Professional Documents
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3, MAY 2005
I. INTRODUCTION
Fig. 3. (a) Structure of a hexagonal spiral winding and (b) its simplified symbol
used in this paper.
In order to design a universal charging platform, it is neces- Fig. 5. Peak (P) and valley (V) positions of the PCB winding pattern.
sary to generate a uniform mmf distribution over a planar sur-
face. In this section, the mmf distribution of single layer planar
In order to generate a uniform mmf distribution over the
winding array is first addressed. Then the structure of the pro-
planar charging surface, two more layers of PCB winding
posed multilayer winding arrays is explained.
arrays should be added. This principle is explained firstly by
First consider a spiral winding arranged in a hexagonal shape
adding a second layer of PCB winding array to the first one as
as shown in Fig. 3(a). For simplicity, it will be represented as a
shown in Fig. 7. The second layer is placed on the first one in
hexagon as shown in Fig. 3(b). If a current passes through each
such a way that the peak mmf positions (P) of the patterns of
spiral winding pattern, a magnetomotive force (mmf), which is
one layer is placed directly over the valley positions (V) of the
equal to the product of the number of turns and current
patterns in the other layer. Fig. 7 highlights the peak positions
(i.e., ), is generated. Fig. 4(a) shows two spiral winding
of the patterns that are directly over the valley positions of
patterns adjacent to each other. The per-unit mmf plot over the
the other layer for the two overlapped PCB layers. It can be
distance (dotted line) can be linearized as shown in Fig. 4(b).
observed from Fig. 7 that the use of two layers of PCB winding
It can be seen that the mmf distribution over the distance is not
arrays does not offer the optimal solution of generating uniform
uniform. The maximum mmf occurs in the center of the pattern
mmf over the inductive charging surface. For each hexagonal
and the minimum mmf occurs in the edge of the pattern.
pattern in the two-layer structure, the peak positions occupy the
Now consider three adjacent patterns in Fig. 5. The maximum
central position and three (out of six) vertices of each hexagon.
mmf region is labeled by a symbol “P” (which stands for mmf
Peak). The minimum mmf region at the junction of two patterns The remaining three vertices are valley positions (V) that
is labeled as “V” (which stands for mmf Valley). Note that each need to be filled by the third layer of PCB winding arrays. These
Peak is surrounded by six Valleys and each Valley surrounded valley positions are shown in Fig. 7 as empty squares. Careful
by three Peaks. examination of Fig. 7 shows there are six peak positions (P)
surrounding each valley position. Therefore, a third layer of
hexagonal PCB winding array can be used to fill up all these re-
III. UNIFORM MMF GENERATION BASED ON MULTILAYER
maining valley positions. By placing the central positions (peak
PCB WINDING ARRAYS
mmf positions) of the hexagonal winding patterns of the third
Many hexagonal spiral windings can be arranged as an array layer of the PCB winding array over the remaining valley po-
as shown in Fig. 6. These windings can be connected in parallel, sitions of the two-layer structure, an optimal three-layer struc-
in series or a combination of both to the electronic driving circuit ture is formed as shown in Fig. 8. Fig. 8 highlights the peak
[19], [20]. In Fig. 6, only the mmf peaks (P) are labeled. It should mmf positions of the three-layer structure. It can be observed
be noted there are six mmf valleys (V) surrounding each peak that all central positions and vertices of all hexagonal patterns
at the six vertices of each hexagonal pattern. have peak mmf.
622 IEEE TRANSACTIONS ON POWER ELECTRONICS, VOL. 20, NO. 3, MAY 2005
Fig. 6. Layer of hexagonal winding patterns (Each mmf peak “P” is surrounded by six valleys).
Fig. 7. Square with a “P” inside of it refers to peak mmf positions. Blank square refers to valley positions (to be filled by the peak positions of the third PCB
winding array) in the intermediate two-layer hexagonal-spiral PCB winding array structure.
In order to understand that the mmf over the surface has PCB winding array structure can be used to generate uniform
uniform mmf distribution, one can consider any distance be- mmf over the inductive charging surface. When used as a
tween any two adjacent peak mmf positions as illustrated in contactless, inductive charging surface, this uniform mmf dis-
Fig. 9. If the winding patterns are excited in the same manner tribution feature ensures that, for a given airgap, a secondary
and polarity so that the mmf generated by each layer of the PCB coupling winding can always couple the same amount
winding array are always in the same direction at any moment, of magnetic flux regardless of the position of the secondary
the resultant mmf is simply the sum of the mmf generated by (coupling) PCB on the inductive charging surface. In addition,
each layer. Fig. 9 shows that the resultant mmf over the distance the voltage induced in the secondary winding would be the
between any two adjacent peak positions in Fig. 9 is equal same over the inductive charging surface. The four-layer PCB
to 1.0 per unit. This indicates that the proposed three-layer winding array structure can be constructed in a three-layer
HUI AND HO: NEW GENERATION OF UNIVERSAL CONTACTLESS BATTERY CHARGING PLATFORM 623
Fig. 8. Structure of three-layer of hexagonal-spiral PCB winding arrays (with peak mmf positions highlighted with symbol P).
(a) (b)
Fig. 10. (a) Measured mmf scan superimposed on the photograph of the PCB and (b) the magnitude plot of the mmf (for a one-layer hexagonal PCB winding
structure).
(a) (b)
Fig. 11. (a) Measured mmf scan superimposed on the photograph of the PCB and (b) the magnitude plot of the mmf (for a two-layer hexagonal PCB winding
structure).
(a) (b)
Fig. 12. (a) Measured mmf scan superimposed on the photograph of the PCB and (b) the magnitude plot of the mmf (for a three-layer hexagonal PCB winding
structure).
HUI AND HO: NEW GENERATION OF UNIVERSAL CONTACTLESS BATTERY CHARGING PLATFORM 625
V. CONCLUSION
The concepts of a novel (patent-pending) universal charging
platform and a method of using multilayer PCB spiral winding
matrices to generate uniform magnetomotive force over a planar
surface are described in this paper. Its feasibility as a battery
charger has been practically demonstrated and confirmed. The
present prototype has been tested successfully as a contactless
battery charger for a range of modified consumer electronic
products. This new invention has an important feature that sev-
eral electronic devices can be placed and charged on the plat-
form simultaneously, regardless of their positions and orien-
tation on the effective charging surface. By designing appro-
Fig. 17. Two views of the measured secondary load power over the charging
surface. (a) Measured secondary load power on the charging surface (W). priate secondary circuits to meet the charging requirements of
(b) Measured secondary load power on the charging surface (W). different types of portable electronic equipment, this new inno-
vation forms the basis of a new generation of universal contact-
less planar battery charger. In principle, the winding arrays can
a Tektronix current probe. A high-speed (500 MHz) Tektronix
be arranged into groups and excited by individual inverters so
digital storage oscilloscope was used for the voltage and current
that localized charging can occur only in the region in which the
measurements. Its mathematical function is used to calculate
charged equipment is placed [19], [20].
average power values.
Fig. 16(a) and (b) show two views of the measured secondary
voltage plot when the secondary PCB planar winding is placed ACKNOWLEDGMENT
over the primary charging surface. It can be seen that over The authors wish to thank P. W. Chan for his efforts in col-
5 V rms can be induced in the secondary winging within the lecting the measurements for this paper.
excited area. It is noted that the induced voltage in the central
area is slightly lower than that near the edges. Fig. 17(a) and REFERENCES
(b) show two views of the measured secondary load power [1] K. Oguri, “Power supply coupler for battery charger,” U.S. Patent 6 356
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being charged by the universal charging platform. 1999.
HUI AND HO: NEW GENERATION OF UNIVERSAL CONTACTLESS BATTERY CHARGING PLATFORM 627
[8] S. C. Tang, S. Y. Hui, and H. S.-H. Chung, “Coreless printed circuit S. Y. (Ron) Hui (F’03) was born in Hong Kong in
board (PCB) transformers with multiple secondary windings for com- 1961. He received the B.Sc. degree (with honors)
plementary gate drive circuits,” IEEE Trans. Power Electron., vol. 14, from the University of Birmingham, Birmingham,
no. 3, pp. 431–437, May 1999. U.K., in 1984, and the D.I.C. and Ph.D. degrees from
[9] S. Y. Hui, S. C. Tang, and H. S.-H. Chung, “Optimal operation of core- the Imperial College of Science and Technology,
less PCB transformer-isolated gate drive circuits with wide switching University of London, London, U.K., in 1987.
frequency range,” IEEE Trans. Power Electron., vol. 14, no. 3, pp. He was a Lecturer in power electronics at the Uni-
506–514, May 1999. versity of Nottingham, Nottingham, U.K., from 1987
[10] S. C. Tang, S. Y. R. Hui, and H. Chung, “Coreless printed circuit board to 1990. In 1990, he took up a lectureship at the Uni-
(PCB) transformers with high power density and high efficiency,” Elec- versity of Technology, Sydney, Australia, where he
tron. Lett., vol. 36, no. 11, pp. 943–944, May 25, 2000. became a Senior Lecturer in 1991. He joined the Uni-
[11] S. Y. R. Hui, S. C. Tang, and H. Chung, “Some electromagnetic aspects versity of Sydney in 1993 and was promoted to Reader of Electrical Engineering
of coreless PCB transformers,” IEEE Trans. Power Electron., vol. 15, in 1996. Presently, he is a Chair Professor of Electronic Engineering at the City
no. 4, pp. 805–810, Jul. 2000. University of Hong Kong. He has published over 150 technical papers, including
[12] S. C. Tang, S. Y. R. Hui, and H. Chung, “Characterization of coreless over 100 refereed journal publications.
printed circuit board (PCB) transformers,” IEEE Trans. Power Electron., Dr. Hui received the Teaching Excellence Award in 1999, the Grand Applied
vol. 15, no. 6, pp. 1275–1282, Nov. 2000. Research Excellence Award in 2001 from the City University of Hong Kong,
[13] S. C. Tang, S. Y. R. Hui, and H. Chung, “Coreless planar printed-circuit- and the Hong Kong Award for Industry-Technological Achievement and the
board (PCB) transformers—A Fundamental concept for signal and en- Consumer Design Award, in 2001 and 2004, respectively. He is a Fellow of the
ergy transfer,” IEEE Trans. Power Electron., vol. 15, no. 5, pp. 931–941, IEE. He has been an Associate Editor of the IEEE TRANSACTIONS ON POWER
Sep. 2000. ELECTRONICS since 1997. He has been an At-Large Member of the IEEE PELS
[14] , “A low-profile power converter using printed-circuit-board (PCB) AdCom since October 2002. He was appointed an IEEE Distinguished Lecturer
power transformer with ferrite polymer composite,” IEEE Trans. Power by IEEE PELS in 2005.
Electron., vol. 16, no. 4, Jul. 2001.
[15] S. Y. R. Hui and S. C. Tang, “Coreless printed-circuit board (PCB) trans-
formers and operating techniques,” U.S. Patent 09/316 735, 2002.
[16] S. C. Tang and S. Y. R. Hui, “Planar printed-circuit-board transformers
with effective electromagnetic interference (EMI) shielding,” US Patent
US6 501 364, Dec. 31, 2002.
[17] T. Mizoguchi, T. Sato, M. Sahashi, M. Hasegawa, H. Tomita, and A. Wing W. C. Ho (M’86) received the B.E.Sc. degree in electrical engineering
Sawabe, “Planar magnetic elements,” U.S. Patent 5 801 521, 2002. and the B.Sc. degree in applied mathematics from the University of Western On-
[18] B. Choi, H. Cha, J. Noh, and S. Park, “A new contactless battery tario, London, ON, Canada, in 1986, the Ph.D. degree in electrical engineering
charger for portable telecommunication/computing electronics,” in from the University of Hong Kong in 1997, and the M.B.A. degree from the
Proc. ICCE’00 Int. Conf. Consumer Electron., 2000, pp. 58–59. University of Newcastle, Newcastle, Australia, in 2003.
[19] S. Y. R. Hui, “Planar inductive battery charger,” U.K. Patent 0 213 374.2, He is presently an Assistant Product Design Manager with Artesyn Technolo-
Jun. 10, 2002. gies AP, Ltd. He spent over 10 years with ASTEC AMPSS, Hong Kong, as a
[20] , “Apparatus and method of an inductive battery charger,” PCT Senior Engineer.
Patent PCT/AU03/00 721, 2000. Dr. Ho is a Chartered Engineer in Britain.