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MINIATURE INTERFACE
CONNECTOR COMPLIANT
Mini USB (AXJ4)
WITH USB 2.0/ON-THE-GO CONNECTORS
FEATURES APPLICATIONS
1. Compliant with USB 2.0-OTG 1. DSC, PMP, DVC, IC recorders
(Transmission speed: 480 Mbps) 2. Mobile phones, PDA, smart phones
2. 7.7 mm deep space-saving size 3. Compact PC peripherals (e.g.
Since the depth is 7.7 mm, the occupied external HDD, memory card readers)
space is approx. 4. Game machines
15% smaller than competing standard
connectors (depth: approx 9.0 mm).
3. Reinforced fixing strength between
the body and shell
The high strength allows for the forcible
Compliance with RoHS Directive insertion of a plug.
ORDERING INFORMATION
Interface connectors
AXJ 4 1 1 1 0 G
4: Mini USB connectors
<Receptacle>
1: 5 contacts receptacle
(Compliant with the Mini USB standard)
<Composition>
3: Mini B right angle type
6: Mini AB right angle type
<Mounting type>
1: Standard, with suction tape
<Terminal and Retention fitting>
1: Terminal portion: SMD,
Retention fitting portion: SMD,
Positioning bosses: Provided
<Flange shape>
0: Without flange
<Package>
G: Embossed tape packaging
PRODUCT TYPES
Packing quantity
Positioning
Type Terminal shape Flange Part number Inner carton
bosses Outer carton
(Embossed)
Mini B
5 contacts receptacle AXJ413110G
Right angle type Terminal position: SMD
(Compliant with the Provided Without flange 1,200 6,000
Mini AB Clips (retention fitting): SMD
Mini USB standard) AXJ416110G
Right angle type
Interface connectors
Cord length: 100mm Fix the cord end.
EIA-364-27
Acceleration: 294m/s2(30G)
Discontinuity: Max. 1µs
Duration: 11 ms,
Impact resistance Contact resistance: Max. 50mΩ
Application directions: 6 surfaces (X, Y, and Z directions)
Appearance: No abnormality
Number of applications: 3 times respectively (Total: 18 times)
Cord length: 100mm Fix the cord end.
250 hours
Contact resistance: Max. 50mΩ
Heat resistance Withstand voltage: 100V AC dielectric breakdown must not EIA-364-17
(mated) occur during a one-minute application. Temperature: 85±2°C
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
96 hours
Contact resistance: Max. 50mΩ
Environmental Low temperature Withstand voltage: 100V AC dielectric breakdown must not
characteristics Temperature: –55±2°C
resistance (mated) occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
7 cycles
Contact resistance: Max. 50mΩ
Humidity resistance Withstand voltage: 100V AC dielectric breakdown must not
EIA-364-31 Method III
(mated) occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
10 cycles
Sequence
Contact resistance: Max. 50mΩ
1. –55±3°C, 30 minutes
Temperature cycle test Withstand voltage: 100V AC dielectric breakdown must not
2. ~, Max. 5 minutes
(mated) occur during a one-minute application.
3. 85±2°C, 30 minutes
Insulation resistance: Min. 100MΩ
4. ~, Max. 5 minutes
Appearance: No abnormality
Bath temperature: 35±2°C
48 hours
Saltwater spray Saltwater concentration: 5±1%
Contact resistance: Max. 100mΩ
resistance (mated) Wash the connector with water at room temperature after the
Appearance: No abnormality
test, and then dry it at room temperature.
96 hours Temperature :40±2°C
Hydrogen sulfide Contact resistance: Max. 100mΩ Humidity: 75 to 80%
Appearance: No abnormality Gas concentration: 3±1ppm
Soldering Reflow soldering Peak temperature: Max. 260°C
temperature 300±10°C: Max. 5 s
resistance Manual soldering
350±10°C: Max. 3 s
2.7±0.1
0.8±0.05
3.70
0.4±0.05 2.0±0.1
7.70
2.5±0.1
1.40±0.1
7.50±0.1
7.5±0.1
2.90
5.3±0.1
4×1.20
7.70
9.90
1.00±0.1
PC board edge
4.4±0.05
8.9±0.1
0.07
Terminal No.1 6.90 Terminal No.5
4.40
3.10
3.95
3.95
Including the projection of the spring
in the shell contact section
5.95
0.80
0.80 dia.
4.40
5.87
Interface connectors
2.7±0.1
0.8±0.05
0.4±0.05 2.0±0.1
3.70
2.5±0.1
7.70
1.40±0.1
7.50±0.1
7.5±0.1
2.90
5.3±0.1
4×1.20
7.70
1.00±0.1
9.90
PC board edge
4.4±0.05
8.9±0.1
4.40
3.10
3.95
3.95
5.95
0.80
0.80 dia.
4.40
5.32
2.0
Embossed carrier tape
380 dia.
Embossed mounting-hole
12.0
1.5 dia.
Interface connectors
cream solder printing. 8. This connector has metal shell for
• Screen thickness of 0.15mm is preventing EMI, when designing an
recommended for cream solder printing. enclosure the followings should be
• When applying different thickness of considered. Guide for plug entrance
screen, please consult us. should be arranged in order to prevent
• Depending upon size of connector, self distorted insertions. Provide a cover
alignments may not be expected. to reinforce the metal shell portions of
Please pay attention to align terminals the receptacle.
and soldered pads. 9. We recommend the use of a
• The following diagram shows the purified-water-based solution for
recommended reflow soldering cleaning the PC board. If you use an
temperature profile. alcohol-based solution, the surface of
Temperature
the molded part may be whitened. In
Max. 260°C
Maximum temperature addition, please carefully monitor the
200°C contamination degree of the solution
Pre-heating
150 to 175°C to prevent the solution from re-
60 to 120 second
Max. 70 sec
contaminating the connector
Time
contacts.
10. Others
• The temperature measured on the PC To prevent insulation deterioration of PC
board surface near connector terminals. board after soldering, please avoid
• After reflow soldering, in case of PC adhesion coating agent to terminals in
board surface the reverse side using case of coating.
reflow soldering, for example an adhesive
and so on connector of fixed disposition. For other details, please verify with
3) Rework of soldering portion the product specification sheets.
• Rework is one time.
• In case of soldering rework of bridges.
Please use a flat-head soldering iron and
don’t use supplementary solder flux.
• Please use the soldering iron under
specification’s temperature