transformer
The input transformer is used to convert the incoming line voltage down to the required
level of the power supply
Here we are using a step-down transformer it has capacity to step down 400V to 48V
Rectifiers
The rectifier used to convert the incoming signal from an AC format to raw DC/pulsating
DC
Different types of rectifiers available are Half wave rectifier, full wave rectifier, and
bridge rectifier
Filter capacitor
The pulsated DC from the rectifier is fed to the smoothing capacitor
It will remove the unwanted ripples in the pulsated DC, so they use large value
capacitors
Voltage regulator
A linear regulator has an active (BJT or MOSFET) pass device (series or shunt)
controlled by a high gain differential amplifier
In this lab we will check the component whether it is reliable to work in different
environment condition
Inside the chamber they create partial atmosphere like cold, hot, dry, temperature variant
conditions
This can be done through control monitor system where we can control the chamber
climate
This testing is compulsory for all the devices to check their reliability
Cold and Dry chamber: this is done to check whether the device withstand in too cold
or at too dry condition, consider example
Size: 40*30*25 (L*B*H) cm
Volume: 30Ltrs
Temperature range: -70c to 150c
Climatic chamber
Size: 58*80*68 cm
Volume: 300Ltrs
Temp range: -50c to 125c
Humidity range: 20% to 95% RH (Reliable humidity)
Dust chamber
Size: 100*100*100
Temp range: up to 60c
3. PCB SECTION:
PCB stands for Printed Circuit Board. A printed circuit board mechanically supports &
electrically connects electronic component or electrical component using conductive track, pads
sheet layer of a non-conductive substrate.
PCB require additional design effort to layout the circuit but manufacturing & assembly can be
automated .specialized CAD software can be fabricated at the work of layout.
PCB can be single-sided (one copper layer)
Multi-layer (outer & inner layer of copper, alternating with layers of substrate)
1. Plated through hole: the PCB layouts are printed on the board and it drills the holes to place
the component on PCB at required and accurate place.
5. Developing: In this process film is removed at the required places & board is developed for
further plating.
6. Copper and tin plating: the copper & tin are plated on the PCB. The copper is plated on 35
micron & tin is deposited on PCB board.
8. Etching: the PCB board is placed in acid solution to remove unwanted copper & tin material,
only the required path is retained.
10. Solder masking: this process is done in HAM machine, photosensitive film is used in this
process.
11. Expose & developing: the masked solder is exposed from required places & the card is
developed.
12. Solder coating: the PCB is passed through hot air level process at a temperature round 300c.
13. Trim to final stage: the unwanted portion is removed from PCB, the PCB is cut & shaped in
exact size & shape. The V grave cutting machine is used for thin process.
14. Bare board testing: the error faults in PCB are tested and detected.
8. Black oxide
12. Deshmear
1. Auto saving machine: It is used for cutting raw sheets in required size
2. Jump scoring machine: It uses an sheet cut & copies it onto the raw material sheets
3. Hot air oven: The PCB contain pressure and hot air in blown oven
5. High speed CNC micro drilling machine: The drilling is done at 400rpm, PCB is completely
auto drilled, six drilling probes are present in a single machine. Hence the boards are drilled at
same time.
7. Dry film developing system: Inner layer is exposed in their machine yellow light is used
because of the board photo sensitivity.
8. Pressing machine: Heating and cooling is done temperature at -190c and 250 PSI pressure, it
depends on thickness and size of the board.
CHAPTER 7
2.7 GPON SECTION
GPON stands for gigabyte passive optical network deals with tripple play(data, voice, video)
transmission over optical network. It is a telecommunication technology used to provide fiber to
end costumer both domestic and commercial. A GPON is distinguishing feature is that it
implement a point to multiple point architecture, in which the upward optical splitter are used to
enable a single optical fiber. To serve multiple end points the end points often individual
customer. we can connect external equipment such as phones, personal computers and WIFI to
GPON system. It has two power supply system. In GPON machine 12 fans are places for cooling
the system. there are two traces since each trace has 6 fans. In GPON we count two telephone
high speed internet which involves uploading speed of internet is upto 2.8gbps, while the serving
speed of internet is upto 2.5gbps.
GPON consists of two important network transmission in telephone they are
OLT(optical line termination)
Features of OLT:
In GPON ther are total 24 chard slots and two traces. Each trace handles 14 slots in which
two are SCM cards and 12 are QPIC cards.
SCM stands for switch control module and the QPIC for quad pin interface card.
SCM is a main card on system. It has all the controls between 14 slots.
Two slots are allocated to SCM cards and remaining 12 cards are allocated to QPIC
cards.
There are total 4 slots allocated to SCM cards and each SCM card carries or support 32
subscribers at a time.
There are 8 port for SCM if any 4 is fallen then the card from remaining extra slot
automatically takes charge.
Around 6000 users can be connect at a time for 2.5gbps serving speed.
In a GPON machine 48 ports are available, each ports can carry 32 OLT’s hence there are
total 1536 ONT’s can be connected.
For the breakdown voltage zener diode is used to aware facility of network like village
gram panchayats, malls and appartments.
The GPON technology is made under the C Dot standards. The communication can be done very
nicely upto 20kms through a optical fibre cabel. The splitters are connected to split the single
network for many subscriber. Therefore many subscribers can connect at a time.
The driver behind the modern passive optical network core are highly reliablility, low cost and
passive functionality. Single mode passive optical component includes branching devices such as
WDM isolaters, circulators etc.
CHAPTER 8
2.8 MOULDING
Here Moulding is divided into two main blocks those are Injection Moulding and Central
Machine Shop. Let us elaborate each of the types in briefly.
1. Injection Moulding:
For Moulding purpose, we use thermoplastic material. Thermoplastic materials are as follows,
Acrylic
Butadiene
Nylon
PC (Poly Carbon)
PS (Poly Sterile)
For military purpose we use high impact grade forest green ABS. It is green in color and hardest
to prevent military communication equipment’s from breaking. They can sustain themselves
even if any vehicle passes from over it.
There are various models of military telephones as,
I. 5C: It weighs 2.4kg and operates in four different modes as magneto mode, battery
mode, line mode, antenna mode.
III. Field auto telephone: It is used for general communication by military officers. They
cannot be used on fields or on base camps of version 1.28.
IV. NUTAN: It is special edition of telephone which gives end to end privacy for user
and maintains complete secrecy hence ITI has provide all VIP’s of India a NUTAN
telephone.
Moulding specification:
we use thermoplastic material for Moulding hence we need to melt the material. The melting
process starts with pre-heating. For different materials, temperature varies.
Pre-heating Standards: PC material = 1200 C
ABS material = 800 C
Pre-heating is done for 1-2 hours.
Moulding machine consists of two main sections those are,
Core Section
Cavity Section.
Pressure applied to mould containg molten material limits the weight of product that is for
specific Moulding machine the weight to be applied is fixed hence the product specifications are
also fixed. They are given as follows,
150 tons = 165 gm
II. Press Break Machine: This break punched sheets and folds them into compact boxes as cage
for electronic devices. This costs around 1.5crore.
III. Power Press machine: This machine applies approximately 30 tons of pressure on sheet for
folding and Pressure can be adjusted according to alignment required that is 60 0 or 900 etc.
3. CONCLUSION
It was an esteemed privilege for us to undergo in-plant training in ITI Bangalore, the first public
sector organizations in India under telecom sector, which has contributed up to 70% of the
present national telecom network as a pioneering venture in the field of telecommunications.
Network Management Systems, Secure communication, Encryption and Networking Solutions
for Internet Connectivity are some of the major initiatives taken by the company. ITI mainly do
the manufacturing of telephone and related equipments for communication and for defence
purposes. A demonstration of various telephones and multiplexing equipments in defence area
was given to us. As the budding engineers, it was really a great experience for us, to feel and
experience the manufacturing, testing, fabrication of various telephones and related equipments
for communication including switching equipments.
4. REFERENCE
1) www.itiltd-india.com
3) www.googlesearch.com
5) www.wikipidea.com