eTEC HV56 Thin Film Thermoelectric Cooler Thin-Film

Data Sheet
Description
The Nextreme eTEC HV Thermolectric Cooler family i t d f il introduces a new class of RoHS compliant l f R HS li t thermoelectric coolers to address applications with high heat flux requirements. The eTEC HV56 cooler can produce 4.8 watts or 75 W/cm2 of cooling at 25C. At 85C, these values increase to 6.0 watts and 95 W/cm2, respectively. The size, input power requirements, heat pumping capability, and speed of this device make it ideal for thermal management of sensors, photonics, and thermal cycling applications

eTEC HV5 Data Sheet 56 t

Features Part Number Options

Part Number HV2004 HV2005 Description Au Wire Bondable d A Wi B d bl pads Soldered 32 AWG Ni Plated Cu wires 6 watts maximum cooling @ 85C 75 W/cm2 heat pumping capability Small 3.12mm X 3.31mm footprint Extremely thin 0.62mm profile <2ms response time RoHS compliant devices

Performance Values (Typical)

Hot Side Temperature Qmax (Watts) Tmax (C) Imax (Amps) Vmax (Volts) Q
max

Assembly Conditions
Time above 290C Peak Assembly Temperature 60 sec 325C 6.0 60 0.9 10.8 95 9.2 16

25C 4.8 50 1.0 8.8 75 8.4 13

85C

Operating Conditions
Maximum Operating Temp. 150C

/Area (W/cm2)

Relectrical () Rthermall (K/W) h

APS0016 rev 3.0

Contact info@Nextreme.com for more information

Nextreme Thermal Solutions, Inc. | www.nextreme.com | In Europe: www.nextreme.eu

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eTEC HV56 Thin-Film Thermoelectric Cooler

Data Sheet
60 I = 1.00 A 50 40 I = 0.55 A I = 0.35 A I = 0.20 A I = 0.10 A 30 20 10 0 0 1 2 3 4 5 6 50 40 60

T vs Qc at 25C

T vs Qc at 85C
I = 0.90 A I = 0.50 A I = 0.32 A I = 0.18 A I = 0.09 A

T (K K)

T (K K)

30 20 10 0 0 1 2 3 4 5 6

eTEC HV5 Data Sheet 56 t

Qc (W)

Qc (W)

COP vs Qc at 25C
7.0 5 deg DT 6.0 5.0 4.0 10 deg DT 15 deg DT 20 deg DT 25 deg DT 6.0 5.0 4.0 7.0

COP vs Qc at 85C
5 deg DT 10 deg DT 15 deg DT 20 deg DT 25 deg DT

CO OP

CO OP

3.0 2.0 1.0 0.0 0 1 2 3 4 5 6

3.0 2.0 1.0 0.0 0 1 2 3 4 5 6

Qc (W)

Qc (W)

Product Dimensions (mm) General Information

Au on the top and back surfaces Au wire bondable pads Positive terminal marked as shown

Definitions
Qmax

The maximum amount of heat that the eTEC device can pump when operating at Imax Tmax The maximum temperature difference the eTEC device can produce Imax The current that produces Tmax Vmax The lt Th voltage th t produces Tmax that d COP Coefficient of Performance (Heat Pumped / Input Power) Rthermal Thermal resistance Relectrical Electrical resistance
APS0016 rev 3.0

Contact info@Nextreme.com for more information

Nextreme Thermal Solutions, Inc. | www.nextreme.com | In Europe: www.nextreme.eu

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