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Proton +1
electron -1
Neutron 0
2. Number of protons in the nucleus of an atom.
3. Number of protons and the number of neutrons in an atom.
4. 168O = 8 protons and 8 neutrons
12
6C = 6 protons and 6 neutrons
5. Isotopes are atoms of the same element having same number of protons but different number
of neutrons. 12 C has 6 neutrons, 13 C has 7 neutrons and 14 C has 8 neutrons.
6. Orbit : The path of an electron around the nucleus of an atom.
Orbital : The wave function of an electron in atom, indicating the electrons’ probable location.
7.
8. Hund’s Rule ; Electrons will fill a set of degenerate by keeping their spins parallel.
9.
10. 1st I.E. of an element is defined as the energy change for the conversion of 1 mol of gaseous
atoms into gaseous ions.
11. 2nd I.E. is the energy needed to convert the +1 charged ion into a +2 charged ion.
12. Group 3
13. A. atomic Radius B. shielding effect C. nuclear charge D. electron pairing
14. And( both period 2 and the 3 SC to Zn are discussed)
15.
Talking through the next 17 atoms one at a time would take ages.
We can do it much more neatly by explaining the main trends in
these periods, and then accounting for the exceptions to these
trends.
The first thing to realise is that the patterns in the two periods are
identical - the difference being that the ionisation energies in period
3 are all lower than those in period 2.
Explaining the general trend across periods 2 and 3
In period 3, the trend is exactly the same. This time, all the
electrons being removed are in the third level and are screened by
the 1s22s22p6 electrons. They all have the same sort of
environment, but there is an increasing nuclear charge.
Ionic bonding
resulting in
Notice that when sodium loses its one valence electron it gets smaller in size, while
chlorine grows larger when it gains an additional valence electron. This is typical of the
relative sizes of ions to atoms. Positive ions tend to be smaller than their parent atoms
while negative ions tend to be larger than their parent. After the reaction takes place, the
charged Na+and Cl- ions are held together by electrostatic forces, thus forming an ionic
bond.
19. Covalent bonding; a chemical bond formed by the sharing of one or more pairs of electrons.
Hydrogen
Hydrogen atoms only need two electrons in their outer level to reach the noble
gas structure of helium. Once again, the covalent bond holds the two atoms
together because the pair of electrons is attracted to both nuclei.
20. Hydrogen Bonding: A strong dipole-dipole force that occurs among molecules in which hydrogen
is bonded to nitrogen, fluorine or oxygen.
Ammonia
In a molecule of ammonia, nitrogen, an electronegative atom is bonded to three hydrogen atoms. The nitrogen
atom forms a negative site of the molecule whereas each of three H-atoms acquires a partial positive charge.
The ammonia molecules are associated by H-bonds as shown below:
Electrostatic bonding
Electrostatic bonding (also known as anodic or field assisted bonding) was first reported in
1969 having been developed and patented by P R Mallory and Co Inc (for which reason it is
sometimes known as Mallory bonding).
The technique is used to join glass to metals and semiconductors at temperatures well
below the softening point of the glass. The components to be joined are polished to a
smooth, flat surface finish (e.g. 50µm rms) then heated to a temperature below the
softening point of the materials, but sufficiently high for ionic conduction to occur (200-
600°C for glass). A d.c. voltage is applied across the components such that the metal (or
semiconductor) is at a positive potential with respect to the glass. The voltage applied can
vary from a few hundred volts to three thousand volts, for bonding times of 10 seconds to
several hours.
A bond is formed as a result of the joint interfaces being brought into intimate contact by
the electrostatic forces generated by ion migration in the glass. No external pressure is
applied other than that required to hold the components in contact.
A reasonable match of thermal expansion coefficients is desirable to avoid strain in the joint,
but joints between unmatched glass/metal combinations have been made successfully when
the metal is in the form of thin foil or film.
Current status
Electrostatic bonding is a technique primarily used for joining glass to silicon for pressure
transducer fabrication and solar cell encapsulation. However, it has also been investigated
for the joining of glass windows in FeNiCo alloy opto-electronic packages. Use of the process
is therefore limited and specialised. A brief description of these applications together with
the reasons for electrostatic bonding being chosen as the most suitable joining process are
given below.