Professional Documents
Culture Documents
2011 CHIP
ACKNOWLEDGEMENT
had helped in the successful completion of this seminar. First of all, I express my
providing me all the facilities with which I was able to do this seminar.
my doubts and for providing me moral support. Further I would like to thank my
Almighty’ who gave me immense strength and showed me the path to make this
seminar victorious.
JIJI. P. POULOSE.
Abstract
drive down the size and cost of electronic products while improving their performance,
flexibility, and reliability. As a part of this effort, packaging methods are constantly being
improved and new, innovative methods are being developed. One area of focus is highly
integrated chip-level electronics assembly, using multiple unpackaged dies and electrical
components in a single package. One of the most popular methods is known as flip chip
assembly.
use wire bonds to provide the interconnection from device to substrate or to other active
devices. Flip chip offers advantages over traditional interconnect schemes. A smaller overall
footprint can be realized, better thermal heat transfer, and improved performance especially at
higher frequencies are all enabled through the use of flip chip technology.
etc………………………!
CONTENTS
1. INTRODUCTION…………………………………………..……01.
2. FLIP CHIP…………………………………………............…..…02.
4. HISTORY.................……………………………………..…….…04.
5. FLIPCHIP PROCESS………………………………….…...……13.
6. BUMPING……………………………………………………..….14.
8. FLIPCHIP JOINING..............................................................…...19.
11. ADVANTAGES……………………………………………………
30.
12. DISADVANTAGES…………………...………………………….31.
13. CONCLUTION…………………………………………….….…31.
14. BIBLIOGRAPHY………………………………………………..32.