Chapter 5: Automation and Computers in PCB Design: Automated Artwork Draughting

Full Manual Method:

Automated artwork generation:-

Equipment for Automated artwork Draughting Digitizer:- Digitizing is a graphic to digital conversion of all the relevant information incorporated in the layout sketch such as component location , solder pad size , conductor configuration , etc. A digitizer consists usually of a cursor- operated digitizer , a control console , a disc storage system and a fast per plotter which are all linked to a minicomputer . Functioning: - There is different working principles applied in the digitizers currently employed. Some designs make use of a coordinatograph which gives the cursor position via precision gears to optical encoders. Accuracy: - Resolution capability of the digitizers available is mostly in the range of 0.025-0.1mm. The absolute positional accuracy varies between 0.075-0.25mm.

Photo plotter Flat bed plotters: - The film is kept flat on the drawing table. Either the drawing head or the table is moved by a highly precise mechanical driving system consisting of digital stepping motors and a gear box with rack and pinion output.

Drum plotters: - The y-coordinate movement is carried out by the drawing head while the x-coordinate movement occurs by rotation of the cylindrical drum with the film fixed on it . Exposure: - Solder pads are exposed by flashing of the light spot projector. The pad diameter depends on the aperture chosen for the exposure. Accuracy:- Positional accuracy can be expected to be within approximately 0.005-0.025mm limits . 0.02-0.04mm while repeatability has

COMPUTER AIDED DESGN (CAD): In computer aided design (CAD) of layouts, the component placing and interconnecting patterns are developed with the assistance of computer facilities .It is not a fully automated procedure but it makes optimum use of the designers ingenuity while the tedious routine operations are taken over by a minicomputer. It is a team work between man and machine where the designer plays his role in a feedback loop, thus being the controlling element.

Fig: CAD layout design with automated Artwork generation

CHAPTER 6: FLIM MASTER PRODUCTION

The film master production: The film negative or positive which is finally used for the direct composure of photo resist coated PCB or the light sensitized screen is called film master.

Emulsion parameter: 1. Density: the density D also called transmission density as the logarithm of the ratio of the luminance intensity i0 falling on the developed image to the luminance intensity if transmitted by the image. 2. Characteristics curve. 3. Gamma: The slope or tangents value of the straight line position of the characterizer curve has been termed gamma and denoted by

4. Resolving power 5. Exposure latitude Emulsion two types: Lith emulsion: It has a high gamma for film master production a high constant capability makes with emulsion an excellent tool for line type photographic work. It is called infection effect. The fine gain lith emulsion have an emulsion thickness of typically 6-8m. Line emulsion: It is a gamma which is in the range of between 4 and 8 comparing lith; it has less constant. The disadvantage of low exposure latitude like lith emulsion. The thickness of fine line is 4-5nm.

Dimensional stability of a film master: The absolute dimensional stability of accuracy of film master is determine by Accuracy of the original work. Dimensional stability of artwork. Reduction scale of artwork to actual PCB size. Camera accuracy is producing the film master there are gain various factors influencing the dimensional stability of a film master such as o Temperature variation. o Charges in relation humidity, o Processing effect. o Ageing. Essential qualities of Reprographic camera:- Flat type less, color corrected distortion free edge portions. Reduction capability for a maximum reduction factor of 4. Precise guidance of less focusing. At least 4560 cm size producing a uniform illumination. Perfect film hold down, usually by vacuum. Adjustment of copy board plane and film plane. Accurate exposure time control Aperture control.

Darkroom: As a guideline in a widest sense any material, equipment, switch, etc, should be located as near as possible to the place where it is used. A short and direct material flow from on place of handling to the next on, makes darkroom operations simple and simultaneously more safe and minimizes dust appearance. The darkroom floor area should neither be too small nor too big. A too small darkroom makes working difficult and more rejects will be the result. While a too big darkroom is difficult to keep clean and dust free and acclimatization, where required, becomes very expensive.

Increasing and decreasing line widths: In certain application, it might be necessary to get a film master with widened or narrowed lines and patterns e.g. to compensate for under etching or plating overhang. The basic requirements for changing of line width are: Point light source. Vacuum printing frame or a spring loaded pressure frame. Film master positive if line widths have to be increased. Film master negative if line widths have to be decreased. Diffuser of at least film size to scatter the exposure light in a controlled manner.

CHAPTER: 7: Properties of copper-clad Laminates

Filler: Filler are continuous webs of materials such as paper, glass cloth, etc. and are used as reinforcing agents. The paper used is Kraft, alpha cellulose, rag or their combinations. Resin: The fillers describe a above are embedded in a matrix of a resign when laminated. Most widely used among all the matrix materials are the phenol-formaldehyde resins. Copper foil: The copper foil which forms the surface of a copper clad laminate is manufactured by the process of electro-deposition. A thin film of copper metal Is deposited onto a slowly rotating corrosion resistant metal cylinder. Manufacturing process of copper clad laminates

Properties of copper clad laminates Electrical properties: Di-electric strength Di-electric constant Dissipation factor Insulation resistance Surface resistively Volume resistively Physical properties: Flexural strength Water absorption Thickness Flame resistance Di-electric strength: Di-electric strength is the ability of an insulating material to resist the passage of a disruptive discharge produced by an electric under specified conditions.

Di-electric constant: This is also referred to as permittivity .it is the ratio of the capacitance of laminate under test and capacitance of the same electrode system with air replacing the laminate as di-electric medium.

Dissipation factor: The dissipation factor is the ratio parallel reactance to parallel resistance and is measured with the electro arrangement. The dissipation factor is herewith the tangens value of the loss angle ; hence tan is identical with the dissipation factor.

Insulation Resistance: Insulation resistance of a base laminate is the ratio of voltage applied to the current flowing in the base laminate. Most test method is a pre-determined DC voltage of 500v. For practical use of this parameter, the measurements are carried out parallel to the surface of the base laminate as well as through the body of the base laminate. Surface resistance: Surface resistance is the resistance to leakage currents along the surface of insulating materials. The surface resistivity depends on factor such as surface humidity, surface clearness, surface finish, presence of chemically active agents in the surrounding atmosphere & temperature.

Volume resistivity: Volume resistivity is the measured to leakage current through the body of an insulation material. Factors influencing the volume resistivity are the chemical nature of the material, temperature and moisture absorbed in the sample Volume resistivity = R*A/l [ cm] Where, R=resistance measurement [] A= area of guarded electrode [cm] L= thickness of sample [cm]

Flexural strength: This is a measure of the force per unit area, which a laminate strip will stand without fracture, when supported at ends loaded in the centre, the values differ in two directions e.g. parallel to the length of filler and perpendicular to it. The cross wise values are in most cases lower.

Water absorption: The amount of water absorbed by a sample of specified size immersed in distilled water for a specified period at a specified temperature is reported as water absorption in milligrams. The gain can be expressed as the percentage of increase over the initial weight. Thickness: The extent of manufacturing thickness variations and its control within limits is of particular significance when the PCBs are used with edge connectors. Flame resistance: The electronics industry is becoming concerned with the problem of inflammability of materials used in the equipment. There is a great need to make laminates more flam resistance. Flame retardant laminates are made by using cloth or special papers with resins to which special chemical flame retardant are added. These additives decompose in the flame and react with the free radicals and this puts out the flame. Flame retardants are carefully chosen and formulated.

7: Properties of Copper Clad Laminates: Filler: Filler are continuous webs of materials such as paper, glass; cloth, etc are use as reinforcing agents. The paper used is draft, alpha cellulose, rag or their combinations. Resin: The fillers describe an above are embedded in a matrix of a resign when laminated. Most widely used among all the matrix materials are the phenol-formaldehyde resins. Copper Foil: The Copper foil which forms the surface of a copper clad laminate is manufactured by the process of electrodepositing. A thin film of copper metal is deposited onto a slowly rotating corrosion resistant metal cylinder. Manufacturing Process of Copper Clad Laminates

Properties of Copper Clad Laminates: Electric Properties: Di-electric strength: Di electric strength is the ability of an insulating material to resist the passage of a disruption discharge produced by an electric under specified conditions.

Di-electric Constant: This is also referred to as permittivity. It is the ratio of the capacitance of laminate under test and capacitance of the same electrode system with ai replacing the laminate as dielectric medium.

Dissipation Factor: The dissipation factor is the ratio parallel reactance to parallel resistance and is measured with the electro arrangement. The dissipation factor is herewith the tangent value of the loss angle $; hence tan $ is identical with the dissipation factor.

Insulation Resistance: Insulation resistance of a basic laminate is the ratio of voltage applied to the current flowing in the base laminate. Most test method are a pre-determine Dc voltage of 500v for practical use of this parameter the measurement are carried out parallel to the surface of the base laminate as well as through the body of the base laminate. Surface Resistance: Surface resistance is the resistance to leakage currents along the surface of insulating materials. The surface resistivity depends on factor such a surface humidity, surface clearness, surface finish, presence of chemically active agents in the surrounding atmosphere & temperature.

Volume resistivity: Volume resistivity is the measured to leakage current through the body of an insulation material. Factors influencing the volume resistivity are the chemical nature of the material, temperature and moisture absorbed in the sample Volume resistivity = R*A/l [ cm] Where, R=resistance measurement [] A= area of guarded electrode [cm] L= thickness of sample

Physical Properties: Flexural strength: This is an measurement of the force per unit area, which a laminate strip will stand without fracture, when supported at ends loaded in the centre, the value differ in two direction e.g. parallel to the length of filler and perpendicular to it. The cross wise values are in most cases lower.

Water absorption: The amount of the water absorbed by a sample of specified size immersed in distilled water for specified period at a specified temperature is reported as water absorption in milligrams. The gain can be expressed as the percentage of increase over the initial weight. Thickness: The extent of manufacturing thickness variation and its control within limits is of particular significance when the PCBs are used with edge connectors. Flame Resistance: Electronics industry is becoming concerned with the problem of inflammability of materials used in the equipment. There is a great need to make laminates more flam resistance. Flame retardant laminates are made by using cloth or special papers with resins. These additives decompose in the flame and react with the free radicals and this puts out the flame. Flame retardants are carefully chosen and formulated. 8: Plating and Etching: What is Plating and Etching? Plating: It is defined as the depositing of a metal ghee on another any type of substance, the process is called plating. Etching: A common term to express under etching, especially when screen or photo resists are used, is the etch factor, defined as the ration of etching depth to the wide of the side attack. Etching machine: Spray Etching Laboratory type spray etching Conveyorised Etching machine Describe the techniques of Plating. Plating of a metal can be accomplished on a copper pattern by three methods. They are: Immersion Plating Electro less Plating Electro Plating Immersion Plating: Immersion plating is the deposition of a metallic coating on a substance, by chemical replacement, from a solution of a salt of the coating metal. The substrate metal reduces the atoms of the metal in solution on itself by reducing the atoms from their ionic state in solution.

Electro less Plating: A unique combination of characteristics is given with electro less plating process with renders them very useful: The throwing power is essentially perfect; deposits can be made on any surface to which the solution gas free accesses, with no excessive build up on projections or edges. Deposits are often less porous than electrodeposits. Power supplies, electric contacts, bus bars and electrical measuring instruments are not required. Electro Plating: The passage of a unidirectional current through a solution is associated with the movement through it of charged particles called ions. The terminals leading the current into the solution are electrodes:

the pole at which the chemical reaction of reduction takes place in the cathode and the pole at which the chemical reaction of oxidation takes place is the anode. In an electrolytic cell, the total process of decomposition due to the passage of a current is called electrolysis. 9: Photo and Screen Printing: Photo Printing: Photo Printing is an extremely accurate process which is also applied to the fabrication of semiconductors and integrated circuits where the conductor widths are typically in the region of just a few microns. Screen Printing: It is a comparatively cheap and simple method for pattern transfers although less prices than photo printing. Basic process for photo printing Print and Etching process Panel Process Pattern Plating Process Feting Process Desirable feature of photo resist Sufficient light sensitive to make its use economically attractive. Ability to produce a pin hole free film of high uniformity with a short exposure time and a high resolution Highly resistance against the chemical used in further processing Possibility to strip with satisfactory case Low Price Wet Film resist: The uniformity of the film coating is expressed in % and is defined as Uniformity = Coating process for wet film process Roller Coating Flow Coating Dip Coating Whirl Coating Spraying Coating Roller Coating: Roller Coating is very efficient and satisfactory method in resist application on a large scale of single or double sided PCB. Once the process is running optimally the resist economy is very high. The principle of roller coating is shown in the figure. Resist is flow continuously between doctor (master) roller and coating (Application) roller. The excess resist flows to the end of the rolls from there make to the main sump for filtration and recirculation. Doctor roller and coating roller are made of smooth butyl rubber. X 100%

Flow Coating: The flow coating is the simplest and was the earliest methods of coating with wet film resist: A few drops of resist are poured on to the board. Dip Coating: In this simple process, the substrate is dipped into a bath of the coating, which is normally of a low viscosity to enable the coating to run back into the bath as the substrate emerges. This process is frequently used on porous substrates.

Whirl Coating: Whirl coating has long been used in graphic arts and printing industries before it become an important method for applications in microelectronics. In PCB applications, it is used where its low productivity rate and its considerable resist losses do not matter. Spray Coating: Spray offering a few advantages over the coating method: Rough and uneven boards can readily be coated. Wide range of control over film thickness through repeated coating/ dying and a adjustment of viscosity. Drilled holes are not or only little infected with resist.

10: Multi Layer Board: Laminating process: Preparation: The circuit is prepared and etched on the inner layer by PCB techniques. The tooling alignment holes on the prepregs must be 1.25 mm lager in diameter then the conductor pads and the holes and the laminates must be 11.25mm smaller than pads over which they are to be placed. Although high flow of the B stage materials in desirable to provide clear void free laminates. Clearance hole boards should be held between 4% and 10% to prevent contamination of conductor pads. B stage flow with other types of multilayer boards can be as high as 30%. Preheating: The platens and the press plates are preheated in the press to a temperature of 180C. The lower plate in then removed and placed on an asbestos pad or hot plate. The aluminium release foil and the successive layer of laminate and prepregs are aligned and pressed carefully into position. Another aluminium

is kept on top of the package and the top press plate is placed over entries sandwich. Kraft paper which required equalizing pressure as well as controls the temperature rise per desire profile is interposed both below the bottom plate and above the top plate and the entries assembly is placed between the platens. Post laminating inspection: After removal from the mould the laminate is inspected for insulation resistance as design requirements. The alignment of layer can be studied to advantage by radiography the board is then excess material and drilled. Further Processing: Inspection the hole: The boards need through inspection to verify the absence of epoxy smear the holes. After the inspection they are given for further treatment to burid up the external layersand the plated through holes as it is similarly done with ordinary double side boards. Etch Back: The common technique by which the epoxy smear is removed and the exposed glass fibers prepared for cooper deposition is known as etch back.

Multilayer Construction: There are many type of multilayer construction. These difference types are distinguished by the method used to make connection from one layer to another layer. After select the type of layer interconnection, the designer must select the suitable materials. Specification: Before starting the design of a multilayer board, the applicable multilayer specification should be reviewed. Heat dissipation must be considerable. A multilayer has lower heat dissipation capability than the equivalent number of single side boards. Nevertheless, voltage and current rating can be upgraded because the circuits are encapsulated. Interconnection Technique: The designer who is a beginner would do well to start with the clearance-hole interconnection method as this is simpler than others, and the usual PCB skills, equipment and design experience are directly applicable. The important limitation with the clearance hole method is that it is less efficient in its use of space because the layer are interconnected by external jumpers.

11: Solders and Soldering Technique: Joining/ Soldering: The process of connecting of two ends of wires or conductors at a single point is called joining. There are three types joining: Mechanical Joining Scaling Electrical Conductive Joining Principle of solder connections: In the process or soldering, the heat in the function of base material, solder and flux. Most of the soft soldering or soldering implies that the process of joining occurs at the below 450 C. The filler base metal wets and alloys with the base metal get drawn into the gap between them and the solder process forms a metal lurgical bond between the paths of the bond. The solder acts by Wetting of the base metal surfaces forming the join Following between these surfaces in a completely filled Metallurgical bonding to these surfaces when solidified Different types of soldering alloys: 1. Tin-Lead

2. Tin-Antimony 3. Tin-Lead-Antimony 4. Tin-Silver 5. Tin-Lead-Silver 6. Tin-Zinc Tin-Lead: The binary mixture of tin and lead constitutes a simple and classical eutectic system with the eutectic point at 61.9% tin and the eutectic temperature at 183C. Tin-Antimony: From the metallurgical equilibrium diagram for the binary tin-antimony alloy system, it can be observed that only a composition with 5% sb by weight forms a single phase solid solution in tin. Tin-Lead-Antimony: For the most commonly used antimonial tin-lead solder with a tin content of 30%-50%, the liquidus temperature is slightly raised compared to binary system. The presence of Sb generally restricts the flow of solder. Tin-Silver: In this system, the eutectic point is reached with 3.5% Ag/96.55 Sn given a eutectic temperature of 221C. A higher silver content results in very sleep rise in liquidus temperature.