2202124

Technical Publications
2202124
Revision 14
CT HiSpeed Series Theory of Operation
Copyrighte 1998, 1999, 2000, 2001 by General Electric Company
Operating Documentation
GE MEDICAL SYSTEMS REV 0
CT HISPEED SERIES THEORY OF OPERATION 2202124
D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.
WARNING
D IF A CUSTOMERS SERVICE PROVIDER REQUIRES A LANGUAGE OTHER THAN ENGLISH, IT IS THE CUSTOMERS RESPONSIBILITY TO PROVIDE TRANSLATION SERVICES. D DO NOT ATTEMPT TO SERVICE THE EQUIPMENT UNLESS THIS SERVICE MANUAL HAS BEEN CONSULTED AND IS UNDERSTOOD. D FAILURE TO HEED THIS WARNING MAY RESULT IN INJURY TO THE SERVICE PROVIDER, OPERATOR OR PATIENT FROM ELECTRIC SHOCK, MECHANICAL OR OTHER HAZARDS.
D CE MANUEL DE MAINTENANCE NEST DISPONIBLE QUEN ANGLAIS.
AVERTISSEMENT
D SI LE TECHNICIEN DU CLIENT A BESOIN DE CE MANUEL DANS UNE AUTRE LANGUE QUE LANGLAIS, CEST AU CLIENT QUIL INCOMBE DE LE FAIRE TRADUIRE. D NE PAS TENTER DINTERVENTION SUR LES QUIPEMENTS TANT QUE LE MANUEL SERVICE NA PAS T CONSULT ET COMPRIS. D LE NON-RESPECT DE CET AVERTISSEMENT PEUT ENTRANER CHEZ LE TECHNICIEN, LOPRATEUR OU LE PATIENT DES BLESSURES DUES DES DANGERS LECTRIQUES, MCANIQUES OU AUTRES.
WARNUNG
D DIESES KUNDENDIENSTHANDBUCH EXISTIERT NUR IN ENGLISCHER SPRACHE. D FALLS EIN FREMDER KUNDENDIENST EINE ANDERE SPRACHE BENTIGT, IST ES AUFGABE DES KUNDEN FR EINE ENTSPRECHENDE BERSETZUNG ZU SORGEN. D VERSUCHEN SIE NICHT, DAS GERT ZU REPARIEREN, BEVOR DIESES KUNDENDIENSTHANDBUCH NICHT ZU RATE GEZOGEN UND VERSTANDEN WURDE. D WIRD DIESE WARNUNG NICHT BEACHTET, SO KANN ES ZU VERLETZUNGEN DES KUNDENDIENSTTECHNIKERS, DES BEDIENERS ODER DES PATIENTEN DURCH ELEKTRISCHE SCHLGE, MECHANISCHE ODER SONSTIGE GEFAHREN KOMMEN.
D ESTE MANUAL DE SERVICIO SLO EXISTE EN INGLS.
AVISO
D SI ALGN PROVEEDOR DE SERVICIOS AJENO A GEMS SOLICITA UN IDIOMA QUE NO SEA EL INGLS, ES RESPONSABILIDAD DEL CLIENTE OFRECER UN SERVICIO DE TRADUCCIN. D NO SE DEBER DAR SERVICIO TCNICO AL EQUIPO, SIN HABER CONSULTADO Y COMPRENDIDO ESTE MANUAL DE SERVICIO. D LA NO OBSERVANCIA DEL PRESENTE AVISO PUEDE DAR LUGAR A QUE EL PROVEEDOR DE SERVICIOS, EL OPERADOR O EL PACIENTE SUFRAN LESIONES PROVOCADAS POR CAUSAS ELCTRICAS, MECNICAS O DE OTRA NATURALEZA.
ATENO
D ESTE MANUAL DE ASSISTNCIA TCNICA S SE ENCONTRA DISPONVEL EM INGLS. D SE QUALQUER OUTRO SERVIO DE ASSISTNCIA TCNICA, QUE NO A GEMS, SOLICITAR ESTES MANUAIS NOUTRO IDIOMA, DA RESPONSABILIDADE DO CLIENTE FORNECER OS SERVIOS DE TRADUO. D NO TENTE REPARAR O EQUIPAMENTO SEM TER CONSULTADO E COMPREENDIDO ESTE MANUAL DE ASSISTNCIA TCNICA. D O NO CUMPRIMENTO DESTE AVISO PODE POR EM PERIGO A SEGURANA DO TCNICO, OPERADOR OU PACIENTE DEVIDO A CHOQUES ELTRICOS, MECNICOS OU OUTROS.
AVVERTENZA
D IL PRESENTE MANUALE DI MANUTENZIONE DISPONIBILE SOLTANTO IN INGLESE. D SE UN ADDETTO ALLA MANUTENZIONE ESTERNO ALLA GEMS RICHIEDE IL MANUALE IN UNA LINGUA DIVERSA, IL CLIENTE TENUTO A PROVVEDERE DIRETTAMENTE ALLA TRADUZIONE. D SI PROCEDA ALLA MANUTENZIONE DELLAPPARECCHIATURA SOLO DOPO AVER CONSULTATO IL PRESENTE MANUALE ED AVERNE COMPRESO IL CONTENUTO. D NON TENERE CONTO DELLA PRESENTE AVVERTENZA POTREBBE FAR COMPIERE OPERAZIONI DA CUI DERIVINO LESIONI ALLADDETTO ALLA MANUTENZIONE, ALLUTILIZZATORE ED AL PAZIENTE PER FOLGORAZIONE ELETTRICA, PER URTI MECCANICI OD ALTRI RISCHI.
IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should be thoroughly read and understood by everyone who will use the equipment before you attempt to place this equipment in operation. The General Electric Company, Medical Systems Group, will be glad to assist and cooperate in placing this equipment in use. Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no practical design of equipment can provide complete protection. Nor can any practical design compel the operator to take adequate precautions to prevent the possibility of any persons carelessly exposing themselves or others to radiation. It is important that everyone having anything to do with x-radiation be properly trained and fully acquainted with the recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the International Commission on Radiation Protection, and take adequate steps to protect against injury. The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents, and representatives have no responsibility for injury or damage which may result from improper use of the equipment. Various protective material and devices are available. It is urged that such materials or devices be used.
CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

All electrical installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations, and testing shall be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are highly sophisticated, and special engineering competence is required. In performing all electrical work on these products, GE will use its own specially trained field engineers. All of GEs electrical work on these products will comply with the requirements of the applicable electrical codes. The purchaser of GE equipment shall only utilize qualified personnel (i.e., GEs field engineers, personnel of third-party service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent, have notation damage in shipment written on all copies of the freight or express bill before delivery is accepted or signed for by a General Electric representative or a hospital receiving agent. Whether noted or concealed, damage MUST be reported to the carrier immediately upon discovery, or in any event, within 14 days after receipt, and the contents and containers held for inspection by the carrier. A transportation company will not pay a claim for damage if an inspection is not requested within this 14 day period. Call Traffic and Transportation, Milwaukee, WI (414) 8273449 / 8*2853449 immediately after damage is found. At this time be ready to supply name of carrier, delivery date, consignee name, freight or express bill number, item damaged and extent of damage. Complete instructions regarding claim procedure are found in Section S of the Policy & Procedure Bulletins.
OMISSIONS & ERRORS

GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this documentation. Customers, please contact your GE Sales or Service representatives.
CAUTION
Do not use the following devices near this equipment. Use of these devices near this equipment could cause this equipment to malfunction. Devices not to be used near this equipment: Devices which intrinsically transmit radio waves such as; cellular phone, radio transceiver, mobile radio transmitter, radiocontrolled toy, etc. Keep power to these devices turned off when near this equipment. Medical staff in charge of this equipment is required to instruct technicians, patients and other people who may be around this equipment to fully comply with the above regulation.
LIST OF EFFECTIVE PAGES

Tab Section (Warning and other important information) (Revision Information) 1 (System)
General Description Power Distribution Scan Operation
Page
Title page Title page rear a to d
REV
14 blank 0
3 (Table/Gantry)
General Description SubAssembly Description
i 11 to 13 21 to 216 i 11 21 to 210 31 to 316 i 11 to 13 21 to 27 31
13 13 13 9 0 13 13 12 12 12 12
4 (DAS/Detector)
General Description Detector Data Acquisition System (DAS)
A to B i 11 to 16 21 to 210 31 to 39 i 11 to 18 21 to 24 31 to 36 41 to 44
14 14 14 10 14 9 12 10 10 10
5 (Xray Generator)
General Description I General Description II Typical Signals
2 (Operator Console)
General Description Host Processor Connector Boards Other OC Components
Appendix
Symbols and Classification A1 to A4 Blank/Rear cover 0
REVISION HISTORY
REV
14
Date
3/08/01 System
Primary Reason for Change

Added the KVMA stations info for twin systems (Sec. 1). Added: New type warmup scan, Asymmetric Scan, Twin cine scan, Auto mA (Sec, 3). Operator Console Table/Gantry DAS/Detector Xray Generator Minor corrections: Sec. 1, 2. Minor corrections: Sec. 2, 3. Removed System Options (Sec. 1). Minor corrections: Sec. 3. Operator Console Table/Gantry DAS/Detector Xray Generator Minor corrections: Sec. 1. Minor corrections: Sec. 1, 2. Minor corrections: Sec. 2, 3. Minor corrections: Sec. 1, 2, 3. Modified the illustration of Detector Module for Twin (Sec. 2). Adopted the new revision control for Sec. 1, 2, 3. Adopted the new revision control for Sec. 1, 2, 3, 4. Adopted the new revision control for Sec. 1, 2. Adopted the new revision control for Sec. 2, 3. Adopted the new revision control for Sec. 1, 2. Added Twin system related information. NP++ mA. 200VPDU note. Added a Jedi (for NP++) block diagram. Added information about NP++ (HiSpeed ZX/i). Hard disk capacity. OC Vide signal specifications, other. Revised Table/Gantry, DAS/Detector tabs. Updated System option description; Added 200VPDU, Scan Operation, NAA1 block diagram, ST1800 description; Generally updated DAS and XG. Initial release.
13
12/08/00
Table/Gantry DAS/Detector
12
10/25/00
System
11 10
9/05/00 7/5/00
DAS/Detector System Operator Console Table/Gantry DAS/Detector Xray Generator
9 8 7 6 5 4 3 2 1 0
5/19/00 4/20/00 2/25/00 12/17/99 10/19/99 2/26/99 11/27/98 8/31/98 7/10/98 3/27/98
SYSTEM
TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 1-3 1-4 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN . . . . . . . . . . . . . . . . . . SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 11
11 12 13 15
SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1 2-2 POWER DISTRIBUTION UNIT (PDU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . POWER DISTRIBUTION SEQUENCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-1 Power On/Off Timing Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-2 Safety Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21 27 27 29
SECTION 4 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4-1 4-2 WARMUP SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AXIAL SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-3 Asymmetric Scan (for Twin Systems only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-4 Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCOUT SCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
31 34 34 34 36 38 38 39
4-3
SYSTEM
GE MEDICAL SYSTEMS blank
ii
SYSTEM
SECTION 1 GENERAL DESCRIPTION
1-1
INTRODUCTION
The features of this CT (Computed Tomography) system, one of the HiSpeed series CT scanners, include the following: Workstation type information processing system, Solidstate xray intensity detector, Continuous rotation type gantry with slip rings and high frequency coupling. This CT system is comprised of the following main components (called subsystems): D Operator Console (called OC) D Scanning Gantry (called gantry) This subsystem further includes the following subsystems: DAS/Detector Xray Generator (called XG) D Patient Table (called table) D Power Distribution Unit (called PDU) The system may include some of the following customer option equipments: D Advantage Windows Image Workstation D Image Camera
11
SYSTEM
1-2
HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN
System Notation (NP, NP+, ...) According to system models or customer options installed on the system, a number of system specifications or functions available may differ from system to system; such are: D Selectable scan times, MA values, FOV dimensions D Remote Tilt function D Number of arrays of DAS/detector units, i.e., single or twin DAS/detector subsystem D ... However, the HiSpeed series scanners are principally grouped into four, for which the following notations are given respectively: NP, NP+, NP++ and Twin In this Theory of Operation manual, these notations NP, NP+, NP++, and Twin are used to describe differences among these four groups and to make descriptions of this manual read simpler. (However, Twin is further grouped into two, that is, NP+ Twin and NP++ Twin. In general outline, NP+ Twin systems are NP/NP+ systems with a twin DAS/detector, and NP++ Twin systems are NP++ systems with a twin DAS/detector. These notations also will be used when required.) Table 11 describes the constitution of the major hardware of NP, NP+, NP++, and Twin.
Table 11
Hardware Constitution NP NP+ NP++ common Halogen Lamps Laser common Firmware only is different. Standard or Option Standard common common common common (Jedi) common (D3142T tube) NP++ Jedi D3152T tube common twin DAS twin detector Jedi D3142T tube NP++ Jedi D3152T tube Standard or Option Standard NP+ Twin NP++ Twin
Subsystem/Component OC Gantry Mechanics Positioning Light Mechanics others Electrics Table IMS (Intermediate Support) Others DAS Detector Xray Generator Xray Tube PDU
12
SYSTEM
1-3
SYSTEM OVERVIEW
Illustration 11 shows the system block diagram. The operator console (OC) controls the entire system, according to the operators operations. The OC sends instructions to the processor of the TGP board, which then controls the gantry and table subsystems according to the instructions. The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights according to the passed instructions. The OGP board processor also passes the instructions from the TGP board to the processor of the xray generator subsystem. The XG processor controls the xray generator according to the instructions (originally from the OC). Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).
13
SYSTEM
GE MEDICAL SYSTEMS REV 14 Illustration 11

Power Unit Interface Board KV Control Board AC/DC Converter DC Bus Filament Board + Inverter Low Voltage Power Supply Rotor Board + Inverter
CT HISPEED SERIES THEORY OF OPERATION 2202124 System Block Diagram

Auxiliary Unit
CAN Bus (Control Bus)
Gantry Rotative Block

Xray Generator = Power Unit + Auxiliary Unit
EMC Board
High Voltage Inverter
High Voltage Tank
High Voltage
Xray Tube
Temperature Controller Detector
RF Transmitter Optical Fiber OGP Board Coaxial Cable Slip Rings RF Receiver Optical Fiber Slip Rings SUB Board Cover Boards Tilt Pot. Servo Amp.
DTRF Board
DAS
Step Motor Encoder
Collimator
TGP Board
Cover Switches Pump/Valve for Gantry Tilt Servo Motor Encoder
Gantry Stationary Block
CDROM 5 MOD Host Processor
OPERATOR CONSOLE
PCI Bus Recon Engine
AC 115 V AC 380 480 V
AC 115 V
AC 200 V
Power Distribution Unit (PDU)

Table Connector Board Potentiometers for Horizontal, Height, (IMS) Touch Sensors Latch Switches Position Feedback Cradle Encoder Cradle Step Motor
Table Board Raw Data Disk DBPCI Power Supply (DC 24 V)
Speaker Foot SW
System Disk
Step Motor Driver
Servo Amp. Pump/Valve for Table Elevation Keyboard DASIFN Feedback For systems equipped with Intermediate Support (IMS) only
Servo Motor
TABLE
Intermediate Support (IMS)
14
SYSTEM
1-4
SYSTEM SPECIFICATIONS AND DATA
The following tables describe system specifications and data.
Table 12
Scan Time Scan Time [sec]
Standard (NP, NP+) 1.0 (Half scan) 1.5 2.0 3.0
with 1.0 sec Scan Option 0.7 (Half scan) 1.0 1.5 2.0 3.0
with 0.8 sec Scan Option, NP+ Twin 0.5 (Half scan) 0.8 1.0 1.5 2.0 3.0
Standard (NP++, NP++ Twin) 0.46 (Half scan) 0.7 1.0 1.5 2.0 3.0
Table 13
Scan/Recon/Cal FOV FOV for NP+, NP++, and Twin [cm] (or, for NP with 50 cm FOV Option) Scan/Recon FOV PHead (18) Head (25) Body (50) Cal FOV Small (25) Small (25) Large (50)
FOV for NP [cm] Scan/Recon FOV PHead (18) Head (25) Body (45.5) Cal FOV Small (25) Small (25) Large (50)
Table 14
Image Spatial Resolution Related No. of Detector Active Channels NP 717 NP+, NP++ 793 Twin 793 X 2 512 X 512 Recon Matrix
No. of Actual Scan Views Full Scan 972 Half Scan 635
For 50 cm or 45.5 cm scan FOV
The same type detector is used both for NP and NP+ & NP++; the difference between the numbers of active channels is realized by software.
15
SYSTEM
1-4
SYSTEM SPECIFICATIONS AND DATA (continued) Table 15 KV Standard for NP, NP+, NP+ Twin 80 60 150 10 150 10 150 (with 200 mA Option) 60 200 10 200 10 200 KVMA Stations MA (with 300 mA Option) 60 300 10 300 10 250 Standard for NP++, NP++ Twin 60 400 10 440 10 380
120 140
Note 1: MA: in 10 mA increments. For Twin systems with V/R 5.5 or later system software, it is in 5 mA increments. Note 2: NP++ systems use the 6.3 MHU cooling algorithm. However, one system model which is grouped into the NP++ Twin systems and called HiSpeed NX/i Plus uses 5.3 MHU cooling algorithm. And the maximum MA available for HiSpeed NX/i Plus is 350 mA (at 120 kV). The system automatically selects Large Focus or Small Focus according to a slice thickness selection as described in Table 16.
Table 16
Combination of Slice Thickness and Focus Size (for Customer) Slice Thickness [mm] Focus Size Twin 1i mode (1 image/rotation) 2i mode (2 images/rotation), or helical mode 0.5*, 1 2, 3, 5, 7 Small Large
except for Twin
1, 2 3, 5, 7, 10
1*, 2 4, 6, 10
Note *: available with 1mm or 0.5 mm Option.
Table 17
Other Specifications
Exposure Start Angle (Axial Scan) Head & Posteriafossa Studies: 90/270 deg. Other Studies: 0/180 deg.
16
SYSTEM
SECTION 2 POWER DISTRIBUTION
2-1
POWER DISTRIBUTION UNIT (PDU)
The power distribution unit (PDU) provides powers to all the subsystems. Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.) See Illustration 21 (400VPDU) or 22 (200VPDU). These illustrations describe the following: D All the powers except XG Power are output from the system transformer on the PDU. (200VPDUs generate XG Power by a stepup transformer.) D XG Power powers the xray generator (XG) equipped on the gantry rotational block. Powers for xray tube high voltage, xray tube anode rotation, XG control circuit boards, etc. are derived from this power. However, the fan and pump for the xray tube are powered by SR115. D SR115 powers all the components equipped on the gantry rotational block except the xray generator. D TG115 powers all the components equipped on the gantry stationary block except the axial motor. The gantry tilt pump also is operated by this power. TG115 also powers the table subsystem. D TG200 powers the axial motor which rotates the gantry rotational block. D OC115 supplies power to the operator console.
21
SYSTEM
2-1
POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 21 Mains AC 380 480 V Power Distribution to Subsystems (400VPDU) Slip Rings Xray Generator
BRK1
XG Power (AC 380 480 V) System Transformer SR115 (AC 115 V) TG115 (AC 115 V)
Rotational Block (Stationary Block)
SW1 TG200 (AC 200 V) OC115 (AC 115 V)
400VPDU
BRK2 Axial Motor
Gantry
Table
CB1
Noise Filter
To internal components CRT
CB2 Operator Console
External components
22
SYSTEM
2-1
POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 22 Power Distribution to Subsystems (200VPDU) Slip Rings XG Power (AC 400/416 V) SR115 (AC 115 V)
BRK1
Mains AC 200/208 V
Stepup Transformer System Transformer
Xray Generator Rotational Block (Stationary Block)
TG115 (AC 115 V) SW1 TG200 (AC 200 V) OC115 (AC 115 V)
200VPDU
BRK2 Axial Motor
Gantry
Table
CB1
Noise Filter
To internal components CRT
CB2 Operator Console
External components
23
SYSTEM
2-1
POWER DISTRIBUTION UNIT (PDU) (continued)
Illustration 23 (400VPDU) or 24 (200VPDU) shows the simplified circuit diagram of the PDU. As shown; D (400VPDU): The voltage of mains power should be within a range of 380 V 480 V. The system transformer provides terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal. D (200VPDU): The system transformer provides terminals for 200 V and 208 V to connect power to the nearest voltage terminal. D The SR115 output is not controlled by any relay contacts; the power is always present in the CT system unless circuit breakers CB2 or CB5 are turned off. D The RMT CNT board contains relays which turn on/off K5, K6, K7, or K19 according to signals from the operator console and gantry. D The relay K1 is turned on some delay time later after K21 is turned on. The resisters connected to the relay K21 suppress rush currents. Earlier PDU models have the following circuits between Mains and XG Power, instead of the circuits shown in Illustration 23 or 24. (The relay K20 is turned on some delay time later after K1 is turned on. The resisters connected to the relay K20 suppress rush currents.) Mains K1 K20 XG Power
CB1
CB2 However, the further earlier PDU models do not have K20 and connected resisters. D Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below: CB1: XG Power CB2: TG200, TG115, SR115, OC115 CB3: TG200 CB4: TG115 CB5: SR115 CB6: OC115
24
SYSTEM
2-1
POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 23 Inside of PDU (400VPDU) K1 XG Power
Mains (3 Phase, 380 480 V)
CB1 System Transformer
K21
F10
CB2
480
CB3
460 440 415 400 380 0 0 115 200
K2
TG200
CB4
K3
TG115
CB5
SR115
CB6 CB1 CB6: Circuit Breakers
K4
OC115
PON FAN AL From OC EOFFO RSTEM SAFEO K5 SAFEG From Gantry RSTEMG EOFFG (The above means: for example, When K6 is turned on, then K3 and K2 are turned on.)
K21 K19
K1 K4 K3 K2
RMT CNT Board
K7 K6
25
SYSTEM
2-1
POWER DISTRIBUTION UNIT (PDU) (continued) Illustration 24 Inside of PDU (200VPDU)
Mains (3 Phase, 200/208 V) Stepup Transformer CB1 System Transformer
K1
XG Power
K21
F10
CB2
208
CB3
200 200
K2
TG200
CB4
115
K3
TG115
CB5
0 0
SR115
CB6 CB1 CB6: Circuit Breakers
K4
OC115
PON FAN AL From OC EOFFO RSTEM SAFEO K5 SAFEG From Gantry RSTEMG EOFFG (The above means: for example, When K6 is turned on, then K3 and K2 are turned on.)
K21 K19
K1 K4 K3 K2
RMT CNT Board
K7 K6
26
SYSTEM
2-2 2-2-1
POWER DISTRIBUTION SEQUENCE Power On/Off Timing Chart
The power on/off controls of XG Power, TG200, TG115, etc. shown in Illustration 21 or 23 (or, 22 or 24, for 200VPDU) are shown in Illustration 25. In the illustration; EOFF turns close or open when either EOFFO or EOFFG turns close or open. That Safety Loop turns close or open means the system safety loop is closed or opened, including both SAFEO and SAFEG turns close or open. (See the Safety Loop description on page 210) Reset Emergency turns close or open when either RSTEM or RSTEMG turns close or open. Illustration 25 describes the following: D Timing B: Only when Safety Loop turns close, XG Power turns ON. D Timing E: When EOFF turns open, XG Power, TG200, and TG115 turn OFF; however, OC115 remains ON. If pins 1 and 2 of JP1 are shorted on the RMT CNT board and the TGP board is at revision 4 or later (has a cradle emergency deceleration function), TG200 and TG115 turn OFF 0.4 sec 0.5 sec later after EOFF turns open; during this period, the cradle is decelerated to a halt. D Timing I: When Reset Emergency turns open, TG200 and TG115 are brought to ON. D Timing J: When FAN AL turns open, XG Power, TG200, TG115 and also OC115 all turn OFF.
27
SYSTEM
2-2
POWER DISTRIBUTION SEQUENCE (continued) Illustration 25 A

close
Power Distribution Sequence B C D E F G H I J K L M N
P ON EOFF Safety Loop

Reset Emergency
open close open close open close open close open ON OFF ON OFF ON OFF
FAN AL OC115 XG Power SR115
ON
TG200 TG115
OFF ON OFF
Pins 2 and 3 of JP1 are shorted on the RMT CNT board.

ON
TG200 TG115
OFF ON OFF
Pins 1 and 2 of JP1 are shorted on the RMT CNT board; and the TGP board is at revision 4 or later (has a cradle emergency deceleration function). Note Safety Loop is always closed in normal conditions after the system is switched ON or reset; this means that XG Power is always supplied to the gantry in normal conditions.
28
SYSTEM
2-2 2-2-2
POWER DISTRIBUTION SEQUENCE (continued) Safety Loop
Illustration 26 shows a diagram of the system safety loop. As shown, components on the gantry rotational block are not involved in the safety loop. Illustration 26 Safety Loop
Switch on the Gantry Rear Base SAFEG
TGP Board
Gantry
RMT CNT Board
PDU Operator Console Host Processor REAR CN1 Board SAFEO PCI Bus DBPCI Board
K5 Relays K1 XG Power
29
SYSTEM
2-2
POWER DISTRIBUTION SEQUENCE (continued)
Open of Safety Loop The safety loop can be opened by any of the following: D Switch equipped on the gantry rear base. D Control by the TGP board: The TGP board opens the safety loop in any of the following cases: When the TGP board receives from the OGP board a safety loop open demand due to an overtime of xray exposure. When the TGP board detects abnormal communication with the OGP board or the operator console (host processor) during xray exposure. D Control by the host processor (i.e., system software): The host processor opens the safety loop in any of the following cases: When the host processor receives a safety loop open demand from the TGP board. When the host processor detects an overtime of xray exposure. When the host processor detects an extra scan (other than scans which the host processor instructed the TGP board to perform) performed. D Signals such are EOFF, FAN AL, etc.
210
SYSTEM
SECTION 3 SCAN OPERATION
3-1
WARMUP SCAN
for Systems with earlier than V/R 5.5 System Software The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron , or when more than two hours have elapsed since the last scan. The warmup scans also have to be performed before performing phantom calibration which updates the calibration files (CAL files), if more than three hours have elapsed since the last scan. The following scans are performed during the warmup scan sequence.
Table 31 Purpose for xray tube warming for calibration
Warmup Scans (earlier than V/R 5.5) No. of Scans (Until the tube case temperature reaches 30%.) 3
The first series of scans warmup the xray tube. During the last three scans the system collects data to analyze it, and update CAL files: The system stores the data and checks whether the data falls within the specified range. If the data is out of range, the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous warmup data and calculates correction factors for CAL files, and updates them. Illustration 31 shows the warmup scan sequence.
31
SYSTEM
3-1
WARMUP SCAN (continued) Illustration 31 Warmup Sequence Start Tube warmup scans Error Message Error & Error code Yes Any error? No Scans & Data collection Raw Data Disk
Data check Error Message Warmup Error No Within range? Yes Calculates correction factors CAL files correction End
32
Raw data files
CAL files
System Disk
SYSTEM
3-1
WARMUP SCAN (continued)
for Systems with V/R 5.5 or later System Software The system requires the Warmup scans to warmup the xray tube prior to starting the first scan after poweron , or when more than two hours have elapsed since the last scan. The warmup scans also have to be performed before performing phantom calibration which updates the calibration files (CAL files), if more than three hours have elapsed since the last scan. The operator selects either the Tube Warmup or Daily Calibration warmup scans, as listed in Table 32.
Table 32 Type Tube Warmup Daily Calibration
Warmup Scans (V/R 5.5 or later) Purpose for xray tube warming for xray tube warming for calibration and xray alignment for system diagnostics (IQ Performance Measurement Scan) No. of Scans (Until the tube case temperature reaches 13%.) (Until the tube case temperature reaches 30%.) 11 (8: calibration 3: xray alignment) 7
The Tube Warmup type scans or the first series of scans of Daily Calibration warmup the xray tube. This means that Tube Warmup only warms the xray tube. During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files: The system stores the data and checks whether the data falls within the specified range. If the data is out of range, the system reports a WARMUP ERROR. If the data is within range, the system compares the data with the previous warmup data and calculates correction factors for CAL files, and updates them. During the scans for xray alignment (three scans), the system collects data to analyze the xray alignment.
IQ Performance Measurement Scan During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in the Status column. Analyzed data: Offset mean, Offset SD, Stability of air calibration, mAdependent DAS linearity variation, Scan time dependent DAS linearity variation, A/B ratio. For details, refer to the Home descriptions, in Section Service Tool, System tab, of the Diagnostics manual.
33
SYSTEM
3-2 3-2-1
AXIAL SCAN General
Prior to the actual xray exposure, the system collects 256 views of offset data generated from the DAS. The offset data is used to correct actual xray data. The system performs a full 360 deg. scan (clockwise direction only) during 0.7 (for NP++, NP++ Twin only), 0.8, 1.0, 1.5, 2.0, or 3.0 sec. These are called scan speeds or scan times, and not all of the them are available to all the systems; the available scan speeds or times vary according to system models or options installed on the systems. During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The following table shows this relation: Scan Speed (sec) 0.7 (NP++, NP++ Twin only) 0.8 1.0 1.5 2.0 3.0 View Period (sec/view) 720 823 1029 1543 2058 3086
The view period is synchronized with the azimuth encoder pulse. Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans, scans can be initiated from any azimuth angle. The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates that the gantry azimuth is at this moment at 0 deg., i.e., home position).
3-2-2
Scan Sequence
Illustration 32 shows the axial scan sequence.
34
SYSTEM
3-2
AXIAL SCAN (continued) Illustration 32 Axial Scan Sequence
Parameters change? (No)
(Yes) Scan parameters setting Cradle positioning Rotor start Gantry acceleration Offset data collection High Voltage ON Das enable Data collection High Voltage OFF Gantry deceleration (KV, MA, Slice Thickness, Scan Time, Slice Interval) (Patient is moved into the gantry scan plane) (The rotor is accelerated to operation speed) (Gantry is accelerated to the constant scan speed) (256 views of offset DAS data are collected ) (Start xray exposure) (DAS is enabled to collect data) (972 views of actual DAS data are collected; view period is synchronized with gantry azimuth position)
(Yes) Next scan? (No) End
35
SYSTEM
3-2 3-2-3
AXIAL SCAN (continued) Asymmetric Scan (for Twin Systems only)
Asymmetric Mode In scanning, you can choose either symmetric or asymmetric slices from the twindetector. There are three choices in the Asymmetric Mode. D [ OFF ] mode : (Symmetric is OFF) acquires slices with the same thickness (symmetric). D [ 10:1 ] ([ 10:2 ], [ 6:1 ]) mode : acquires slices with different thickness (asymmetric). [ 10:1] : provides 10 mm and 1 mm slices. [ 10:2] : provides 10 mm and 2 mm slices. [ 6:1] : provides 6 mm and 1 mm slices. Illustration 33 shows how asymmetric slices are obtained. In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the center of the twindetector. This slice is called fused, whereas the other thinner slice is derived from one detector.
36
SYSTEM
3-2
AXIAL SCAN (continued) Illustration 33 Asymmetric Slice Asymmetric slices of [10:1]

Collimator
Radiation area
Center between detectors A and B
1mm slice 9mm Detector A 10mm slice Detector B
Asymmetric slices of [10:2]

Collimator
Radiation area
Asymmetric slices of [6:1]

Collimator
Radiation area
37
SYSTEM
GE MEDICAL SYSTEMS REV 14 3-2 3-2-4 AXIAL SCAN (continued) Twin Cine Scan
In Cine scan, continuous multiple 360degree data acquisition is achieved without table travel or at the same location. In Twin Cine scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective recon, images from Detector A and images from Detector B can be displayed alternately (2i mode). The 1i mode display is also possible in retrospective recon. 3-2-5 Auto mA
The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The system varies mA according to patient shape and a predetermined algorithm for scan location. The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary information on Xray attenuation. (The last scout scan data is used for the Auto mA scan.) The system automatically increases mA at the scan locations where Xray attenuation is relatively high and decreases mA at the scan locations where Xray attenuation is relatively low. In the example below, the mA is set low at the start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at the location of abdomen area. Illustration 34 Auto mA
0degree Scout (AP) Tube
Patient
90degree Scout (LAT) Tube
Start
End
mA
0
Start End
Scan location
38
SYSTEM
3-3
SCOUT SCAN
Prior to the actual xray exposure, the system collects 64 views of offset data generated from the DAS. The offset data is used to correct actual xray data. The system advances the cradle and collects data from 793 (or 717 for NP) active channels. The cradle speed is 75 mm/sec, and data collection timing is synchronized with the cradle encoder pulse. Illustration 35 shows the scout scan sequence. Illustration 35 Scout Scan Sequence (KV, MA, Scan Range) (Cradle is moved to the Start + 20 mm position) (The rotor is accelerated to operation speed) (64 views of offset DAS data are collected ) (Cradle is accelerated to the constant scan speed) (Start xray exposure) (DAS is enabled to collect data) (Actual DAS data are collected; view period is synchronized with cradle position)
Scan parameters setting Cradle positioning Rotor start Offset data collection Cradle acceleration High Voltage ON Das enable Data collection High Voltage OFF Cradle Stop
Cradle move start
Start position Cradle stop
High Voltage ON Cradle acceleration
DAS enable Data collection
39
SYSTEM
310
SYSTEM
OPERATOR CONSOLE
TABLE OF CONTENTS
1-1 1-2 1-3 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAIN COMPONENT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OPERATIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 11
11 14 17
SECTION 2 HOST PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1 2-2 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BUILTIN I/O (INPUT/OUTPUT) DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21 24
SECTION 3 CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 3-2 CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . REAR CN1 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2-1 Filter Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2-2 Audio Mixer Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
31 31 31 33
SECTION 4 OTHER OC COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4-1 4-2 4-3 4-4 4-5 KEYBOARD, MOUSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRT DISPLAY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NAA1 (NP/NP+ AUDIO AMPLIFIER 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PCI EXPANSION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ST1800 (SERIAL PORT EXTENSION BOX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
41
41 41 41 42 44
OPERATOR CONSOLE
ii
OPERATOR CONSOLE
1-1
OVERVIEW
The information processing system (operator console) is based on the PCI (Peripheral Component Interconnect) bus architecture. The host processor of the operator console is a Unix workstation, which is on the market. (Workstation: The physical hardware that contains the CPU and graphics boards, a system disk, and a power supply. You connect it to a monitor, keyboard, and mouse to configure a working system.) The model type of this workstation is called O2. Illustration 11 or 12 shows a block diagram of the operator console of this CT system.
O2 System Software O2 System Software is the standard IRIX operating system software for the O2 and Silicon Graphics tools that come on the system disk and on the CDROM that you use in the event of a system crash. (IRIX: Silicon Graphicss version of the UNIX operating system)
PCI Bus PCI stands for Peripheral Component Interconnect a bus specification. The PCI bus is a highperformance local bus used to connect peripherals to memory and a microprocessor. A wide range of vendors make devices that plug into the PCI bus. The PCI bus can be operated at its intended highperformance by using DMA transfers. To perform DMA transfers with the PCI bus, a DMA controller should be equipped on the connected peripheral.
Address Map For a PCI bus based computer system, memory address mapping and I/O address mapping of PCI devices are determined during Configuration Cycle which the host processor generates when the system is powered on. Each of the PCI devices requests its required address space size from the host processor during the cycle. The PCI devices also (such are DBPCI, NPRIF, others) within this operator console are relocatable in the PCI address space. This means that address mappings of the PCI devices are not fixed. The physical addresses assigned by the host processor can be known by reading a set value on a base address register within configuration registers of each PCI device. (With a VME bus, base addresses are determined by dip switches.)
11
OPERATOR CONSOLE
GE MEDICAL SYSTEMS REV 12 Illustration 11 Operator Console Block Diagram (NP, NP+, NP++)
HIS/RIS Ethernet Analog RGB 21 Color Monitor PS/2 Mouse Scan Panel PS/2 103 Keyboard Keyboard PDU Laser Camera RS232C Laser Camera Interface (DASM) ST1800 (Serial Port Extension Box) Ultra/Wide SCSI Bit3 Backplane Card Raw Data Disk Raw Data Disk(Option) RS232C Ultra/Wide SCSI (Internal) Host Processor Bit3 PCI Host Card Bit3 PCI Backplane Controller Card PCI Bus NPRM
NPRS
System Disk System Disk (Option) Ultra/Wide SCSI (External) CDROM 5 MOD
NPRIF
5 MOD (Option) AHA2940UW
RS232C Scan Room TGP
DBPCI
Gantry Mic Table Speaker
NAA1
OC Speaker
Includes Rear CN1 Board, Rear CN2 Board, VSPL Board, and IST Board (for SmartView) DASIFN
DAS Heart Gate Trigger Optical Fiber NPRIF: Recon Engine Interface NPRM: Recon Engine Master NPRS: Recon Engine Slave DBPCI: DAS Buffer DASIFN: DAS Interface
12
OPERATOR CONSOLE
GE MEDICAL SYSTEMS REV 12 Illustration 12 HIS/RIS Ethernet Analog RGB 21 Color Monitor PS/2 Mouse Scan Panel PS/2 103 Keyboard Keyboard PDU Laser Camera RS232C Laser Camera Interface (DASM) ST1800 (Serial Port Extension Box) RS232C Ultra/Wide SCSI (Internal) Host Processor Bit3 PCI Host Card Operator Console Block Diagram (Twin)
Bit3 PCI Backplane Controller Card PCI Bus
NPRS
System Disk System Disk (Option) Ultra/Wide SCSI (External) CDROM 5 MOD
NPRM
NPRIF
5 MOD (Option) AHA2940UW Ultra/Wide SCSI Bit3 Backplane Card
RS232C Scan Room TGP
Raw Data Disk
DBPCI
DBPCI
Gantry Mic Table Speaker
NAA1
OC Speaker
Includes Rear CN1 Board, Rear CN2 Board, VSPL Board, and IST Board (for SmartView) DASIFN2
DAS Heart Gate Trigger Optical Fiber NPRIF: Recon Engine Interface NPRM: Recon Engine Master NPRS: Recon Engine Slave DBPCI: DAS Buffer DASIFN: DAS Interface
13
OPERATOR CONSOLE
1-2
MAIN COMPONENT DESCRIPTION
Host Processor The host computer performs all of the following operations: User interface Image processings/display (all processings except recon) Communication Database control Raw data/image data flow control Image storage Scan/recon control System Disk (Ultra/Wide SCSI; within the Host Processor) The host processor includes a hard disk drive which is used as the system disk. This system disk mainly stores the followings: System and application software Images Calibration files System parameters D Capacity: 4 GB or 9 GB In the case of a 4 GB disk, Image Storage: 4000 images (take up 2 GB (1 image/0.5 MB)) (The remained 2 GB storage is used for System software/swapping space + Application software) For NP++ and Twin systems, 9 GB disk drives are used. NPR (NP/NP+ Recon Engine) This is a unit for performing highspeed recon operations. This unit consists of the following three kinds of circuit boards: D NPRIF (NPR Interface): Performs interfaces between the PCI bus and the NPRM. D NPRM (NPR Master): Includes one master DSP (Digital Signal Processor), main memory called Global Memory 0, others. D NPRS (NPR Slave): Includes two slave DSPs which perform arithmetic operations under the NPRM control. The NPRS is a piggyback board equipped on the NPRM, and up to eight NPRS boards can be equipped on the NPRM (i.e., up to 16 slave DSPs can be equipped). The NPRIF only is connected to a PCI slot. The NPRIF and NPRM are connected by cables.
14
OPERATOR CONSOLE
1-2
MAIN COMPONENT DESCRIPTION (continued)
DBPCI (DAS Buffer for PCI Bus) This is a circuit board, serving as a ring buffer whose capacity is 4 MB. This buffer temporarily stores DAS data. This board also includes control registers for the OC keyboard, safety loop, others.
DASIFN (DAS Interface for NP/NP+/NP++) DASIFN2 (for Twin) This is a circuit board which converts raw data sent from the gantry in optical serial signals into electric parallel signals. During conversion, this board performs transfer error corrections. This board also includes one channel for receiving Heart Gate Trigger inputs.
PCI Expansion Unit Consists of PCI Host Card, PCI Backplane Controller Card, PCI Backplane Card. Increases the number of slots which are connected to the PCI bus of the host processor. Circuit boards for scan/recon are connected to these slots (NPRIF, DBPCI, AHA2940UW).
REAR CN1 This is a circuit board which mainly has two functions: Signal filtering and Audio control. This board is connected to OC external components such are keyboard, TGP board on the gantry, or Power Distribution Unit (PDU), and is also connected to OC internal components such are DBPCI board, NAA1 board, or others.
15
OPERATOR CONSOLE
1-2
MAIN COMPONENT DESCRIPTION (continued)
Raw Data Disk (Ultra/Wide SCSI) This is a highspeed hard disk drive for storing raw data. D Capacity: 2 GB Raw Data Storage: 450 raw data files (70% of the disk space is used for raw data storage; 30 % of it is not used, because of low read/write rate) For NP++, the capacity is 4 GB. For Twin, the capacity is 9 GB, and two drives of this are used.
Archive Equipment (MOD) MOD is used for archiving images/raw data. MOD is also used during system software installation to temporarily store data. D Capacity: 2.3 GB, Density: 4x (Hitachi/Sony MOD) Images: DICOM format Raw data: YMS format as Unix files (Includes Cal files, others)
CDROM Drive Used for system software loading.
16
OPERATOR CONSOLE
1-3
OPERATIONAL DESCRIPTION
Scan Data Main Flow Illustration 13 or 14 shows: Raw data acquired during scans is first buffered by DBPCI; The raw data is then stored to a hard disk drive which is a highspeed type and exclusively used for raw data storage; The raw data is then transferred to the NPR where recon processing is performed; The reconstructed images are then read by the host processor which converts the image data to video signal, as well as stores the image data to the system disk, which also stores system software. As shown, raw data and image data are mainly transferred over the PCI bus. Illustration 13 Scan Data Main Flow (NP, NP+, NP++) Scan
Raw Data CRT Display PCI Bus
Video Signal Host Processor Raw Data
DBPCI
Raw Data Disk System Disk Image Data Raw Data NPR Recon
17
OPERATOR CONSOLE
1-3
OPERATIONAL DESCRIPTION (continued) Illustration 14 Scan Data Main Flow (Twin) Scan
Raw Data CRT Display PCI Bus Ach Video Signal Host Processor Raw Data Raw Data Disk System Disk Image Data Raw Data NPR Recon Raw Data Disk Bch
DBPCI
DBPCI
18
OPERATOR CONSOLE
SECTION 2 HOST PROCESSOR
2-1
OVERVIEW
The host processor is a Unix workstation; its product name is O2. The host processor is the central unit within the operator console, performing various operations such are described below: D Controls data transfer between data storage units and memory devices located on NPR, etc. D Controls the entire scan sequence; it sends necessary instructions to relevant processors and devices, and receives status information from those processors and devices. D Controls the NPR (NP Recon Engine). D Performs graphics operations. The host processor includes a DC power supply (175 watts); it requires AC 115 V power.
21
OPERATOR CONSOLE
2-1
OVERVIEW (continued)
Table 21 shows main specifications of the host processor.
Table 21
Host Processor Specifications Component Specification Model Operating Frequency Cache Memory MIPS R5000SC or Rm5200 200 MHz or 300 MHz (Rm5200) 32 kB data/32 kB instruction primary cache 1 MB secondary cache 64 MB (32 MB DIMM X 2) or128 MB (64 MB DIMM X 2) Synchronous DRAM, 100 MHz, 4 banks, 288bit wide up to 256 MB with 16 Mbit SDRAM up to 1 GB with 64 Mbit SDRAM 4 GB (5400 rpm) or 9 GB (7200 rpm) 12 X 1280 x 1024 pixels 75.03 Hz Frame Rate 1024 x 768, 800 x 600, 640 x 480 also supported Frame Buffer Formats 32 + 32 bit FB (32 + 32 double buffered) 32 bit FB (16 + 16 double buffered) 16 bit FB (8 + 8 double buffered) 8 bit overlay Video Signal Horizontal Statistics Horizontal Front Porch Horizontal Back Porch Horizontal Sync Horizontal Active Horizontal Line Rate First Field Statistics Vertical Front Porch Vertical Back Porch Vertical Sync Vertical Active Vertical Sync Pulse : 118.52 nsec ; 16 pixels : 1.84 sec ; 248 pixels : 1.07 sec ; 144 pixels : 9.48 sec ; 1280 pixels : 79.98 KLines/sec : 12.50 sec : 475.14 sec : 37.51 sec : 12.80 msec : 38.58 sec ; 1.00 lines ; 38.00 lines ; 3.00 lines ; 1024.00 lines ; 3.09 lines
Central Processor
Main Memory
Capacity (standard) Type Upgrade
Hard Disk Drive (System Disk) CDROM Graphics
Capacity Type Resolution
Pixel Clock : 135.00 MHz
22
OPERATOR CONSOLE
2-1
OVERVIEW (continued) Table 21 Host Processor Specifications (continued) Component Builtin I/O (Input/Output) Specification PC (PS/2) compatible keyboard and mouse 2 x Ultra Fast/Wide SCSI singleended, 1 internal, 1 external (40 MB/sec each) 2 x Serial 460 kbps (DB9) 1284 Parallel (C miniature) 10BaseT/100BaseTX Ethernet standard (RJ45) Audio Expansion Slot Analog stereo input/output One halflength, 64bit PCI slot (10 W) IRIX 6.5 with XFS or later
Operating System
23
OPERATOR CONSOLE
2-2
BUILTIN I/O (INPUT/OUTPUT) DESCRIPTION
The host processor has input/output ports for the following:
Display Analog RGB signals are output from this port.
Keyboard/Mouse A PS/2 keyboard and a mouse are connected these ports, respectively.
10BaseT/100BaseTX Ethernet A diagnostic console, an independent console, or an HIS/RIS is connected to this port. DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10 Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols, etc.).
Ultra/Wide SCSI (Internal This port is provided within the host processor) The O2 host processor includes a hard disk drive. This drive is used as the system disk, and is connected to this port. The disk is also used for storing images.
Ultra/Wide SCSI (External) Since this port is a wide SCSI, the data bus of this port is 16bit wide. However, within this OC, devices which handle eightbit data such are CDROM drive, MOD drive, or Camera Interface are connected to this port in daisy chain.
Serial Port (RS232C) Provides two serial ports; one is used for communication with the TGP board, and the other is used for communication with scan keys (on the keyboard).
Audio Provides audio input/output ports. The host processor can record audio signals from a microphone or other sources, and can play recorded audio data. This function is used for Autovoice.
PCI Bus Slot The host processor is equipped with one PCI slot. In order to expand the PCI bus, a PCI Host Card is connected to this slot. The PCI Host Card is a component of the PCI Expansion Unit.
24
OPERATOR CONSOLE
SECTION 3 CONNECTOR BOARDS
3-1
CONNECTOR BOARDS
All the signal cables connected between the operator console (OC) and subsystems/components outside the OC run through these connector boards. The connector boards mainly include filters for each signal line to improve the EMC (ElectroMagnetic Compatibility) performance of the OC. The REAR CN1 board also includes an audio mixer, relay for the safety loop, and others.
3-2
REAR CN1 BOARD
Illustration 31 shows a block diagram of the REAR CN1 board. The REAR CN1 board is connected to a slot of the connector box of the OC, and as shown in Illustration 31, the board is connected to OC external components such are the keyboard, TGP board on the gantry, or the Power Distribution Unit (PDU), and is connected to OC internal components such are DBPCI board, NAA1 board, or others. The board functionally consists of the following two blocks: D Filter Block D Audio Mixer Block
3-2-1
Filter Block
As shown in Illustration 31, this block includes the following interface circuits: D Keyboard Interface: Mainly interfaces between the keyboard (including the scan buttons) and the host processor. D TGP Interface: Mainly interfaces RS232/RS422 communications and Direct Lines between the TGP board located on the gantry and the host processor or keyboard. D PDU Interface: Mainly interfaces Power On/Off, Emergency, Safety Loop, or other signals between the Power Distribution Unit (PDU) and the keyboard or the FRONT PNL board of the OC.
31
OPERATOR CONSOLE
3-2
REAR CN1 BOARD (continued) Illustration 31 REAR CN1 Block Diagram REAR CN1 Scan Panel Keyboard RS232 KB Reset Emergency Stop/Rest Direct Line PS/2 from/to Patient, Auto Voice, Foot SW, Xray On Direct Line TGP Reset Xray On RS422 NAA2 from Patient to Patient Speaker on Table Fan Alarm PDU
Emergency Stop/Rest
Filter Block PS/2 Fan Alarm
RS232 RS232
Host Processor
Thermal Guard Front Panel
Gantry
Power On Shutdown KB Reset Safety Loop Shutdown TGP Reset Xray LED
PCI Bus (via PCI Expansion Unit)
TGP Board
DBPCI Board
Talk On
Safety Loop Power On External Speaker (option)
Audio Mixer Block
Xray On Alert On CSA/WRA ACKA Address (4:0) Data (7:0) Line OUT Line IN
DBPCI Board (only for Twin)
from Patient Foot SW
CD Line OUT CDROM Drive from Patient NAA1
Foot Switch
32
OPERATOR CONSOLE
3-2 3-2-2
REAR CN1 BOARD (continued) Audio Mixer Block
The audio mixer block of the REAR CN1 board Includes registers for audio function, and also includes an audio amplifier for headphones or external speakers (which are not the OC speaker which is driven by the NAA1 board). See Illustration 32. As shown, audio signals from several sources are mixed in this block. D Audio Input Sources: Microphone on the gantry (Intercom: From Patient) Microphone on the OC keyboard (Intercom: To Patient) Audio output on the host processor (Auto Voice play) Audio output on the CDROM drive (BGM, or other) Synthesized sounds on the REAR CN1 board (Xray On, Alert) These are generated using a programmable timer which is controlled by software. D Audio Output Destinations: Speaker on the gantry Speaker on the OC Audio input on the host processor (for recording Auto Voice messages)
33
OPERATOR CONSOLE
3-2
REAR CN1 BOARD (continued)
Audio Input Switch As shown in Illustration 32, analog switches are used to switch audio input sources, and are controlled by the Talk On button on the keyboard or a foot switch connected to the keyboard. D An intercom function is provided between the OC room and the gantry room. The Talk On button on the keyboard switches communication direction, as described below: While Talk On is pressed, communication of OC room gantry room is enabled; and both of Auto Voice (both in the OC room and the gantry room) and sound from the CDROM drive (both in the OC room and the gantry room) are disabled. While Talk On is released, communication of gantry room OC room is enabled. If a foot switch is provided, this also serves as the Talk On button. D The Xray On sound and alert sounds in the OC room are always enabled, even when Talk On is pressed. D Auto Voice messages can be recorded by using the microphone equipped on the keyboard while pressing the Talk On button. While Auto Voice is being played, communication of gantry room OC room can be disabled. This prevents Auto Voice sound degradation on the OC side, because: Auto Voice is played both in the OC room and the gantry room. If communication of gantry room OC room is enabled, the Auto Voice messages are doubled on the OC side, which degrades the sounds.
Volume Control The following two kinds of volume control are provided. D The following can be adjusted with the manual volumes on the keyboard: Volume of communication of OC room gantry room (through the keyboard microphone) Recording level of Auto Voice messages (through the keyboard microphone) Auto Voice volume in the gantry room Volume of communication of gantry room OC room (through the gantry microphone) D The electronic volumes are controlled by software, controlling the following: Auto Voice volume in the OC room Sound volume from the CDROM drive both in the gantry room and the OC room Alert sounds in the OC room Xray On sound in the OC room
34
OPERATOR CONSOLE
GE MEDICAL SYSTEMS REV 10 3-2 REAR CN1 BOARD (continued) Illustration 32 Audio Mixer Block Stereo Signal Monaural Signal Xray Sound Programmable Timer Modulation
from/to DBPCI Xray On/Off Alert On Address (4:0) Data (7:0)
Analog Switch OP. Amp.
Frequency & Alert Sound Alert pulse width controller (one shot) Electronic Volume Sound Volume Control Register to Electronic volume control
from CD Drive from Host Processor Line OUT from Gantry Mic from OC Mic to Patient Volume
from Patient Volume
Lowpass Filter
Auto Voice Volume
Scan Keyboard Volumes
to Host Processor Line IN
to Gantry Speaker
to OC Speaker
35
OPERATOR CONSOLE
3-2
REAR CN1 BOARD (continued)
Audio Register Address Map Illustration 33 shows an address map of audio control registers. The addresses shown are mapped at an area within the DBPCI Input/Output address space of the host processor. Registers mapped within the I/O register bases $50 $7F are located on the DBPCI board. These are controlled by the host processor, and control signals only are sent from DBPCI to the REAR CN1 board. Registers mapped within the I/O register bases $80 $FF are located on the REAR CN1 board. These registers and the DBPCI board are connected via a dedicated bus. Illustration 33 Audio Register Address Map D7 D0
$b4 $b0 $ac $a8 $a4 $a0 CD GA Volume Register CD OC Volume Register AV OC Volume Register Alert Volume Register Xray Volume Register PIT1 Register $90 PIT0 Register $80
$60
AUX0 Auto Voice Playback Register
Note: CD: CDROM Drive GA: Gantry OC: Operator Console AV: Auto Voice PIT: Sound Pulse Width Control
$54 IO Register Base $50
Alert Sound Register Xray On Sound Register
36
OPERATOR CONSOLE
SECTION 4 OTHER OC COMPONENTS

4-1 KEYBOARD, MOUSE D 103 Keyboard, Mouse: This 103 keyboard and the mouse have a PS/2 interface for connecting themselves to the host processor. D Scan Keys, Microphone: Keys used for scanning, and a microphone used for an intercom are incorporated into the keyboard. These keys are connected to the host processor via RS232C. The keyboard and the TGP board are connected by Direct Lines for the remote cradle and gantry tilt control. 4-2 CRT DISPLAY D 21 color monitor D The resolution used for the CRT Display is 1280 x 1024 matrix. The refresh rate used is 75 Hz. 4-3 NAA1 (NP/NP+ AUDIO AMPLIFIER 1)
The keyboard used for this operator console integrates the following components:
This is an amplifier board for the OC speaker. See the following block diagram. Illustration 41 NAA1 Block Diagram Power Amplifier Preamplifier
+ + CN2 From REAR CN1 OUT OUT CN1 To OC Speaker
Muting
Voltage Regulator
41
OPERATOR CONSOLE
4-4
PCI EXPANSION UNIT
The host processor only provides one PCI slot. This unit expands this one slot to seven slots available. This unit consists of the following three boards (designed by Bit3): PCI Host Card PCI Backplane Controller Card PCI Backplane Card The main devices on these boards are PCIPCI Bridge chips, which expand the number of slots in stages. Illustration 42 shows a block diagram of the PCI Expansion Unit. Table 41 describes installed circuit boards at those slots which are made available by the PCI Expansion Unit.
Table 41 Slot Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7
PCI Slot Board Board NPRIF DBPCI DBPCI (for Twin only) AHA2940UW (space) (space) (space)
AHA2940UW Card This is a SCSI card of Adaptec. To this card, up to two hard disk drives can be connected for onthefly (high speed) raw data storage.
42
OPERATOR CONSOLE
4-4
PCI EXPANSION UNIT (continued) Illustration 42 PCI Expansion Unit
PCI Host Card PCI PCI Bridge Chip Cable
PCI Backplane Controller Card PCI PCI Bridge Chip
PCI Bus
PCI Backplane Card PCI Slot 1 PCI Slot 2 PCI Slot 3 PCI Bus
PCI Bus (Host) PCI PCI Bridge Chip
PCI Slot 4 PCI Slot 5 PCI Slot 6 PCI Slot 7
43
OPERATOR CONSOLE
4-5
ST1800 (SERIAL PORT EXTENSION BOX)
The host processor only provides two serial ports. To increase the number of available serial ports, the ST1800 unit is used. See Illustration 11 for the connection of the ST1800 unit within the operator console. The unit is connected to the ultra/wide SCSI port of the host processor, and provides four serial ports available. The serial ports may be used for connection with an InSite modem, a trackball, etc.
44
OPERATOR CONSOLE
TABLE/GANTRY
TABLE OF CONTENTS
1-1 1-2 1-3 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 11
11 12 13
SECTION 2 SUBASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1 2-2 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . STATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-1 TGP board Service Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-2 TGP Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ROTATING GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-1 MECHANISM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21 22 29 210 212 214 214 215
2-3 2-4 2-5
TABLE/GANTRY
ii
TABLE/GANTRY
1-1
INTRODUCTION
The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board receives command from the Operator Console and sends control commands to Table, Stationary Gantry and Rotational Gantry including OGP (On Gantry Processor), DAS and Xray Generator. Although the DAS/Detector and Xray Generator are in the Gantry, they are not explained in this subsystem. The Table/Gantry consists of the following components:
D TGP board D OGP board D SUB board D Table board D Servo Amp/Servo Motor D Gantry Display D Gantry Switch D Collimator D Positioning Light D Hydraulic System (Gantry Tilt and Table elevation) D Touch Sensors D Cradle drive system D IMS (Intermediate Support)
11
TABLE/GANTRY
1-2
COMPONENTS INTERCONNECTION
The illustration 11 shows the components of the Table/Gantry. Illustration 11 Table/Gantry
GANTRY SWITCH PANEL
GANTRY DISPLAY
TILT POTENTIOMETER TABLE HEIGHT POTENTIOMETER IMS POTENTIOMETER CRADLE POSITION POTENTIOMETER CRADLE ENCODER AZIMUTH ENCODER FOOT SWITCHES GANTRY PULSE TABLE TOUCH SENSORS GANTRY TOUCH SENSORS LATCH SWITCHES TGP BOARD OGP BOARD SUB BOARD SERVO AMP/MOTOR STEPPING MOTOR DRIVER TABLE BOARD SERVO AMP FOR IMS CRADLE DRIVER
AXIAL MOTOR TILT HYDRAULIC SYSTEM APERTURE MOTOR CRADLE MOTOR TABLE VALVE SOLENOID TABLE HYDRAULIC SYSTEM LOOK GUIDE IMS MOTOR APERTURE SENSORS EMERGENCY SWITCHES
FOR TWIN ONLY
ZAXIS LIMIT SENSORS DAS ZAXIS MOTOR
12
TABLE/GANTRY
1-3
SPECIFICATIONS
The specifications of the Table/Gantry is as follows:
Gantry Rotation Speed 0.7 (NP++, NP++ Twin), 0.8, 1, 1.5, 2, 3 sec/rot.
Tilt Angle 30_ 0.5_
Tilt Speed BWD 30_ ~ FWD 30_ : 60 6 sec
Table Height 400 ~ 950 mm
UP/Down Speed From 400 mm to 950 mm height: 30 sec 5 sec +10 sec.
Cradle Speed Slow Fast Scout Home 20 mm/sec 100 mm/sec 75 mm/sec 100 mm/sec
IMS Speed 50 mm/sec
13
TABLE/GANTRY
14
TABLE/GANTRY
SECTION 2 SUBASSEMBLY DESCRIPTION
2-1
OVERVIEW
The Table/Gantry consists of table and Gantry. The Gantry is divided into Stationary Gantry and Rotating Gantry. The communication between stationary and rotating Gantry is made by slipring, a rotation mechanism that permits electrical power and signals exchange. The illustration 21 shows the Table/Gantry block diagram. Illustration 21 Table/Gantry Block Diagram GANTRY
PDU
STATIONARY GANTRY
ROTATING GANTRY
POWER OC TGP BOARD GANTRY SWITCH OGP BOARD GANTRY TILT HYDRAULIC SYSTEM POSITIONING LIGHT COLLIMATOR GANTRY DISPLAY
SUB BOARD
SERVO AMP
SERVO MOTOR
SLIP RIN G
DAS
XG
TABLE
CRADLE IN/OUT TABLE BOAR D IMS (*) TOUCH SENSORS
Collimator DAS line to control Zaxis is for the Twin ONLY.
TABLE ELEVATION HYDRAULIC SYSTEM
(*) Standard or Option, depending on a system.
21
TABLE/GANTRY
2-2
STATIONARY GANTRY
The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 22 shows the main components of the stationary Gantry. The TGP board communicates with Operator Console and Table via cables and with the OGP board located in rotating Gantry via cable and slip ring. Illustration 22 Stationary Gantry main components
OGP (SLIP RING) 115VAC MICROPHONE GANTRY SWITCH PS1 PS2 FCV BOAR D PS 3 DISPLAY BOARD TOUCH SENSOR BREATH NAVI EMERGENCY SWITCH
OC TGP BOARD TABLE MICROPHONE GANTRY SWITCH XDISP BOARD TOUCH SENSOR RCV BOAR D BREATH NAVI EMERGENCY SWITCH
GANTRY TILT PUMP & VALVE TABLE ELEVATION PUMP & VALVE SUB BOARD AXIAL MOTOR
SIDE COVER SWITCHES
M
FRONT AND REAR COVER SWITCHES
The functions of the parts of the stationary Gantry are as follows:
PS1 and PS2 Supply power to TGP board and SUB board. PS1 supplies +5V, +12V and 12V. PS2 supplies +24V.
22
TABLE/GANTRY
2-2
STATIONARY GANTRY (continued)
FCV (Front Cover) Board RCV (Rear Cover) Board Contains connection circuitry to display board, touch sensors, breath navis and emergency switches. See Illustration 23 and 24. Illustration 23 FCV Block Diagram
FCV BD ASSY CN1 TGP TGP BD ASSY (CN8) +24V,+5V,GND,SHIELD,XLED,PLLED, A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 CN2 DISP GNTDISP BD ASSY CN5 LG LG1 BD ASSY FLED LG2 BD ASSY CN3 LSW LSW BD ASSY CN4 RSW
+24V,+5V,SHIELD,FLED,SLED CUNTL0,CUNTL1, CUNTL2,CUNTL3, CUNTH0,CUNTH1, CUNTH2,CUNTH3 7seg DECODE & DRIVE CIRCUIT
La,Lb,Lc,Ld,Le,Lf,Lg, Ha,Hb,Hc,Hd,He,Hf,Hg
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED +5V SWENBL* K1 +5VSW
EMERGENCY SW RSW BD ASSY
INR,OUTR,FAST,IMSR,INLMR,EXLMR,RANGE, UPR,DNR,FWDR,BWDR,POSL,PRACTICE EMERGENCY
EMERGENCY SW
TCH*
TOUCH SW DETECT CIRCUIT
CN6 TSW TSNS,CONNECTOR
TOUCH SW ASSY
NAA2 ASSY (CN2)
CN8 MICOUT MIC+,MIC,MICGND
CN7 MIC MIC ASSY
23
TABLE/GANTRY
2-2
STATIONARY GANTRY (continued) Illustration 24 RCV Block Diagram

R CV BD ASSY CN1 TGP +24V,+5V,GND,SHIELD,XLED,PLLED, A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 CN2 DISP
TGP BD ASSY (CN9)
CN8 XDISP +24V,XLED,PLLED CN5 LG LG1 BD ASSY FLED LG2 BD ASSY SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED +5VSW TEMP+5V K2 K1 RENBL CN4 LSW RSW BD ASSY CN3 RSW LSW BD ASSY XDISP BD ASSY
+24V,+5V,SHIELD,FLED,SLED CUNTL0,CUNTL1, CUNTL2,CUNTL3, CUNTH0,CUNTH1, CUNTH2,CUNTH3 7seg DECODE & DRIVE CIRCUIT
La,Lb,Lc,Ld,Le,Lf,Lg, Ha,Hb,Hc,Hd,He,Hf,Hg
+5V SWENBL*
POSL,INLMR,RANGE,PRACTICE (+5VSW) INR,OUTR,FAST,EXLMR,UPR,DNR,FWDR,BWDR (TEMP+5V) CN10 EOFF SW EMERGENCY
EMERGENCY SW CN6 TSW TSNS,CONNECTOR
TCH*
TOUCH SW DETECT CIRCUIT
TOUCH SW ASSY
NAA2 ASSY (CN3)
CN9 MICOUT MIC+,MIC,MICGND
CN7 MIC MIC ASSY
24
TABLE/GANTRY
2-2
Display Board and XDISP board Display board is the display located at middle upper side of the Gantry front cover. XDISP board is the smaller display located at middle upper side of the Gantry rear cover.
Gantry Switches Located at left and right of both front and at rear Gantry cover. These switches are used to tilt manage Gantry tilt, table and cradle movement and positioning light.
Gantry Microphone Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.
Touch Sensor Located at front and at rear upper side of the Gantry cover to protect patient during tilt. When touch sensor at the front cover hit something during forward tilt, the tilt stops. When touch sensor at the rear cover hit something during backward tilt, the tilt stops.
Breath Navi Located at upper portion of the entrance of the Gantry opening, at the front and the rear side to notify patient to breath, hold breath and show remaining scan time.
Emergency Switch Located at left and right of both front and at rear Gantry cover.
SUB Board The SUB board contains control circuitry for Gantry tilt, table elevation and servo amp for axial motor. Control these functions according to the command received from TGP board. Contains also connection to Gantry cover switches. See Illustration 25.
25
TABLE/GANTRY
2-2
STATIONARY GANTRY (continued) Illustration 25 SUB Board Block Diagram
26
TABLE/GANTRY
2-2
TGP BOARD There are three micro processors on the TGP Board. One controls the GANTRY Rotation, one controls the Table and the other controls the arbitration of commands from the gantry processor, table processor, scan processor (located on the OGP board) and the OC. See Illustration 26. D Processor A for GANTRY CONTROL (GP) D Processor B for TABLE CONTROL (TP) D Processor C for MANAGEMENT (MP) The Management processor communicates with the OC through serial links. The other processors (Gantry Processor and Table Processor) communicate with the Management Processor, and can receive commands from the OC via the Management Processor. The Gantry Processor and Table Processor also contain a serial communication port which is not used for communication between OC or other Processors, but rather is used for Data correction from the sensor switches. The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the following functions: D AXIAL Drive control D TILT Drive control D CRADLE IN/OUT Drive control D IMS IN/OUT Drive control D TABLE Elevation Drive control D GANTRY Display control D Breath Navi Display control D GANTRY panel switch/Foot switch control D Error Detection
27
TABLE/GANTRY
GE MEDICAL SYSTEMS REV 13 2-2 STATIONARY GANTRY (continued) Illustration 26 TGP Block Diagram
TGP Bd PDU PDU Safety Loop Gantry Processor (uPD78310) SRAM Flash Memory G Test SW Status LED Management Processor (uPD78310) SRAM OC OC OC Direct Line Flash Memory Flash Memory Dual Port RAM Service SW M Test SW Status LED Table Processor (uPD78310) DAS Trig 9600bps SIO CT Lock &Alarm Control Breath Navi Control IMS Control Flash Add Cont
Emergency Rot Safe GPulse Rot Count 12bit DAC Rotate Control Azimuth Servo AMP C M Enc
Test 0,1 Reset SW Reset Patarn
Dual Port RAM
Slice Count
C Slip Ring Slip Ring Relay
OC
OC Comm unication
Breath Navi IMS Servo AMP IMS Pot HIT Pot TILT Pot M Enc
SRAM Flash Memory T Test SW Status LED
12bit ADC Cradle Control Table Control Tilt Control Display Control T/G SW Port Flash Add Cont
Cradle Pot Cradle Motor Driver Up/Dwn Relay Tilt Relay M Enc P,V P,V Gantry Display Gantry SW Table SW Fluoro SW Audio Amp Mic Spk
28
TABLE/GANTRY
GE MEDICAL SYSTEMS REV 13 2-2-1 TGP board Service Switches
There are five service switches at right upper side of the TGP board which are used to control the Gantry Rotation manually. Illustration 27 TGP Board Service Switches
SPD1
MNL
FIX
SVE
SPD0
SLOW
90DEG
TGP BOARD
GANTRY LEFT SIDE
SYS :
SYS OFF
System Position. When the switch is in this position, the Gantry is controlled by the Operator Console. Disable the Gantry rotation. Servo Amplifier is disabled and Static brake activated.
OFF
MNL
MNL Manual Position. When the switch is in this position, the Gantry rotation is controlled manually, by the other switches described below. ABT : Arbitrary Mode. This switch is a spring loaded switch that enables Gantry rotation toward the direction selected by the rotation Direction switch (CNT/HOME/90DEG), by the fixed speed of XXX seconds per revolution. Servo Enable. Servo Amplifier is enabled and voltage command is 0 volts, that means there is no rotation at this position.
ABT SVE
SVE : FIX :
FIX
Rotates Gantry according to the selection of the Speed Selection switches (SPD2/SPD1/SPD0 and FAST/MID/SLOW) and Direction switch (CNT/ HOME/90DEG).
29
HOME
SYS OFF
ABT
SPD2
FAST MID
CNT
TABLE/GANTRY
2-2-1
SPD2
TGP board Service Switches (continued)

FAST SPD1 MID
and
These two switches sets the rotation speed See table below
SPD0
SLOW
SPD2/SPD1/SPD0 FAST/MID/SLOW SPEED (sec/rot)

HOME CNT
SPD2 FAST 0.7
SPD2 MID 0.8
SPD2 SLOW 1.0
SPD1 FAST 1.5
SPD1 MID 2
SPD1 SLOW 3
SPD0 FAST 5
SPD0 MID 10
SPD0 SLOW 15
CNT
: Clockwise rotation
HOME : Home position (Xray tube at zero degree position) 90DEG : 90 degree position (Xray tube at 90 degree position)
90DEG
2-2-2
TGP Processors
The TGP board contains three processors:
Management Processor (MP) The Management Processor oversees the functions of the Table/Gantry. It communicates with OC and according to the message received from OC, sends corresponding commands to Gantry processor, Table processor and OGP board. The main functions of the Management processor are: D Communication with OC serial link D Communication with OGP serial link through slip ring D IMS movement control D Xray ON LED (on Gantry panel) control D Positioning Light ON LED (on Gantry panel) control D Look guide control D Practice Switch (for look guide) control D Tilt position, table height and cradle position adjustment. There is a ROM connected to management processor that contains adjustment data. The management processor reads this data, compares with the current positions and make adjustment as needed.
210
TABLE/GANTRY
2-2-2
TGP Processors (continued)
Gantry Processor (GP) The Gantry processor control the following functions: D Positioning light switch D Gantry rotation
Table Processor (TP) The table processor control the following functions: D Cradle In/Out D Gantry Tilt D Table Up/Down D Gantry Display D Gantry Switch D Interlock
211
TABLE/GANTRY
GE MEDICAL SYSTEMS REV 13 2-3 ROTATING GANTRY
The Illustration 28 shows the main components of the rotating Gantry. The functions of the parts of the stationary Gantry are as follows: OGP Board The OGP (On Gantry Processor) performs the following functions: D Xray exposure on/off control D DAS data transfer timing D Collimator control D Beam Tracking Control (For Twin System ONLY) D Positioning light control D Scan control D The automatic shutoff of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been powered down. Illustration 28 Rotating Gantry main components
PHOTO SENSOR MOTOR DRIVER MOTOR DRIVER TO TGP (SLIP RING) POSITIONING LIGHT (FOR LASER) POSITIONING LIGHT (FOR HALOGEN) TRANS- RELAY FORMER SWITCHING POWER SUPPLY 1 115VAC SWITCHING POWER SUPPLY 2 TEMP CONT ASSY 115V OGP BOARD MOTOR COLLIMATOR
SHADED PARTS IS FOR TWIN SYSTEM ONLY. GPLS
DAS
MOTOR
ENOCODER
PHOTOSENSOR
TO DAS BUFFER
RF XMT
DTRF
DAS/DETECTOR
212
TABLE/GANTRY
GE MEDICAL SYSTEMS REV 13 2-3 ROTATING GANTRY (continued)
Switching Power Supply 1 Supply power to the OGP board, DTRF board, RF transmitter and positioning light. Switching Power Supply 2 Supply power to the DAS and Temperature Control Box. Collimator Located at the exposure window of the Xray tube, controls the aperture of the Xray beam by moving the blades. Single Detector: The aperture can be 1,2,3,5,7 or10 mm. Twin Detector: The aperture can be (0.5x2,) 1x2, 2x2, 3x2, 5x2, 7x2 or10x2 mm. The Twin System contains the collimator with Zaxis beam control mechanism. Motor Driver Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP board and convert it to other type of pulses. Encoder Sends the feedback pulse to the OGP to show the moved amount of the blades. Photo Sensor Detects when the collimator blades are in 1mm aperture DAS Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed explanations are in the DAS/Detector sections. Temp Cont Assy Device that controls the Detector temperature DTRF (or DTRF2 for Twin) Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector sections. RF XMT Converts Serial signal from DTRF to RF signal. GPLS Notify TGP and OGP board when the Gantry is at zero degree tube position.
213
TABLE/GANTRY
2-4
SLIP RING
The SLIP RING transfers the following signals; D DAS Data D DAS Trigger D TGP and OGP Communication message 2-4-1 MECHANISM
This Gantry slip ring system utilizes: D ETC Slip Ring: Nine 480VAC power brushes (3 power lines x3 brushes) HSDCD Slip Ring: Twentyseven 480VAC power brushes (3 power lines x9 brushes) D ETC Slip Ring: Four 115VAC power brushed (2 power lines x2 brushes) HSDCD Slip Ring: Ten 115VAC power brushed (2 power lines x5 brushes) D ETC Slip Ring: Three ground brushes (1 ground line x3 brushes) HSDCD Slip Ring: Six ground brushes (1 ground line x6 brushes) D ETC Slip Ring: Twentyfour signal brushes (6 signal lines x 4 brushes) HSDCD Slip Ring: Thirtysix signal brushes (6 signal lines x 6 brushes) D RF transmitter / receiver modules Every slip ring has a corresponding terminator located on the opposite side of the transmitter terminal. See illustration 29. Illustration 29 Slip Ring Terminator
TERMINATE RESISTOR
SIGNAL
SLIP RING
214
TABLE/GANTRY
2-5
TABLE
The Illustration 210 shows the main components of the table. The description of the parts of the Table follows:
Table board This is an interface board between TGP board and servo amp, stepping motor driver, and table CONN board.
TBL CONN board This is an interface between Table board and potentiometers, touch sensors and latch switches. This board has only connectors. For detail information, see schematic diagrams. Illustration 210 Table
HEIGHT POTENTIOMETER PUMP FROM SUB BOARD VALVE TABLE UP/DOWN HYDRAULIC SYSTEM (*) SERVO AMP (*) Standard or Option, depending on a system.
(*) IMS POTENTIOMETER M (*)SERVO MOTOR (IMS)
(*) ENCODER FROM TGP BOARD
TABLE BOARD
TABLE CONN BOARD LATCH SWITCHES
TOUCH SENSORS FOOT SWITCHES SPEAKER E STEP MOTOR (CRADLE) SW P.S. STEP MOTOR DRIVER ENCODER M ENCODER POTENTIOMETER
FROM GANTRY NF2
215
TABLE/GANTRY
2-5
TABLE (continued)
Foot Switches Pedals that controls Table Up/Down. When the Table is raised or lowered using foot switches, there is no cradle compensation.
Hydraulic System Consists of pump, hose and cylinder. it is used for Table Up/Down.
Cradle Portion of the Table that executes longitudinal movement. It is controlled by step motor and motor driver.
IMS (Intermediate Support) Mechanism that aids the longitudinal movement in order to improve scannable range. It is controlled by Servo Amp and Motor. Some systems equips this function as a standard.
Latch Switches Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety purpose.
Potentiometers There are three potentiometers: IMS position potentiometer, height potentiometer and Encoder (tilt) potentiometer. They are used for feedback purpose.
Touch Sensors Located at under surface of the Table. They are for safety purpose.
216
TABLE/GANTRY
DAS/DETECTOR
TABLE OF CONTENTS
1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 11
11
SECTION 2 DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DAS/DETECTOR CONNECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . QCAL CHANNELS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AFTER GROW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21 21 22 24 26 28 29 210
SECTION 3 DATA ACQUISITION SYSTEM (DAS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 3-2 3-3 3-4 3-5 3-6 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CIF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAM BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DDP BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DTRF BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
31 39 310 311 315 316
DAS/DETECTOR
ii
DAS/DETECTOR
1-1
OVERVIEW
DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on the rotationary Gantry. Xray data acquired by the detector is converted to light, then to electrical signal in the detector and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends to the Operator Console for image reconstruction. The Xray exposure through the scanning object is detected by these modules, converted to light, then converted to electrical signal and sent to to the DAS. The DAS digitizes and sends this data by RF slipring and fiber optics to the Operator Console, where it is processed for image reconstruction. Illustration 11 Xray Exposure and Data Flow Block Diagram
OBJECT XRAY
XRAY TUBE
DETECTOR
DATA ACQUISITION SYSTEM
DAS Data
DATA PROCESSING UNIT
Illustration 12
Xray Exposure and DAS/Detector
XRAY TUBE
XRAY BEAM DETECTOR DAS

11 DAS/DETECTOR
12
DAS/DETECTOR
SECTION 2 DETECTOR
2-1
OVERVIEW
The detector consists of housing, collimator and detector modules. The detector module is made of scintillator (Lumex crystal), photodiode and connector. When the Xray exposure is performed, the Xray enters through the collimator and hits the scintillator. The scintillator is made of a material that emits light when hit by Xray. The scintillator is in contact with photodiode so that the light generated by Xray is converted into electrical current. The generated current is sent to the DAS (Data Acquisition System) to be processed.
2-2
SPECIFICATIONS
Distance from Focus to ISO: 541 mm. Distance from Focus to Detector surface: 949.075 mm. Detector Channel Pitch: 1.15 mm. Detector Channel angle: 0.06946 degree. View Number: S S Offset: 256 views (for Twin and systems with V/R 4.0 or later), 64 views (other) Active: 972 views
Channel Distribution: TWIN A Slice 793 20 3 0 B Slice 793 20 3 0
NP Active Channel Reference Channel QCAL Channel GND Channel 717 20 3 12
NP+/NP++ 793 20 3 0
21
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 2-3 HILIGHT DETECTOR MODULE
The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 21. The Xray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator is made of Lumex Crystal, the material that emits light when absorbs Xray radiation. The Scintillator is optically coupled with Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to DAS through the connector. Illustration 21 DETECTOR MODULE FOR TWIN
COLLIMATOR (IN THE DETECTOR HOUSING) XRAY
HILIGHT MODULE
LUMEX CRYSTAL
LIGHT PHOTO DIODE
CHANNEL B CHANNEL A
CONNECTOR (TO DAS)
22
DAS/DETECTOR
2-3
HILIGHT DETECTOR MODULE (continued) Illustration 22 DETECTOR MODULE FOR SYSTEMS OTHER THAN TWIN
COLLIMATOR (IN THE DETECTOR HOUSING) XRAY
HILIGHT MODULE
LUMEX CRYSTAL
LIGHT
PHOTO DIODE
CONNECTOR (TO DAS)
23
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 2-4 CHANNEL DISTRIBUTION
The illustrations 23, 24 and 25 show the channel distribution of each system model. Illustration 23 TWIN DETECTOR CHANNEL DISTRIBUTION
1 MODULE (16 Channels)
49 MODULES
A SLICE
1~3 (3 CH) QCAL 4 ~ 13 (10 CH) REF. 3 CHANNELS
14 ~ 806 (793 CH) ACTIVE 14 ~ 806 (793 CH) ACTIVE
6 CHANNELS
807 ~ 816 (10 CH) REF. 807 ~ 816 (10 CH) REF.
1~3 (3 CH) QCAL
4 ~ 13 (10 CH) REF.
3 CHANNELS
6 CHANNELS
B SLICE Illustration 24 NP+/NP++ DETECTOR CHANNEL DISTRIBUTION
49 MODULES
1~3 (3 CH) QCAL
4 ~ 13 (10 CH) REF.
3 CHANNELS
14 ~ 806 (793 CH) ACTIVE
6 CHANNELS
807 ~ 816 (10 CH) REF.
24
DAS/DETECTOR
2-4
CHANNEL DISTRIBUTION (continued) Illustration 25 DUMMY NP DETECTOR CHANNEL DISTRIBUTION DUMMY
1 MOD 1 MOD 1 MOD 1 MOD
44 MODULES
1~3 (3 CH) QCAL
4 ~ 13 14 ~ 16 (10 CH) (3 CH) REF. GND
17 ~ 19 (3 CH) GND
13 CH
20 ~ 736 (717 CH) ACTIVE
25

(6 CH) GND
1 MOD 1 MOD 1 MOD
737~ 742 743~752 (10 CH) REF.
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 2-5 DAS/DETECTOR CONNECTOR
The detector module consists of 32 channels (A Slice and B Slice) for Twin and 16 channels for others. The illustrations 26 and 27 show the flexible PWB that connects detector modules to the DAS (CAM boards) and its pin configuration. Illustration 26 DAS/DETECTOR CONNECTOR FOR TWIN
48 PIN CONNECTOR D C B A 1 2 3 4 5 6 7 8 9 10 11 12
A 1 2 3 4 5 6 7 8 9 10 11 12 2SG 2SG
B 2SG 2SG
C 2SG 2SG
D 2SG 2SG
A1ch B1ch A16ch B16ch A2ch B2ch A15ch B15ch A3ch B3ch A14ch B14ch A4ch B4ch A13ch B13ch A5ch B5ch A12ch B12ch A6ch B6ch A11ch B11ch A7ch B7ch A10ch B10ch A8ch B8ch A9ch B9ch FG FG FG FG FG FG FG FG
FLEXIBLE PWB
Note SG: Signal Ground FG: Frame Ground
26
DAS/DETECTOR
2-5
DAS/DETECTOR CONNECTOR (continued) Illustration 27 DAS/DETECTOR CONNECTOR FOR SYSTEMS OTHER THAN TWIN A 1 D C B A 1 2 3 4 5 6 7 8 9 10 11 12 2 3 4 5 6 7 8 9 FLEXIBLE PWB 10 11 12 SG SG A8ch A7ch A6ch A5ch A4ch A3ch A2ch A1ch FG FG B SG SG FG FG FG FG FG FG FG FG FG FG C SG SG A9ch A10ch A11ch A12ch A13ch A14ch A15ch A16ch FG FG D SG SG FG FG FG FG FG FG FG FG FG FG
48 PIN CONNECTOR
24 PIN CONNECTOR d c b a 1 2 3 4 5 6 1 2 3 4 5 6
a CH 7 CH 5 CH 3 CH 1 FG FG
b CH 8 CH 6 CH 4 CH 2 FG FG
c CH 9 CH11 CH13 CH15 SG SG
d CH10 CH12 CH14 CH16 SG SG
Note SG: Signal Ground FG: Frame Ground
27
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 2-6 QCAL CHANNELS
The Xray exposure can move along the Zaxis. It can be due to mechanical adjustment or to tube temperature (the angle of the Xray output can vary according to the temperature). There is three channels in the left most positioned detector module that is used for Zaxis data correction. In this module there is a wedge shaped lead block, called ZWEDGE (illustration 28). The outputs of the three channels are tied together so that only one data is taken for three channels. The corresponding intensity according to the position of the Xray exposure along the Zaxis is detected (as can be seen at right side of the illustration 28), so that the system recognizes the current Xray position (along the Zaxis). There is a remaining data for Zaxis data correction in the system. Therefore, the correction is made according to the data acquired by the QCAL channels. Illustration 28
ZWEDGE
QCAL CHANNELS FOR SYSTEMS OTHER THAN TWIN
QCAL CHANNELS
X Illustration 29
GROUND CHANNEL
QCAL CHANNELS FOR TWIN

QCAL CHANNELS
A Slice
B Slice
Z
QCAL CHANNELS
XRAY INTENSITY DETECTED ACCORDING TO THE BEAM POSITION ALONG THE ZAXIS
28

A Slice XRAY EXPOSURE B Slice
XRAY INTENSITY DETECTED ACCORDING TO THE BEAM POSITION ALONG THE ZAXIS
XRAY EXPOSURE
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 2-7 AFTER GROW
The Lumex crystal scintillator has a property represented in the illustration 210. The scintillator continues emitting light even after the Xray radiation is stopped. This phenomenon is called AFTER GROW. This remaining scintillation provides incorrect data, but the system performs the error correction to eliminate this portion. Illustration 210 AFTER GROW
XRAY ON
scintillation
XRAY OFF
29
DAS/DETECTOR
2-8
HEATER AND TEMPERATURE CONTROL
The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box. Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the detector temperature. The temperature is controlled to 35 0.5 C. The illustration 211 shows its block diagram. Illustration 211 TEMPERATURE CONTROL BLOCK DIAGRAM
Thermistor Heater
DETECTOR DC24V 60W
INPUT POWER 24V DC
Driver for Heater
PS (+24V > +12V)
PS (+12V > +5V)
(OP Amp Comparator)
CPU
ROM
Switch TEMPERATURE CONT BOX
LED indication
210
DAS/DETECTOR
SECTION 3 DATA ACQUISITION SYSTEM (DAS)
3-1
OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back Board). Each box contains the set of boards as follows:
For TWIN S S S RBB CBB LBB 18 CAM boards 18 CAM boards 18 CAM boards, 2 DDP boards, 1 CIF board
The Illustration 31 shows the DAS boxes. Illustration 31 DAS (RBB, CBB, LBB) LBB ASSY CONTROL BOARDS CBB ASSY CONNECTOR (TO DETECTOR) RBB ASSY
B Slice DDP
A Slice DDP
CAM ASSY
#36
#19 FLEXIBLE CABLE
CAM Assy nomenclature: Odd Number CAM ASSYs represent A Slice Even Number CAM ASSYs represent B Slice
31
DAS/DETECTOR
3-1
For systems other than Twin S S S RBB CBB LBB 9 CAM boards 9 CAM boards 9 CAM boards, 1 DDP board, 1 CIF board
The Illustration 32 shows the DAS boxes. Illustration 32 DAS (RBB, CBB, LBB) LBB ASSY CBB ASSY CONNECTOR (TO DETECTOR) RBB ASSY
CONTROL BOARDS CAM ASSY
FLEXIBLE CABLE
The DAS channels number is as follows: TWIN NP Active Channel Reference Channel QCAL Channel Ground Channel 717 10 + 10 3 3+3+6 NP+/NP++ 793 10 + 10 3 0 A Slice 793 10 + 10 3 0 B Slice 793 10 + 10 3 0
32
DAS/DETECTOR
3-1
The illustrations 34 and 33 show DAS block diagram for Twin and systems other than Twin, respectively. The data coming from the detector is taken by the CAM boards, sequentially channel by channel, digitized, converted to parallel, go through offset correction, then sent to the Operator Console. The CIF board is an interface with OGP (On Gantry Processor) receiving control and timing signals, and generates the timing signals for data gathering. The DDP board performs offset correction and generates the test pattern. Illustration 33 DAS/Detector Structure for TWIN DETECTOR
A Slice B Slice CAM BOARDS
DC+12V Analog #53 #52 #51 DC12VAnalog #54 POWER DC+5V CAM SUPPLY (B Slice) (A Slice) (B Slice) (A Slice)
#6
#5
#4
#3
#2
#1
(B Slice) (A Slice) (B Slice) (A Slice) (B Slice) (A Slice)
DC +5V Digital
CIF Board Control from OGP
Control
Control
DDP Board (B Slice) 16 Bit Data to DTRF2 DDP Board (A Slice) 16 Bit ata to DTRF2 LBB ASSY
33
DAS/DETECTOR
3-1
OVERVIEW (continued) Illustration 34 DAS/Detector Structure for systems other than Twin
DETECTOR
DETECTOR MODULES
Front End Circuit for 16 channels DC +12V Analog DC 12V Analog DC +5V CAM POWER SUPPLY Gate Array Control circuit for 2 Front End
CAM BOARDS
Control Signal from OGP
DC +5V Digital
CIF BOARD
Control Signal
Control Signal
16 Bit Data to DTR
DDP BOARD
LBB ASSY
34
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 3-1 OVERVIEW (continued) Illustration 35 DAS Power Connection for Twin
CIF ASSY B SLICE DDP ASSY A SLICE DDP ASSY CAM ASSY #54 CAM ASSY #53 CAM ASSY #52 CAM ASSY #51 CAM ASSY #50 CAM ASSY #49 CAM ASSY #48 CAM ASSY #47 CAM ASSY #46 CAM ASSY #45 CAM ASSY #44 CAM ASSY #43 CAM ASSY #42 CAM ASSY #41 CAM ASSY #40 CAM ASSY #39 CAM ASSY #38 CAM ASSY #37
CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM
ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY
#36 #35 #34 #33 #32 #31 #30 #29 #28 #27 #26 #25 #24 #23 #22 #21 #20 #19
CASE
CAM ASSY #18 CAM ASSY #17 CAM ASSY #16 CAM ASSY #15 CAM ASSY #14 CAM ASSY #13 CAM ASSY #12 CAM ASSY #11 CAM ASSY #10 CAM ASSY #9 CAM ASSY #8 CAM ASSY #7 CAM ASSY #6 CAM ASSY #5 CAM ASSY #4 CAM ASSY #3 CAM ASSY #2 CAM ASSY #1
CAM Assy nomenclature: Odd Number CAM ASSYs represent A Slice Even Number CAM ASSYs represent B Slice
35
DAS/DETECTOR
3-1
OVERVIEW (continued) Illustration 36 DAS Power Connection for systems other than Twin
36
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 3-1 OVERVIEW (continued) Illustration 37 DAS Signal Connection for Twin
CIF ASSY B SLICE DDP ASSY A SLICE DDP ASSY CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY #54 #53 #52 #51 #50 #49 #48 #47 #46 #45 #44 #43 #42 #41 #40 #39 #38 #37 CN51 CN50 CN49 CN48 CN47
CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM CAM
ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY ASSY
#36 #35 #34 #33 #32 #31 #30 #29 #28 #27 #26 #25 #24 #23 #22 #21 #20 #19
CAM ASSY #18 CAM ASSY #17 CAM ASSY #16 CAM ASSY #15 CAM ASSY #14 CAM ASSY #13 CAM ASSY #12 CAM ASSY #11 CAM ASSY #10 CAM ASSY #9 CAM ASSY #8 CAM ASSY #7 CAM ASSY #6 CAM ASSY #5 CAM ASSY #4 CAM ASSY #3 CAM ASSY #2 CAM ASSY #1
CAM Assy nomenclature: CN4 CN3 CN2 CN1 Even Number CAM ASSYs represent B Slice
Odd Number CAM ASSYs represent A Slice
37
DAS/DETECTOR
3-1
OVERVIEW (continued) Illustration 38 DAS Signal Connection for systems other than Twin
38
DAS/DETECTOR
3-2
DATA FLOW
The illustration 39 shows the data flow. The Detector generates an electrical current proportional to Xray intensity. The electrical current is converted to voltage signal in the CAM board. The voltage signal is amplified to an appropriate level, converted to digital data (serial), then converted to parallel data, also in the CAM board. The offset correction of the data is performed in the DDP board. The data is then sent to to DTRE board where it is converted back to serial, conditioned and then sent to Operator Console through the RF Slip ring. Illustration 39
DAS
DAS block diagram
CAM board
Signal Conditioner Analog DATA A/D Converter
FPGA
Digital Serial data Serial/Parallel Conversion Digital Parallel data
Electrical
DETECTOR
Current
CAM control signal generator
Timing Control
Digital Parallel data
Timing Control DDP board Offset Correction
CIF board
SLIP RING
DTRF2 Board (for Twin) or DTRF Board (other than Twin)
FEC Encoder
Parallel/Serial Conversion
39
DAS/DETECTOR
3-3
CIF BOARD
The CIF board performs the following functions: D OGP Interface: exchange signals with OGP to control and synchronize the data acquisition. D Control signals: generates control and timing signals to the other boards in the DAS for data acquisition. D Zaxis beam tracking (only for Twin): controls the Xray intensity between the CAMs A and B Slices.
OGP Interface The DAS subsystem receives scan control signals from OGP board, by which the CIF board generates control signals for data acquisition. The exchanged signals with OGP are shown in illustration 310 and the functions of the signals is as follows: DTRIG : DAS trigger This is the timing signal initiates for data acquisition. AXIAL 16pulses/view SCOUT 1pulse/view DENBL : DAS enable indicates that the data is valid. H : data valid L : data invalid SDCOM : Serial Communication data from OGP to CIF (including signals, ZERO DETECT and OVER RANGE). DSCOM : Serial Communication data from CIF to OGP (including signals, ZERO DETECT and OVER RANGE). GPLS2 : Home Position H : home position L : not in home position AC/OF : Signal to indicate if the scan is active or offset. XRON : Signal to indicate that Xray exposure is On. RESET : Reset signal for microprocessor in the DAS.
310
DAS/DETECTOR
3-3
CIF BOARD (Continued) Illustration 310 CIF board block diagram for systems other than Twin to CAM CIF 24.8832 MHz CLK Generator AZCLK CAM CLK
DTRIG DENBL AC/OF SDCOM DSCOM OGP RESET
32.0000 MHz
CLK Generator
ADCLK
micro processor
CIF control circuit
GPLS2 XRON data select circuit ROM
ADTR3
ROM
SCAN MODE
ROM
CAM data
DDP
311
DAS/DETECTOR
3-3
CIF BOARD (Continued) Illustration 311 CIF board block diagram for Twin Motor Driver for Zaxis control to CAM CIF 24.8832 MHz CLK Generator AZCLK CAM CLK
DTRIG DENBL AC/OF SDCOM DSCOM OGP RESET
32.0000 MHz
CLK Generator
ADCLK
micro processor
CIF control circuit
GPLS2 XRON data select circuit ROM
ADTR3
ROM
SCAN MODE
ROM
CAM data
DDP
312
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 3-4 CAM BOARD
The CAM board performs the following functions: D Conversion of electrical current signals from the detector to voltage signals. D Signal level conditioning D Analog to Digital conversion D Serial to parallel (digital data) conversion. D Generation of the timing signals for data gathering See Illustration 312. The signal from the detector with the level proportional to the Xray intensity is fed to the CAM board. The signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data. The serial data is then sent to the control logic and converted to parallel data. The control logic also generates the timing for data gathering, so that 1 channel data is taken at a time. This part of circuit works synchronized with other CAM boards so that the data in entire DAS is taken a determined sequence. Illustration 312 DETECTOR
DAS
CAM board block diagram
CAM ASSY
Electrical Current ANALOG DATA DIGITAL SERIAL DATA
A/D Converter
32 CHANNELS
A/D Converter
CONTROL LOGIC (FPGA) DIGITAL PARALLEL DATA (TO DDP)
CONTROL SIGNALS (FROM CIF)
313
DAS/DETECTOR
3-4
CAM BOARD (Continued) Illustration 313 Control Logic (FPGA) block diagram
FPGA
CCLK master signal for CAM control from CIFside CAM 7bit data master signal for CAM control to next CAM 7bit data ADTR1 ADTR2 ADTR3 shift resistor 1CLK unit1 control
CAM control logic generator
shift resistor 2CLK
shift resistor 1CLK
SAMPLE for A/D sample generator
ACT/ REF select
FPNR
head Amp 2nd Amp. 3rd Amp.
x64 x16 SAMPLE SCLK BUSY
x4
x1
314
output data to DDP 9bit data
parallel data data selector serial / parallel conversion
Comparator
A/D
MCLK RST
unit2 control
from A/D Sdata : serial data SCLK Busy
to FPNR ranging data x 64 x 16 x 4 x 1
serial data
DAS/DETECTOR
GE MEDICAL SYSTEMS REV 13 3-5 DDP BOARD
The DDP board performs two functions: Offset data correction and test patter generation. Offset Correction The digital data coming from CAM board contains offset portion due to electronic circuitry and offset scan. The illustration 314 shows a simplified block diagram of the offset cancel circuit in the DDP board. The multiplex blocks MUX1 select inputs ports A or B according to the data type. Port A or B is selected if the data is or active respectively. These multiplexers shift data by 4 bits. Both offset and active data are 16 bits long. When first offset data comes, the multiplexers MUX2 select port B so that 0 is added (by ALU Arithmetic Logic Unit) to the offset data. The result of this operation is then latched to the block LATCH in illustration 314. From the next offset data on, the multiplexers MUX2 select input A so that the latched former result is added to new offset data. this operation is repeated 16 times, what leads to 20 bits data.Only 16 most significant bits are taken, which results in the average of the sum. This data is taken as a subtraction factor for offset correction. During normal scan operation, the average of the offset data is subtracted from the active data in the ALU. This data is then sent to a ROM for the purpose of data alteration. Illustration 314 Offset correction circuit
LATCH DATA FROM SPC function (CAM FPGA circuit) D15D12
A MUX1 B
A MUX2 B ALU DATA TO DTRF
D15D12 D11D9
A MUX1 B
A MUX2 B ALU
D3D0
A MUX1 B
A MUX2 B ALU
Test Pattern Generation The Test Pattern is for test purpose (DAS data pattern test) that checks the link between DDP board to DAS IFN board (Operator Console).
315
DAS/DETECTOR
3-6
DTRF BOARD
The DTRF (Data Transfer with Forward Error Correction) executes the following functions: D Error correction code generation D Parallel/Serial conversion D View packing D Electric to light signal conversion Illustration 315 DTRF2 for Twin
A Slice From DAS B Slice
FEC Encoder TAXI Transmitter (P/S conversion) Optical Transmitter fiber optics RF Transmitter To RF OC Receiver fiber optics
FEC Encoder
Illustration 316
DTRF for systems other than Twin
From DAS
FEC Encoder
TAXI Transmitter (P/S conversion)
Optical Transmitter fiber optics
RF Transmitter
To RF OC Receiver fiber optics
Error correction code is added for checking the transmitted data at DASIFN assy in the Operator Console to assure data accuracy. The optical transmitter converts the electric signal to light signal, which is sent to RF transmitter by cable optics. The RF transmitter sends the signal to RF receiver on the stationary gantry, where the signal is again converted to light signal and sent to Operator Console by fiber optics. For details about data communication, error correction and other information, refer to DASIFN in the Operator Console.
316
DAS/DETECTOR
XRAY GENERATOR
TABLE OF CONTENTS
SECTION SECTION 1 GENERAL DESCRIPTION I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1 1-2 GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . JEDI HIGH LEVEL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 11
11 12
SECTION 2 GENERAL DESCRIPTION II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1 2-2 2-3 2-4 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-1 A Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-2 Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-3 A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21 21 22 23 23 23 25
SECTION 3 TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 JEDI TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
31
XRAY GENERATOR
ii
XRAY GENERATOR
SECTION 1 GENERAL DESCRIPTION I
1-1
GLOSSARY
Glossary of terms used in this document:
Term
ABC AEC CAN CPU EPLD EMC FPGA
Definition
Automatic Brightness Control. Regulation loop which makes the measured brightness equal to brightness demand Automatic Exposure Control. Exposure cut off technique which uses the brightness signal to cut the exposure Controller Area Network. A network used for localized control. Control Processor Unit. Microprocessor and peripherals which run the software/firmware Erasable Programmable Logic Device. Electro Magnetic Compatibility. The EMC function prevents the generator from polluting the power source. Field Programmable Gate Array. It is programmed by the CPU core after the reset and handles all the exposure control logic including the system interface real-time lines. High voltage variations due to inverter current pulses. Typically a few percent. Software or hardware function which handles the state of a system and authorize to go to the next state upon reception of specific events. Insulated gate bipolar transistor. A type of power switch HV power inverter parallel resonant current; current in the parallel inductor HV power inverter serial resonant current; current in the serial inductor. Metal Oxide Semiconductor. A type of power switch On Gantry Processor. Unit which drives the generator in CT systems Power Distribution Unit Root Mean Square
HV Ripple State Machine
IGBT
Ilp Ilr
MOS OGP PDU RMS
11
XRAY GENERATOR
REV 12
1-2 JEDI HIGH LEVEL BLOCK DIAGRAM
GE MEDICAL SYSTEMS
JEDI GENERATOR / NP, NP+ FUNCTIONAL ARCHITECTURE

System System Interface Control Bus
Illustration 11 Jedi Generator / NP, NP+ Functional Architecture
kV Control
Heater
heater supply bus
Low Voltage Power Supply
Rotation
DC Bus AC/DC
12 XRAY GENERATOR
rotation phases
High Voltage EMC Filter Inverter
High Voltage Tank
HV Cables
CT HISPEED SERIES THEORY OF OPERATION
1 phase 3 phase power tube cooling input input
X-Ray Tube 1
2202124
GE MEDICAL SYSTEMS REV 12 Illustration 12
CT HISPEED SERIES THEORY OF OPERATION 2202124 Jedi Generator / NP++, NP++ Twin Functional Architecture
JEDI GENERATOR / Np++, NP++ TWIN FUNCTIONAL ARCHITECTURE
13
XRAY GENERATOR
14
XRAY GENERATOR
SECTION 2 GENERAL DESCRIPTION II
2-1
INTRODUCTION
Jedi is the engineering name for a family of compact high frequency XRay generators. This generator family covers a wide range of applications from mobile equipment up to vascular systems:
D D D D D
JEDI 1225 kW: JEDI 2448 kW: JEDI 3250 kW: JEDI 100 kW:
Mobile applications CT applications RAD applications VASCULAR applications
JEDI 506580 kW: RF applications
2-2
STANDARD FEATURES
Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological, fluoroscopic and CT applications. The family handles 1 ms to continuous exposures with tube currents ranging from 0mA up to 1000 mA. The generators feature the very latest technology available:
D D D
Constant potential independent of line voltage variations Power generation by a highfrequency converter (High voltage ripple: 40 kHz140 kHz) Distributed microprocessor controlled functions (CAN bus)
Other features include:

D D D
Single phase, three phase or battery power source Very low kV and mA ripple, excellent accuracies and dose reproducibility Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different tubes. Thermal load interactive integrator ensuring optimum use of the heat protection curve of the xray tube Available in various packaging configurations: gantry, undertable, cabinet Serviceability: high reliability, fast installation (no generator calibration), application error codes ensure fast troubleshooting Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required) Optional pulsed fluoroscopy
D D
D D
21
XRAY GENERATOR
2-3
APPLICATIONS
RAD
3 Points Mode 2 Points Mode 1 Point Mode 0 Point Mode AEC Tomography AET Continuous/Pulsed Fluoroscopy Rad Exposures Cinema 30 fr/s Cinema 90 fr/s ABC Variable mA Scans Low mA Fluoroscopy
Surgery
RF x x x x x x x x
x x x x x x x x x
Vascular/ Cardiac x x x x x
CT
x x x x
Legend:
AEC Automatic Exposure Control AET Automatic Tomographic Exposure ABC Automatic Brightness Control in fluoroscopy
22
XRAY GENERATOR
2-4
ARCHITECTURE
Refer to Illustration 21: Jedi Generator / Functional Architecture The Jedi family is composed of 3 elements:
2-4-1
D D D D D D D D
A Kernel
High voltage chain composed of kV control, HV power inverter and HV tank Anode rotation function Tube filaments heater function Control bus for communication between the functions DC bus for power distribution to each function Input voltage to DC conversion: AC/DC function Low voltage power supply Application software, running on the kV control board
These functions are the Jedi core. They are present in all versions of the generator. A function can be unique for all products, or can have several different releases based on product specification. Examples: The anode rotation function is available in 2 releases:
D D
low speed rotation for applications where the tube has a max rotation of 3000 rpm high speed/low speed rotation for applications where at least one of the tubes can use 800010000 rpm
The control bus is unique.

2-4-2
D
Options Depending on the Application
A System Interface which can be: CT interface RAD interface (console interface, room interface, AEC management present or not) ATLAS interface EMC function Grid function (RF, vascular) Bias function (RF, vascular) Tube management (2 tubes or 3 tubes option)
D D D D
23
XRAY GENERATOR
REV 12
GE MEDICAL SYSTEMS
JEDI GENERATOR / FUNCTIONAL ARCHITECTURE

System Interface Control Bus
Illustration 21
System
Jedi Generator / Functional Architecture
kV Control
preload (1 phase)
Heater
heater supply Low bus
Voltage Power Supply
Rotation
DC Bus AC/DC
inverter controls HV measures fil. drives
24 XRAY GENERATOR
Tube Selection
rotation phases +safeties+fans
Tube Management
rotation phases +safeties+fans
EMC Filter
High Voltage Inverter
High Voltage HV Cables Tank
CT HISPEED SERIES THEORY OF OPERATION
Grid/Bias X-Ray Tube 1 1 phase or 1 phase tube phase power cooling input input
X-Ray Tube 2
Chiller
2202124
GE MEDICAL SYSTEMS REV 12 2-4-3 A Packaging Architecture
The packaging architecture consists in a set of boxes which can be put together in several ways to make Jedi fit either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2 units distant of several meters (example: CT gantry). Refer to Illustration 22. The boxes normally consist of the following:
Auxiliaries Box
D D D
Rotation function Heater function Low voltage power supply (which can also be in the AC/DC box)
This box is always present.

Power Box
D D D D
HV tank HV power inverter kV control System interface (for the less complex system interface)

AC/DC Box
D D D
MC filter (optional) AC/DC function Low voltage power supply (which can also be in the auxiliaries box)

System Interface Box
D D
RAD interface AEC interface
This box is present in the RAD product.
25
XRAY GENERATOR
GE MEDICAL SYSTEMS REV 12 HEMIT (High efficiency motor insulated transformer)

D D
HV HEMIT Tank (transformers in high voltage) DCDisch board (to discharge the recovered energy of the rotor and securities)
This box is present with non insulated stator tubes (Performix on NP++ and NP++ Twin, for example)
Optional Boxes
D D
Tube selection Grid/Bias control
26
XRAY GENERATOR
GE MEDICAL SYSTEMS REV 12 Illustration 22 Jedi Generator / Packaging Architecture
Inverter Assembly
Dual Snub Tube HV Gate Command Board
+
KV Measure HV Tank
CT Interface
KV Control Board EMC Filter (Optional)
POWER BOX
LVPS Board (for NP and Emperor)
Heater Board
Rotation Board
Rotation Capacitor
Rotation Capacitor
(optional) AUXILIARIES BOX OPTIONAL BOXES

LVPS Board (for TIGER) AC/DC BOX RAD Interface Tube Selection 27
AC/DC Board
Rectifier Block
AEC Interface
SYSTEM INTERFACE BOX FOR THE RAD PRODUCT
Grid/Bias Control
XRAY GENERATOR
28
XRAY GENERATOR
SECTION 3 TYPICAL SIGNALS
3-1
JEDI TYPICAL SIGNALS
The following table describes the main signals of the generator. For each of them, typical values are presented for the main applications:
Signal/Application Anode Rotation: Phase P current during high speed run Phase A current during high speed run Filament Drive: Inverter current in standby 2.5 A Heater DC input voltage in standby kV Control: DC bus measure at 400 VAC ILR at full power at 400 VAC ILR at min power at 400 VAC ILP at full power at 400 VAC ILP at min power at 400 VAC 560 V
Values
(36 kW max, Qj tube)
2 A peak / 144 Hz 2 A peak / 144 Hz 3.3 A peak / 35 kHz 160V
500 A peak / 50 kHz 80 A peak / 25 kHz 150 A peak / 50 kHz 150 A peak / 25 kHz
31
XRAY GENERATOR
32
XRAY GENERATOR
APPENDIX A SYMBOLS AND CLASSIFICATION

Symbol Publication Description
4175032
Alternating Current
3351 3 3351 3N
Threephase Alternating Current
Threephase Alternating Current with neutral conductor
Direct Current
4175019
Protective Earth (Ground)
348
Attention, consult ACCOMPANYING DOCUMENTS
4175008
OFF (Power: disconnection from the mains)
4175007
ON (Power: connection to the mains)
Warning, HIGH VOLTAGE
Emergency Stop
A1
Symbol
Publication
Description Type B
4175339
Xray Source Assembly Emitting
4175009
Standby
Start
Table Set
Abort
Intercom
(on Operator Console) Power On: light on Standby: light off
A2
Symbol
Description Microphone (Mic)
Contrast
Brightness
eb_C
System storage prior to installation: Maintain storage temperature between 10 C and +60 C
acb_C System storage prior to installation: Maintain noncondensing storage humidity below 95% DO NOT store system longer than 90 days
m wuqu dagd. l pv quys C yqry o u y
Au P r r fdbacbebtPo
System storage and shipment: Maintain Air Pressure between 750 and 1060hPa
A3
GE MEDICAL SYSTEMS REV 0 CLASS 1 EQUIPMENT
Any permanently installed equipment containing operator or patient accessible surfaces must provide backup protection against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1 equipment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a person touches a broken piece of equipment or touches two different equipment surfaces simultaneously.
TYPE B EQUIPMENT CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an adequate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a breakdown in the reliability of the protective earth connection.
ORDINARY EQUIPMENT Enclosed EQUIPMENT without protection against the ingress of water.
OPERATION 0f EQUIPMENT
CONTINUOUS OPERATION WITH INTERMITTENT LOADING.

Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS. The stated permissible loading time is so short that the long term onload operating temperature is not attained. The ensuing interval in loading is, however, not sufficiently long for cooling down to the long term noload operating temperature. EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH OXYGEN or NITROUS OXIDE
CLEANING The ProSpeed S series system is NOT WATERPROOF. It is NOT designed to protect internal components against the ingress of liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped in hot water and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to remove dirt.
NOTICE
Avoid damage to equipment! Some spray and wipecleaners etch and permanently cloud clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.
A4
GE Medical Systems: Telex 3797371 P.O. Box 414, Milwaukee, Wisconsin 53201 U.S.A. (Asia, Pacific, Latin America, North America) GE Medical Systems Europe: Telex 698626 283, rue de la Minire, B.P. 34, 78533 Buc Cedex, France

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Technical Publications

CT HiSpeed Series Theory of Operation

Copyrighte 1998, 1999, 2000, 2001 by General Electric Company

GE MEDICAL SYSTEMS REV 0

CT HISPEED SERIES THEORY OF OPERATION 2202124

D THIS SERVICE MANUAL IS AVAILABLE IN ENGLISH ONLY.

D CE MANUEL DE MAINTENANCE NEST DISPONIBLE QUEN ANGLAIS.

D ESTE MANUAL DE SERVICIO SLO EXISTE EN INGLS.

GE MEDICAL SYSTEMS REV 0

CT HISPEED SERIES THEORY OF OPERATION 2202124

GE MEDICAL SYSTEMS REV 0

CT HISPEED SERIES THEORY OF OPERATION 2202124

IMPORTANT! . . . X-RAY PROTECTION

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

GE MEDICAL SYSTEMS REV 0

CT HISPEED SERIES THEORY OF OPERATION 2202124

OMISSIONS & ERRORS

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

LIST OF EFFECTIVE PAGES

i 11 to 13 21 to 216 i 11 21 to 210 31 to 316 i 11 to 13 21 to 27 31

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

Primary Reason for Change

DAS/Detector System Operator Console Table/Gantry DAS/Detector Xray Generator

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

SECTION 2 POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SECTION 4 SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GE MEDICAL SYSTEMS blank

CT HISPEED SERIES THEORY OF OPERATION 2202124

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

SECTION 1 GENERAL DESCRIPTION

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

HARDWARE CONSTITUTION OF NP, NP+, NP++ AND TWIN

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

GE MEDICAL SYSTEMS REV 14 Illustration 11

CT HISPEED SERIES THEORY OF OPERATION 2202124 System Block Diagram

CAN Bus (Control Bus)

Gantry Rotative Block

High Voltage Inverter

High Voltage Tank

Temperature Controller Detector

Step Motor Encoder

Cover Switches Pump/Valve for Gantry Tilt Servo Motor Encoder

Gantry Stationary Block

CDROM 5 MOD Host Processor

AC 115 V AC 380 480 V

Power Distribution Unit (PDU)

Table Board Raw Data Disk DBPCI Power Supply (DC 24 V)

Step Motor Driver

Intermediate Support (IMS)

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124

SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.

Scan Time Scan Time [sec]

Standard (NP, NP+) 1.0 (Half scan) 1.5 2.0 3.0

For 50 cm or 45.5 cm scan FOV

GE MEDICAL SYSTEMS REV 14

CT HISPEED SERIES THEORY OF OPERATION 2202124