VLSICore deals with VLSI design on SoC / ASIC / FPGA design flows.

It includes, Digital Logic design, Full-Custom/Semi-Custom design. Microprocessors, DSP, Telecom more. Nano Technology: 90nm, 45nm and beyond. Foundry: TSMC, UMC, CSM, IBM, Tower Standard / IO Cell library preparation, Intellectual Property [Memories, SRAMs, DRAMs, PCI, USB, Audio/Video CODEC], VDSM/UDSM. Verilog, PLI, VHDL, EDIF, System Verilog, SystemC Design Entry, Simulation, Formal Verification, Synthesis. Floorplanning, HF Net Synthesis, Placement, Clock Tree Synthesis, Routing, Physi cal Verification, RC Extraction, DFM, OPC, Tape-Out. Shell, Perl, Tcl, Tk/Tix, Scheme, C/C++, API, ... Analog design, SPICE, Simulation, RF, PLL, High Speed CMOS, MEMS, ... DFM (Design for Manufacturing) EDA: Synopsys, Cadence, Mentor, Magma, Xilinx, Altera, Atmel, ... Open Source EDA tools, Open Source : ASIC design and technology. 1. Design Engineer: Takes specifications, defines architecture, does circuit design, runs simulation s, supervises layout, tapes out the chip to the foundry, evaluates the prototype once the chip comes back from the fab. 2. Product Engineer: Gets involved in the project during the design phase, ensures manufacturability, develops characterization plan, assembly guidelines, develops quality and relia bility plan, evaluates the chip with the design engineer, evaluates the chip thr ough characterization, reliability qualification and manufacturing yield point o f view (statistical data analysis). He is responsible for production release and is therefore regarded as a team leader on the project. Post production, he is r esponsible for customer returns, failure analysis, and corrective actions includ ing design changes. 3. Test Engineer: Develops test plan for the chip based on specifications and data sheet, creates characterization and production program for the bench test or the ATE (Automatic Test Equipment), designs test board hardware, correlates ATE results with the b ench results to validate silicon to compare with simulation results. He works cl osely with the product engineer to ensure smooth release to production and post release support. 4. Applications Engineer: Defines new products from system point of view at the customer s end, based on mar keting input. His mission is to ensure the chip works in the system designed or used by the customers, and complies with appropriate standards (such as Ethernet , SONET, WiFi etc.). He is responsible for all customer technical support, firmw are development, evaluation boards, data sheets and all product documentation su ch as application notes, trade shows, magazine articles, evaluation reports, sof tware drives and so on. 5. Process Engineer: This is a highly specialized function which involves new wafer process developme nt, device modeling, and lots of research and development projects. There are no quick rewards on this job! If you are R&D oriented, highly trained in semicondu ctor device physics area, do not mind wearing bunny suits (the clean room unifor ms used in all fabs), willing to experiment, this job is for you. 6. Packaging Engineer: This is another highly specialized job function. He develops precision packaging technology, new package designs for the chips, does the characterization of new

packages, and does electrical modeling of the new designs. 7. CAD Engineer: This is an engineering function that supports the design engineering function. H e is responsible for acquiring, maintaining or developing all CAD tools used by a design engineer. Most companies buy commercially available CAD tools for schem atic capture, simulation, synthesis, test vector generation, layout, parametric extraction, power estimation, and timing closure; but in several cases, these to ols need some type of customization. A CAD engineer needs to be highly skilled i n the use of these tools, be able to write software routines to automate as many functions as possible and have a clear understanding of the entire design flow.