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Small rectangular patch antenna tively longer than the length of the conventional patch.

The
dimensions of each patch antenna are chosen after a series of
K.M. Luk, R. Chair and K.F. Lee extensive measurements, and are close to the m i n i " resonant
frequency for each type of folded patch.
A novel folded rectangular patch antenna is designed and
measured. Compared with a conventional patch antenna with the
same surface area, the resonant frequencyis reduced by 37%. The
cross-polarisationlevel is -20dB. - 6

5
Zntroduction: Microstrip patch antennas have the attractive fea-
$ 4
tures of low profile and light weight, and can be made conformal .-e
to mounting structures. In the low microwave frequency range, 8 3
however, their sizes may be too large for practical applications.
Several techniques have been proposed to reduce the size of the 2
conventional half-wave patch. One approach uses expensive and 1
heavy high dielectric constant material [l]. Another approach uses n
either a shorting wall [2] or a shorting pin [3]. A shorting wall "1.4 1.6 1.8 2.0 2.2 2.4
leads to the quarter-wave patch while a shorting pin near the feed frequency, GHz mB
can reduce the patch size even further. However, in both cases, the Fig. 3 Measuved gain
cross-polarisation level is quite high. In this Letter, a novel small
folded patch antenna is proposed. The antenna is simple in struc- -configuration 1
ture and has low cross-polarisation. Compared to a conventional configuration 2
patch antenna with the same surface area, the resonant frequency
is reduced substantially. 0' 0'

top view

side view
180' 180'
a b
a b C plane
Fig. 4 Folded-patch configuration 1 radiation pattern
a E-plane
I W I di I I I hz 1 I1 I 12 i W i I W 2 I w3 I W4 1 W5 I Wg b H-plane
L
31 I 51 I 2 0 1
d2
15 I
hi
2 I 3 I 1 5 I 2 3 I 3 0 111 51 9.51 5 I 1 5 I 11 -co-polarisation
(unit:") cross-polarisation
10dB/div
Fig. 1 Structure ofpatches and antenna
O0 '
0
W = 31mm, L = 51mm, d, = 20mm, d, = 15"
h , = 2mm, h, = 3mm, w 1= 9.5mm, w, = 5mm
1, = 10mm, l2 = 15mm, l3 = 15mm, l4 = 23"

180' 180'
a b
Fig. 5 Folded-patch configuration 2 radiation pattern
a E-plane
b H-plane
1 C I -co-polarisation
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 cross-polarisation
frequency, GHz a 10dBidiv
Fig. 2 S WR against frequency
(i) single layer patch;& = 2.65GHz; B W = 1.23% Measurements: An HP8510C network analyser and a compact
(ii) folded-patch configuration 1;fo = 2.1GHz; BW = 2.03% range with an HP85301C antenna measurement system was used
(iii) folded-patch configuration 2;f0 = 1.66GHz; BW = 3.16%
to measure the S W R and the radiation pattern of each antenna,
respectively. As shown in Fig. 2, the resonant frequency of the
Antenna structure: The geometries of the antennas are shown in rectangular patch antenna is decreased when the patch is folded.
Fig. 1. Fig. l a presents a conventional patch antenna with length The resonant frequency for the conventional rectangular patch is
L = 51mm and W = 3 1mm. This antenna excited in TMIomode is 2.65GHz. Folded-patch configuration 1 has a resonant frequency
used as a reference. Fig. lb shows a folded patch antenna, desig- of 2.1 GHz (20.75% decrease) while the folded-patch configuration
nated as folded-patch configuration 1, which is made of a copper 2 has a resonant frequency of 1.66GHz (37.26% decrease). The
sheet of length 85.5" and width 31mm, while Fig. IC shows a gains of the two configurations are 6.1 and 5.8dBi, respectively
second folded patch antenna, designated as folded-patch configu- (Fig. 3). The thickness of the antenna (Smm), in units of substrate
ration 2, which is made of a copper sheet of length 111mm and wavelength, is -0.056 at 2.1GHz and 0.044 at 1.66GHz. The
width 31". The antennas are fed by coaxial feeds. Although all radiation pattems of the folded-patch configurations have been
the three antennas have the same length in the top view, it is measured at 2.1 and 1.66GHz, respectively. As shown in Figs. 4
found that the resonant lengths of the folded patches are effec- and 5, the co-polarisation pattems have maxima in the broadside
2366 ELECTRONICS LETTERS 10th December 1998 Vol. 34 No. 25
direction. The cross-polarisation maximum is --20dB below the measured at a positive gate bias V , = 0.25V. A large energy band
co-polarisation maximum. This is significantly lower than that for discontinuity in the AlGaNiGaN heterostructure, strong piezoelec-
a shorted quarter-wave patch or patch with shorting pin. tric effect and a large electron effective mass resulted in a turn-on
voltage for the gate current as high as +2.2V (see [l]).
Discussion: Two novel designs for small rectangular patch anten- , . , ‘ I . I . , . ,

nas have been presented. The resonant frequencies of both folded- 140
patch configuration 1 and folded-patch configuration 2 were 200
T2
found to be decreased compared to the the resonant frequency of - 120
the conventional patch. This is because the effect of folding the . E
patches is an increase in the physical length of the patch. Refer- E150 - IOl)$
E . E
ence to Fig. 2 shows that the bandwidth (SWR = 2) is 2.03% for B -
folded-patch configuration 1, 3.16% for folded-patch configura- E - 80 $
tion 2, and 1.23% for conventional patch. It was found that when
i
E100 - -
m
+-
the height of each layer is increased, the bandwidth of the antenna L
3 60 iz
c
increases but the resonant frequency also increases slightly. Com-
pared to the patch with a shorting wall or shorting pin, the folding m
K
.-
% 50 - - 40
sc
designs result in considerably lower cross-polarisation. .
- 20
0 IEE 1998 20 November 1998 0 -
Electronics Letters Online No: 19981643 - 0
K.M. Luk and R. Chair (Department of Electronic Engineering, City -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0
University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong) gate bias, V L@!?l
K.F. Lee (Department of Electrical Engineering, University of Missouri Fig. 1 Transfer characteristics of two Al, *,Ga, ,5N-GaN HFETs (TI
Columbia, Engineering Building West, Columbia, Missouri 6521I , USA) and T2) used in digital circuit shown in Fig. 2
source-drain current calculated using following fitting parame-
References ters for T1 and T2, respectively: output conductances 0.013 and 0.01
V-I; mobility 0.15m2/Vs; sheet electron density 7.3 X and 9.8 X
1 LO, T.K.:
‘Miniature aperture-coupled microstrip antenna of very 1015m-Z; source and drain resistance 5 Q saturation velocity 1.1 X lo5
high permittivity’, Electron. Lett., 1997, 33, pp. 9-10 and 1.5 x 105m/s; knee voltage parameters 5 and 1.9; distance to
buffer layer charge 30nm; threshold voltages -0.6 and -1.13V; gate
2 PINHAS, s , and SHTRIKMAN, s.: ‘Comparison between computed and length 2 p
measured bandwidth of quarter-wave microstrip radiators’, ZEEE
Trans., 1988, AP-36, (ll), pp. 1615-1616
3 WATERHOUSE, R.B.: ‘Small microstrip patch antenna’, Electron.
Lett., 1995, 31, pp. 604605 The devices exhibited a very low gate leakage, a sharp pinch-off
and very high breakdown voltage. The gate leakage current in a
4 5 p wide HFET was 200pA at a reverse gate bias of -1V and
remained unchanged up to V , = -10V. For comparison, the maxi-
mum drain current in this device was -6.5mA at V , +2.0V. Thus,
the on-to-off ratio of this device was of the order of 108.
Low-thresholdAIGaN-GaN heterostructure To increase the breakdown voltage, we fabricated HFETs with
field effect transistors for digital applications offset gate design [3]. The breakdown voltage was measured in
4 5 p wide devices with a source-drain spacing of 5 p , gate
R. Gaska, J. D e n g a n d M.S. Shur length of 2 p , and source-to-gate and gate-to-drain distances of
0.5 and 2 S p , respectively. The irreversible breakdown of the
The fabricationof an AlGaN-GaN based digital inverter circuit is devices at a gate bias V, = -1 V occurred at a source-drain voltage
reported, in which a large gain (up to 180) and a noise margin of V, = 330V. The estimated average electric breakdown field is -1.3
-0.W have been obtained. The measured temperature coefficient x 106V/cm.This breakdown field is higher than the previously
of the switching voltage of the inverter was -3SmVi”C up to reported record value of 1.1 x 1O6Vicm[4] and is close to the max-
90°C. The simulations predict that such an inverter should imum breakdown field estimated in [3].
operate up to -230°C.
6
AlGaN-GaN heterostructure field effect transistors (HFETs) have
demonstrated an extremely low gate leakage current and exhibited 5
drain current saturation at positive gate bias as high as +6V [l].
The low values of the gate leakage point out to the potential
applications of AlGaN-GaN HFETs in high temperature digital 4
circuits such as, for example, the direct coupled field effect transis- >
tor logic (DCFL) family. Such circuits operate on a single power 93
supply and, thus, require switching transistors with a positive (or >”
small negative) threshold voltage. The first AlGaN-GaN based
digital circuit was demonstrated by Khan et al. [2]. 2
In this Letter, we report the performance of AlGaN-GaN
HFET-based inverter at elevated temperatures. 1
The low-threshold AI,, zsGa,7,N-GaN HFETS were grown on
sapphire substrates using low-pressure MOCVD [3]. We minimised
the threshold voltage of the devices by growing nominally 0 1 ’
0
’ I
1
. ’
2
* ’
3
. 4
1 1

undoped epilayer structures and by depositing a very thin (-lOnm Vi”, v jozlizi
thick) AlGaN barrier with a 25% aluminum molar fraction. This Fig. 2 Characteristics of inverter
allowed us to fabricate HFETs with -75-80% depleted channel
even at zero gate bias (see T1 in Fig. 1). The electron mobility in Based on switching (Tl) and load (T2) AlGaN-GaN HFETs with
threshold voltages of -0.5V and -1.0V and GaN Schottky barrier
these heterostructures was 840cm2Ns and 3000cmZiVs at room diode (D) with turn-on voltage of 1V connected in series with HFET
temperature and at 77K, respectively. The sheet electron density gate for level shifting
was -5 x l O ’ * ~ m and
- ~ did not change with temperature. As seen Inset: schematic diagram of digital circuit
from Fig. 1, the maximum source-drain current of these low-
threshold devices was -130mAimm, which is almost an order of
magnitude lower than in our high power HFETs with doped chan- We used these the low-threshold HFETs to realise a GaN-based
nel design [l]. The maximum transconductance was 125mSimm digital circuit. Fig. 2 shows the measured characteristics of the
ELECTRONICS LETTERS 10th December 1998 Vol. 34 No. 25 2367

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