THE BOMBAY SALESIAN SOCIETY’S

DON BOSCO INSTITUTE OF TECHNOLOGY

(ENGINEERING COLLEGE)

PREMIERE AUTOMOBILES ROAD,KURLA(W), MUMBAI-70

Project Report on

“Electronic Jam”

Submitted by

Jovin Miranda TE EXTC – 42

Ravi Naval TE EXTC – 50

Nijo Mathew TE EXTC – 40

Guided by

Ms. Madhavi.S.Pednekar
This Report has been prepared in partial fulfillment of

THE THIRD YEAR ELECTRONICS AND TELECOMMUNICATION ENGINEERING

[Semester V Syllabus] for

ELECTRONIC HARDWARE WORKSHOP

as prescribed by

THE UNIVERSITY OF MUMBAI

2010-2011
 CERTIFICATE

This is to certify that Mr.____________________________________

has successfully completed his/her Project Work on the Topic
“ELECTRONIC JAM” in the subject of Electronic Hardware
Workshop, in the partial fulfillment of Engineering in the department of
Electronics and Telecommunication Engineering of the University of
Mumbai during the year 2010-2011.

(Internal Examiner) (External

Examiner)
Abstract:
Electronic jams are one of the most common devices used
especially in quiz completions. However, to work with this system, it
requires low power consumption and hence we can use it as a handy
device.

Having low cost and yet having a quick response time is really a
boon. It’s basically a device having high noise immunity with a wide
supply range, however still being ultra sensitive. Even in the voting
booth’s such kind of device could be useful.

We have taken Electronic Jam for its use in quiz show and to
make Quiz shows priority less.
 ACKNOWLEDGEMENT

Written words have unfortunate tendency to degenerate genuine

gratitude into a formality. However it is the only way to record one’s feelings
permanently.

We were bestowed the golden opportunity to conduct our Project

on “Electronic Jam”,
Jam and hence take this opportunity to express my heartfelt
thanks to all those who have been associated with my project.

We express my heartfelt gratitude to Prof. Madhavi Pednekar,

Pednekar for
providing us with endless support and encouragement in all our
endeavors at every movement during our project. We would like to place on
record the constant encouragement, support and guidance that we received
from her in abundance. Her valuable advice helped us tremendously in
improving the quality of our dissertation.

We are also greatly thankful to Mrs. Pratibha Dumane,

Dumane for her extended
support, generous guidance and co-operation throughout our project.

We would also like to thank our principal Mr. N.G. Joag and the
management of “Don Bosco Institute of Technology”
Technology for providing their
cooperation for completing the work in time

Last but not the least; we acknowledge all our fellow students for
their co-operation and collaboration.
 Introduction:
• Electronic Jam Is Commonly Used In Quiz Contests.

• Fastest Finger First Is The Basic Principle.

• It Adds Beauty To Active Quiz Shows Contains Many Buzzer Rounds.

It also 8 Inputs can be handled at a Time.

• It uses Seven Segment Display instead of LED/bulb for visual interface.

• Basically this Electronic Jam is built with the view of making

The Game Show Priority less.
Block diagram

Explanation

In this diagram as we see there are 8 switches which act as input to

IC 74373. Now IC 74373 has got 8 D –Flip Flops which are used to
latch the input. Also, IC 74147 is an 8:3 Encoder and is used for
encoding. It converts 8 lines input to 3 lines output. Now this 3 line
output is connected to IC 7404 which is a NOT gate. This gate is
used to convert low signal to high signal. Now it is given to IC 7447
which is known as the driver IC. This is used to drive the 7-Segment
Display.

Also the output of IC 74373 is given to IC 7430 which is an 8 input

NAND gate. We know that for a NAND gate if any input is low, the
output is high. After this it is given to a 2 input NAND gate and given
to the buzzer via help of a p-n-p transistor. Whenever any of the
switches is pressed, the buzzer sound is heard.

Circuit diagram
Explanation

This jam circuit can be used in quiz contests wherein any

participant who presses his button (switch) before the other
contestants, gets the first chance to answer a question. The circuit
given here permits up to eight contestants with each one allotted a
distinct number (1 to 8). The display will show the number of the
contestant pressing his button before the others. Simultaneously, a
buzzer will also sound. Both, the display as well as the buzzer have to
be reset manually using a common reset switch. Initially, when reset
switch S9 is momentarily pressed and released, all outputs of
74LS373 (IC1) transparent latch go ‘high’ since all the input data lines
are returned to Vcc via resistors R1 through R8. All eight outputs of
IC1 are connected to inputs of priority encoder 74LS147 (IC2) as well
as 8-input NAND gate 74LS30 (IC3).
The output of IC3 thus becomes logic 0 which, after inversion by
NAND gate N2, is applied to latch-enable pin 11 of IC1. With all input
pins of IC2 being logic 1, its BCD output is 0000, which is applied to
7- segment decoder/driver 74LS47 (IC6) after inversion by hex
inverter gates inside 74LS04 (IC5). Thus, on reset the display shows
0. When any one of the push-to-on switches—S1 through S8—is
pressed, the corresponding output line of IC1 is latched at logic 0
level and the display indicates the number associated with the
specific switch.
At the same time, output pin 8 of IC3 becomes high, which
causes outputs of both gates N1 and N2 to go to logic 0 states. Logic
0 output of gate N2 inhibits IC1, and thus pressing of any other switch
S1 through S8 has no effect. Thus, the contestant who presses his
switch first, jams the display to show only his number. In the unlikely
event of simultaneous pressing (within few nano-seconds difference)
of more than one switch, the higher priority number (switch no.) will
be displayed. Simultaneously, the logic 0 output of gate N1 drives the
buzzer via p-n-p transistor BC158 (T1). The buzzer as well the
display can be reset (to show 0) by momentary pressing of reset
switch S9 so that next round may start.

Components and their cost

Resistors

Specificati No.
ons
10 K Ω 9
2.2K Ω 1
1K Ω 1
560 Ω 7

Capacitors

Specificati No.
ons
0.01 µF 1
0.1 µF 1

Transistors

Specificati No.
ons
BC547 1

IC’s

Specificati No.
ons
IC 74373 1
IC 74147 1
IC 7447 1
IC 7404 1
IC 7400 1
IC 7430 1

Miscellaneous

Specifications No.
Buzzer 1
Push to ON 8
switches
7 Segment display 1
PCB Layout

Bottom copper
Top copper

Simulation
The software used in our project for simulation purposes is
Proteus.

Proteus
Introduction:

Many CAD users dismiss schematic capture as a necessary evil in the process
of creating PCB layout but we have always disputed this point of view. With
PCB layout now offering automation of both component placement and track
routing, getting the design into the computer can often be the most time
consuming element of the exercise. And if you use circuit simulation to develop
your ideas, you are going to spend even more time working on the schematic.

ISIS has been created with this in mind. It has evolved over twelve years
research and development and has been proven by thousands of users
worldwide. The strength of its architecture has allowed us to integrate first
conventional graph based simulation and now - with PROTEUS VSM -
interactive circuit simulation into the design environment. For the first time ever
it is possible to draw a complete circuit for a micro-controller based system and
then test it interactively, all from within the same piece of software. Meanwhile,
ISIS retains a host of features aimed at the PCB designer, so that the same
design can be exported for production with ARES or other PCB layout software.

Use Of Proteus in making the PCB

layout
IN ISIS from circuit diagram layout is prepared. Now supply is given and
the circuit is simulated. It is then transferred to ARES. It is done by clicking on
the ARES button .This will take you to the ARES screen wherein all the
components used during simulation is displayed.The components can be
placed on the screen either manually or automaticaly.Manual placing of the
components is preferred for better results and to minimize the error.

After the components are placed the next step is to do the routing.
Routing can be done manually. We choose to make a double sided PCB in this
case as no of IC’s are more and by making double sided, it would lead to less
complications.

The PCB layout is then ready to take a printout. You can also view the 3D
visualization of the circuit using the output option.
Soldering of PCB components
Soldering is a process in which two or more metal items are joined together by
melting and flowing a filler metal into the joint, the filler metal having a relatively
low melting point. Soft soldering is characterized by the melting point of the filler
metal, which is below 400 °C (752 °F).[1] The filler metal used in the process is
called solder.

Solders

Soldering filler materials are available in many different alloys for differing
applications. In electronics assembly, the eutectic alloy of 63% tin and 37% lead
(or 60/40, which is almost identical in performance to the eutectic) has been the
alloy of choice. Other alloys are used for plumbing, mechanical assembly, and
other applications.
A eutectic formulation has several advantages for soldering; chief among these
is the coincidence of the liquidus and solidus temperatures, i.e. the absence of
a plastic phase. This allows for quicker wetting as the solder heats up, and
quicker setup as the solder cools. A non-eutectic formulation must remain still
as the temperature drops through the liquidus and solidus temperatures. Any
differential movement during the plastic phase may result in cracks, giving an
unreliable joint. Additionally, a eutectic formulation has the lowest possible
melting point, which minimizes heat stress on electronic components during
soldering.

Flux

In high-temperature metal joining processes (welding, brazing and soldering),

the primary purpose of flux is to prevent oxidation of the base and filler
materials. Tin-lead solder, for example, attaches very well to copper, but poorly
to the various oxides of copper, which form quickly at soldering temperatures.
Flux is a substance which is nearly inert at room temperature, but which
becomes strongly reducing at elevated temperatures, preventing the formation
of metal oxides. Secondarily, flux acts as a wetting agent in the soldering
process, reducing the surface tension of the molten solder and causing it to
better wet out the parts to be joined.

Fluxes currently available include water-soluble fluxes (no VOC's required for
removal) and 'no-clean' fluxes which are mild enough to not require removal at
all. Performance of the flux needs to be carefully evaluated; a very mild 'no-
clean' flux might be perfectly acceptable for production equipment, but not give
adequate performance for a poorly-controlled hand-soldering operation.

Basic soldering techniques

Soldering operations can be performed with hand tools, one joint at a time,
or en masse on a production line. Hand soldering is typically performed with a
soldering iron, soldering gun, or a torch, or occasionally a hot-air pencil.
Sheetmetal work was traditionally done with "soldering coppers" directly heated
by a flame, with sufficient stored heat in the mass of the soldering copper to
complete a joint; torches or electrically-heated soldering irons are more
convenient. All soldered joints require the same elements of cleaning of the
metal parts to be joined, fitting up the joint, heating the parts, applying flux,
applying the filler, removing heat and holding the assembly still until the filler
metal has completely solidified. Depending on the nature of flux material used,
cleaning of the joints may be required after they have cooled.

Hard soldering" or "silver soldering" (performed with high-temperature solder

containing up to 40% silver) is also often a form of brazing, since it involves filler
materials with melting points in the vicinity of, or in excess of, 450 °C. Although
the term "silver soldering" is used much more often than "silver brazing", it may
be technically incorrect depending on the exact melting point of the filler in use.
In silver soldering ("hard soldering"), the goal is generally to give a beautiful,
structurally sound joint, especially in the field of jewelry.

Induction soldering is a process which is similar to brazing. The source of heat

in induction soldering is induction heating by high-frequency AC current.
Generally copper coils are used for the induction heating

Desoldering and resoldering

Used solder contains some of the dissolved base metals and is unsuitable for
reuse in making new joints. Once the solder's capacity for the base metal has
been achieved it will no longer properly bond with the base metal, usually
resulting in a brittle cold solder joint with a crystalline appearance.

It is good practice to remove solder from a joint prior to resoldering—

desoldering braids or vacuum desoldering equipment (solder suckers) can be
used. Desoldering wicks contain plenty of flux that will lift the contamination
from the copper trace and any device leads that are present. This will leave a
bright, shiny, clean junction to be resoldered.

Soldering defects

Various problems may arise in the soldering process which lead to joints which
are non functional either immediately or after a period of use.

The most common defect when hand-soldering results from the parts being
joined not exceeding the solder's liquidus temperature, resulting in a "cold
solder" joint. This is usually the result of the soldering iron being used to heat
the solder directly, rather than the parts themselves. Properly done, the iron
heats the parts to be connected, which in turn melt the solder, guaranteeing
adequate heat in the joined parts for thorough wetting. In 'electronic' hand
soldering solder the flux isembedded in the solder. Therefore heating the
solder first may cause the flux to evaporate before it cleans the surfaces (pcb
pad and component connection) being soldered.

An improperly selected or applied flux can cause joint failure, or if not properly
cleaned off the joint, may corrode the metals in the joint over time and cause
eventual joint failure. Without flux the joint may not be clean, or may be
oxidized, resulting in an unsound joint.

Movement of metals being soldered before the solder has cooled will cause a
highly unreliable cracked joint. In electronics' soldering terminology this is
known as a 'dry' joint. It has a characteristically dull or grainy appearance
immediately after the joint is made, rather than being smooth, bright and shiny.
This appearance is caused by crystallization of the liquid solder. A dry joint is
weak mechanically and a poor conductor electrically.

Tools
Hand-soldering tools include the electric soldering iron, which has a variety of
tips available ranging from blunt to very fine to chisel heads for hot-cutting
plastics, and the soldering gun, which typically provides more power, giving
faster heat-up and allowing larger parts to be soldered. Hot-air guns and pencils
allow rework of component packages which cannot easily be performed with
electric irons and guns.

Testing of circuit

TROUBLE SHOOTING:

Troubleshooting and fault analysis requires a good theoretical knowledge and

analytical thinking. It is not something which can be studied from books, but has
to be acquired through constant troubleshooting and experimenting. However,
there are guidelines that can be followed to the troubleshooting process. Nearly
anyone who is familiar with basic electronic theory can learn troubleshooting
techniques and fix many types of electronic failures. To troubleshoot, you
simply follow logical, step-by-step procedures to arrive at a solution. Basically,
troubleshooting depends on the circuit complexity, on symptoms, and on the
personal experience. The most common troubleshooting techniques are listed
below:

Power check:

Many times a simple issue such as a blown fuse or a flat battery is the cause of
a circuit malfunction. Initially, therefore, ensure that the power cord is plugged in
and that the fuses are not blown. If the circuit is battery powered, make sure
that the voltage level is acceptable. If a power supply rectifier is present, check
the level of the voltage at the output and make sure that the circuit is powered
with the correct polarity.
Visual inspection:

This inspection is part of the so-called sensory checks. Sensory checks rely on
the human senses to detect a possible fault. The visual inspection of the PCB is
the simplest troubleshooting technique (which is very effective in many of the
cases). The soldered joints have to be inspected thoroughly. If any doubts exist
about the quality of a certain joint, it has to be re-soldered. The PCB has to be
inspected visually for any burnt components.

Sometimes, components that overheat leave a brown mark on the board. They
can be used as ‘starting points' in the troubleshooting process and the reasons
why they overheat have to be determined. It is bad practice simply to replace
such components, without trying to find out what actually caused the
component to overheat. In many cases, the reason is a faulty (or out of range)
component near the failed component. It also has to be replaced.

Using a sense of touch

Overheated components can be detected by simply touching them. However,

this check has to be performed with extreme caution. The circuit has to be
turned off, and some time allowed for the large capacitors to discharge. Always
touch the components with the right hand only. This is important because in the
case of electric shock it is less likely that the current will pass through the heart.
If possible, wear insulated shoes.

In addition, care should be taken not to burn the fingers. Using the sense of
touch is a very useful troubleshooting technique in circuits, where everything
seems to work properly for a while, and then the circuit fails, due to overheating
of a certain component. Identifying such components helps to detect the
possible cause of the fault. Special freezing sprays are available, which allow
instant freezing of components. If the circuit begins to operate properly
immediately after the heated component is sprayed, this is an indication that
this component is causing the circuit failure.

Before replacing the component, further investigation is needed to determine

what caused the overheating in the first place.

Smell check:

When certain components fail due to overheating it is possible in most cases to

detect a smell of smoke. This is usually the case, if the technician happens to
be there at the time the accident occurred. If not, it is usually possible to detect
the failed component by visual inspection afterwards.

Component replacement:

This troubleshooting method relies mostly on the operator's skills and

experience. Certain symptoms are an obvious indication of a particular
component failure. This statement is especially true for an experienced
electronic technician. For example, some TV service technicians can
unmistakably identify the failed component in a TV set (even before opening it),
by just briefly examining the symptoms.

Component replacement is a good troubleshooting technique for an

experienced electronics technician, as it saves a lot of time and money.
Moreover, this technique guarantees the success of the repair, because if
enough components are replaced, eventually the faulty one will be replaced too.
However, it is recommended that the amateur technician initially applies some
logical thinking to the troubleshooting process.

What one needs for troubleshooting

A good set of tools

Appropriate test equipment

Schematics, source-code, and other documentation.

A knowledge of what the equipment is supposed to do.

If possible, a working unit for comparison.

A knowledge of basic electronics theory and devices.

IC’s information

IC74373 connection diagram

These 8-bit registers feature totem ple 3-STATE outputs designed
specifically for driving highly capacitive or relatively low impedence
loads. The high impedence state and increased high logic level drive
provide these registers with the capability of being connected directly
to and driving the bussiness in a buss organised system without need
fornter face or pull up components. They are particularly attractive for
implementing buffer registers. I/O ports, bidirectional bus drivers and
working registers.

Features

• Choice of 8 latch or 8 D type flip flop in a single

package.

• 3 State bys driving output.

• Full parallel access for loading.

 • buffered control inputs.

• PNP inputs reduce DC loading on data lines.

IC 7400
The MM74HC00 NAND gates utilize advanced silicon-gate CMOS
technology to achieve operating speeds similar to LS-TTL gates with
the low power consumption of standard CMOS integrated circuits. All
gates have buffered outputs. All devices have high noise immunity
and the ability to drive 10 LS-TTL loads. The 74HC logic family is
function-ally as well as pin-out compatible with the standard 74LS
logic family. All inputs are protected from damage due to static
discharge by internal diode clamps to VCC and ground.

Features
■ Typical propagation delay: 8 ns
■ Wide power supply range: 2–6V
■ Low quiescent current: 20 µA maximum (74HC Series)
■ Low input current: 1 µA maximum
■ Fanout of 10 LS-TTL loads
7430 8-input

This device contains a single gate which performs the logic NAND
Function.
Alternate Military/Aerospace device (5430) is available. Contact a
National Semiconductor Sales Office/Distrib-utor for specifications.
7447 BCD to 7-segment display driver

The 47A feature active-low outputs designed fordriving common-

anode LEDs or incandescent indicators di-rectly. All of the circuits
have full ripple-blanking input/out-put controls and a lamp test input.
Segment identification and resultant displays are shown on a
following page. Dis-play patterns for BCD input counts above nine are
unique symbols to authenticate input conditions. All of the circuits
incorporate automatic leading and/or trail-ing-edge, zero-blanking
control (RBI and RBO). Lamp test (LT) of these devices may be
performed at any time when the BI/RBO node is at a high logic level.
All types contain an overriding blanking input (BI) which can be used
to con-trol the lamp intensity (by pulsing) or to inhibit the outputs.

Features
• All circuit types feature lamp intensity modulation capability.
• Open-collector outputs drive indicators directly.
• Lamp-test provision.
 • Leading/trailing zero suppression.

Hex NOT gates [ IC 7404 ]

• 7404 hex NOT
• 7405 hex NOT with open collector outputs
• 7414 hex NOT with Schmitt trigger inputs

SEVEN SEGMENT LED DISPLAY:

Seven segment displays are very common for electronic product to display numerical output.
Many common devices like calculators, watches, electronic weighing scales,ovens etc use
them.

PIN Configuration

Now you know the basic of these displays, to use them you should know the pin configuration of the
commercially available displays. As you must have guessed these displays should have nine pin( one
for each segment + decimal point +common) but the available modules have two pins for common.
They are internally connected. So they have total of 10 PINs.
Result and discussion

• Basically there are 8 switches, whichever is pressed buzzer rings

and the 7 segment display indicates the corresponding no. ie.
The switch which is pressed.
 • Thus it actually jams the first input and thus it acts as fastest
finger first.

Applications:
 It can be used in Quiz contests to make Game Shows Priority
Less.
 It can also be used in voting machines where, if a voter presses a
button the LED lamp glows & the buzzer rings. Once a button is
pressed all the other buttons are jammed. The officer has a switch
to reset the voting machine after each voter votes.

Advantages:
 It is a handy device.

 It has low Power consumption.

 It’s much easier to use.

 It is more accurate.

 Also Visual Interface adds its advantage.

 Its response time is very fast.

 It is highly sensitive.

 It got a wide supply range.

 It has high noise immunity.

  It’s cost is very low.

Disadvantages:
 Input is limited to eight

Future scope:
 Instead of Seven Segment Display, LCD screens can be
implemented.

 Priority list of all inputs can be imparted in output.

Conclusion
• Project aims the implementation of ‘Electronic Jam’ for making
Quiz shows priority less.
• Seven Segment display included for more user interface.
REFERENCES:

Wikipedia
http://www.scribd.com

http://www.electronicsforu.com