Packaging

Freescale Semiconductor (formerly Motorola, Inc., Semiconductor Products Sector) has

over 30 years of leadership in semiconductor packaging and manufacturing technology
for automotive, industrial, networking and wireless markets and offers industry-leading
packaging options spanning from low-cost solutions to high-end flip-chip BGAs
(FCBGAs). Freescale actively supports the need for environmentally safe products and
has an Environmentally Preferred Product (EPP) program to help ensure customer and
legislative requirements are met. Freescale packaging options include MAPGAs, PBGAs,
TEPGAs, TBGAs and FCPGGAs.

MAPBGA (Molded Array Process Ball Grid Array)

The wire-bonded MAPBGA

(Molded Array Process Ball Grid
Array) is an excellent package
for low-performance to mid-
performance devices that require
packaging with low inductance,
ease of surface mounting, low
cost, small footprint and
excellent package reliability.

Features:

• Custom substrate designs / ball maps for maximum flexibility and electrical
performance
• Custom ball patterns / full array / depopulated arrays available; 0.5 mm to 1.0 mm
pitch
• Substrates use standard PCB manufacturing technology
• Two or four layer substrates available (ground / power planes)
• High I/O with smaller footprints available
• Maximum thickness from 1.30 mm to 1.60 mm
• Capability to withstand lead-free reflow processes (260°C reflow)
• Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)
PBGA (Plastic Ball Grid Array)

The wire-bonded PBGA (Plastic

Ball Grid Array) package is an
excellent package for mid- to
high-performance devices that
require low inductance, ease of
surface mounting, relatively low
cost, and excellent package
reliability. Additional copper
layers in the substrate allow for
increased power dissipation
capability with the Thermally
Enhanced PBGA (TEPBGA).

Features:

• Custom substrate designs / ball maps for maximum routing flexibility and
electrical performance
• Custom ball patterns / full arrays / depopulated arrays available
• Substrates use standard organic PCB manufacturing technology
• Two or four layer substrates available (ground / power planes)
• Proven reliability in automotive / industrial environments
• Capability to withstand lead-free reflow processes (260°C reflow)
• Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)

TEPGA (Thermally Enhanced Plastic Ball Grid Array)

In the TEPGA a thermally enhanced substrate acts to spread and draw heat from the die
to the customer board. For further
power dissipating capability, a
heat spreader is placed on top of
the die, within the mold
compound of a PBGA, drawing
heat to the surface of the package.

Features:
 • Proven reliability in industrial environments
• Capability to withstand lead-free reflow processes (260�C reflow)
• Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)
• Builds upon the standard PBGA process
• Overall substrate thickness increased over two-layer
• Additional epoxy dispense, heat spreader placement, epoxy cure steps needed
• Substrate design must account for heat spreader design to allow for attachment
area

TBGA (Tape Ball Grid Array)

The TBGA (Tape Ball Grid Array)

is a mid to high end BGA
packaging solution for
applications needing excellent
thermal performance without an
external heatsink.

Features:

• Improved thermal performance over std PBGA packages <15°C/Watt

• Custom substrate designs / ball maps for maximum flexibility and electrical
performance
• Custom ball patterns / depopulated arrays available; 1.0 mm to 1.27 mm pitch
• Substrates use standard PCB manufacturing technology
• Maximum thickness from 1.30 mm to 1.60 mm
• Fine Lines/Spacing Geometry (35/35 µm) on two sides of polyimide substrate
• Capability to withstand lead-free reflow processes (260�C reflow)
• Lead-free solder balls available (95.5% Sn, 3.8% Ag, 0.7% Cu)

FCPBGA (Flip Chip Plastic

Ball Grid Array)
Our FCPBGA (Flip Chip Plastic Ball Grid Array) is a laminate-based BGA packaging
solution. The FCPBGA provides competitive solutions for higher performance
applications.

Features:

• Improved board level solder joint reliability and lower cost compared to FC
CBGA
• Custom substrate designs / ball maps for maximum routing flexibility and
electrical performance
• Custom ball patterns / full arrays / depopulated arrays available
• Substrates use standard organic PCB manufacturing and HDI laminate
technologies
• FCPBGA footprint is a drop-in replacement (PCB design and board assembly) for
WB PBGA for the same ball diameter and pitch.
• Production qualified MSL 3 at 245°C reflow