Advanced circuit technology built on innovation and expertise

Teledyne Labtech is one of the leading manufacturers of microwave solutions with specialist capabilities in design, manufacturing, assembly and testing across many technologies, product and market applications from defence electronics, global telecommunications to space and satellite communications.

Teledyne Labtech operates from two dedicated manufacturing centres in the UK. The site at Milton Keynes specialises in microwave design and component manufacture, whilst our Presteigne site is dedicated to microwave circuit board manufacturing with both sites involved in microwave and PCB testing.

Our product capability

Microwave PCBs

Microwave MIC assembly

Microwave components

MMIC packaging solutions

Delivering excellence in microwave circuits

Microwave PCBs We manufacture complex and high technology microwave printed circuit boards for demanding and critical applications. Our ability to meet prototype-to-volume production requirements coupled with comprehensive technical support provides customers a higher level of expertise and service. Metal backed PCBs High precision double sided PCBs Multilayer PTFE, mixed dielectric PCBs Microwave MIC assembly services Teledyne Labtech offers a comprehensive build-to-print microwave module and component manufacturing service. Our scope covers ceramic thin film circuit manufacture, laser drilling, laser welding, automatic chip placement and wire bond assembly. Turnkey service utilising in-house capabilities Automatic chip and wire assembly Module & microwave test up to 40Ghz RF machining & box build assembly

Microwave components Teledyne Labtech has extensive and proven experience in producing high performance microwave components including DLVAs and amplifiers. Typically, our microwave components operate within the frequency range of 10MHz-40Ghz; pin switches up to 26GHz and a range of custom active and passive components for multifunction sub-systems, which use discrete and MMIC designs. Broadband and narrowband amplifiers Detector log video amplifiers (DLVAs) Custom active and passive components MMIC packaging solutions Teledyne Labtech has developed an innovative low cost custom packaging solution combining our established microwave printed circuit board techniques with the use of low cost organic materials for single chip & MCM applications. Single chip & MCM packages Auto assembly & microwave test of packages SMD, drop-in & BGA footprints

Microwave solutions you can trust

Teledyne Labtech operates under the highest quality and environmental standards with recognised accreditations including ISO9001:2001 and ISO14001. Manufacturing and testing are undertaken in a class 10,000 clean room with fully automated chip placement and wire bonding. At Teledyne Labtech you can be confident every aspect of our business, and all of our people, are committed to continuous improvement - supported by a range of quality programmes that ensure we consistently deliver reliable and high specification microwave solutions. Inspection default: IPC6018 Class 2 and 3 (PCBs) SPC & continuous improvement programmes Environmental testing and conditioning including mil-std vibration Temperature cycling and leak testing (gross and fine) Mil Std 883 compliant

For more information on the total microwave package call us on + 44 (0) 1544 260093 or email labtechsales@teledyne.com

Teledyne Labtech Limited Unit 1 Broadaxe Business Park Presteigne Powys LD8 2UH UK Tel: +44 (0) 1544 260093 Fax: +44 (0) 1544 260310 www.teledynelabtech.com labtechsales@teledyne.com

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