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Intel Atom Processor E6xx & E6x5C Series Hands-On Training Event
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
Q1 2011
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
Desktops
Laptops
Netbooks Gadgets
Smartphones
Smart TVs
Embedded
Servers/Cloud
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
SMALL
As small as an Intel Atom processor? No, but close! Die size of ~25 mm
INTEGRATED
Highly & efficiently Integrated allowing for small form factors
VALUE
LEADING TECHNOLOGY
LOW POWER
Built on as small as 32nm Transistor Technology
FANLESS
Has best performance per watt!! Runs fanless!
SCALABLE
Allows for flexibility to design scalable platform
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
ITS UP TO YOU!!
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A Continuum of Computing
Intel Core i5 Processor Intel Atom Processor
1 core
@1.6GHz 2 cores @ 2.4GHz
6 Cores
@ 2.8Ghz
988 Pins
Max TDP
1366 pins
INTEL CONFIDENTIAL
edc.intel.com
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
INTEGRATION
FSB
FSB Graphics & Video
Display Controller PCIe* USB Audio
Processor Core
FLEXIBILITY
SDIO
PATA
LPC
FLEXIBLE
OPEN STANDARDS
INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Intel Atom Processor E6xx Series-based Platform Unleashing Innovation for Optimization
Discrete PCIe Device
Target segment
Discrete PCIe* Device
USB
GbE
PCI
Processor Core
Proprietary ASIC
Customer with existing proprietary ASICs e.g. Print Imaging, PLC Target Segment
FPGA
PCI Express 4 x1
Network Parallel Other I/F Interfac es Accel. Low Spd Clocks/ Serial Timing I/Fs Power HS Serial / I/Fs VR Audio Video I/F I/F Storage PCIe Power x2 I/Fs Mgmt.
Segments with diverse I/O requirements e.g. Industrial Automation Target Segment High volume segments with uniform I/O e.g. IVI, Media Phone, Premise Service Gateway
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Efficient Footprint
Bill of Materials & TCO
+
Intel Platform Controller Hub EG20T
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
Help Provide More Tightly Integrated Solutions Intel Atom Processor E6x5C Series
CPU IOH FPGA DSP ASIC
Military
Aerospace
Machine Vision
Transportation
Industrial Automation
Robotics
Sensors
Security
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
Flexibility
Configurable with application-specific or proprietary I/O and algorithms Single Design supports multiple product derivatives Multiple functions combine into a single package for smaller form factor needs
Simplicity
Single Package reduces footprint and helps lower costs Ease of Design with few chips and simplified inventory Power of One with one supplier, one package, and one support call
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Processor Core
Internal Memory
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Software
Operating Systems
BIOS/Firmware
Intel Embedded Media and Graphics Driver (Intel EMGD) 3rd Party IOH Drivers
WES2009*, WinCE 6.0, VxWorks*, Neutrino*, Meego*, WR Linux* Intel Boot Loader Development Kit (Intel BLDK)
I/O Flexible
Next Gen
Power Optimized
Oaktrail Lincroft
2010
2011
Dual Core
Shipping POR
2012
Planning
2013
INTEL ATOM PROCESSOR E6XX SERIES Industrial Temp Available on some HANDS-ON TRAINING SERIES EVENT 2011
(-40 to +85 C)
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PERFORMANCE
DENSITY
INTEGRATION
CONFIGURABLE
OTHER
17
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
PERFORMANCE OPTIMIZED
CPU & Graphics Performance to Cost Leadership
OAK TRAIL
POWER OPTIMIZED
Fanless Performance to Watt Leadership
I/O FLEXIBLE
Flexible for Specific Design Needs
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
1.6
400
Yes
4.5
1.3
400
Yes
3.6
1.0
320
Yes
3.6
0.6
320
Yes
3.3
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
E665C
1.3
400
Yes
3.6
E645C
1.0
320
Yes
3.6
E625C
0.6
320
Yes
3.0
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Oaktrail (Lincroft)
Configurable FPGA
Video encode
DDR3
Extended Temp
BOM Consolidation
Full HD Playback
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Intel Atom Processor E6xx Series-based Platform for General Embedded Purposes
Additional Third-party IOHs for specific segment needs: OKI Semiconductor*
ML7213 primarily for IVI ML7223 for telecom terminals, e.g. media phones
STMicroelectronics*
ConneXt STA2X11 for IVI
Reaktek*
RTL8954C for CSGs & medical
Third-party PMIC / CLKGEN helps to simplify designs: Dialog Semiconductor* ROHM Co., Ltd
DA6011 (1 chip) BD9590MWV & BU7335MWV (2 chips)
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
Multi-Chip-Package Details
Multi-Chip Package (MCP) 37.5x37.5mm, 0.8mm ball pitch Commercial and Industrial Temp SKUs (-40C to 85C) available I/O Options: SMBus; SPI ; LPC GPIO (14+)
PCIe* (2+) High speed Transceivers (6 total, up to 3.125 Gbps) Digital Signal Processing Up to 312 multipliers (39 DSP block)
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011
*Other names and brands may be claimed as the property of others.
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INTEL ATOM PROCESSOR E6XX SERIES HANDS-ON TRAINING SERIES EVENT 2011 ** TDP is for the CPU only, depending on FPGA programming, actual TDP will be higher