Classification Notes • No.

7 21
December 2004

Prepara'tion'111nd pre-cleaning

AJ)pl~ wafer 'was,b'able · Apply pCisl-emul,siliable· Apply. .solvent removilbJe

penetrant and a llow contact penetr:ant and allqw contact penet rant and all(!W contact
time (inin. 25 minute). time (mln. 25 minute). time (l.nio. :Z.S minute.).

W1lter and solvenf' Wafer WllS'1 Apply solvent reniove:r

Water spray rinse .Apply lipopbiUc

emulslfier-ana allow
contac:'t lime.

Apply hydrop.hilic
emulsifier. an.d :allow
contact time.

Allow to ·dry

Water wash Water wash

Excess peoettarit remover check

Dry

At>ply water soluble developer Apply water susp endable dhcloper

I Apply dry developer Allow to dry

Oevelopme11t

Cleaning

Figure4-l
Main stages of penet.rant testing

DH NORSKE VERIT AS