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Introduction
Nanolithography is the branch of nanotechnology concerned with the study and application of fabricating nanometer-scale structures, meaning patterns with at least one lateral dimension between the size of an individual atom and approximately 100 nm. Nanolithography is used during the fabrication of leading-edge semiconductor integrated circuits (nanocircuitry) or nanoelectromechanical systems (NEMS). As of 2012, nanolithography is a very active area of research in academia and in industry.
Resolution
K1 R NA
K1 is the system constant is the wavelength of the light NA = 2 ro/D, is the numerical aperture
SPM Lithography
STM can move atoms around on a surface.
Iron on Copper
Iron on Copper
1. Atomic Manipulation
2. Mechanical and Termomechanical Pattering 3. Local Oxidation
1. Atomic Manipulation
SPM probe tip used to push or pull a particle Push: Electric field and dipole moment of atom lead to potential energy gradient Pull: Chemical binding force between tip and atoms or Magnetic interactions
Pick-up of magnetic beads with the magnetizable tip in the presence of an external magnetic field
Positioning single atoms with scanning tunnelling microscope. Eigler, D. M. Nature 1990, 344, 6266
The scanning tunneling microscope (STM) at low temperature. (4K) to position 35 Xe atoms on a single-crystal Ni surface. THIS IS FUN!!!
2. Local Oxidation
Voltage bias between probe tip and sample Intense electric field Local oxidation Silicon: Growth of silicon oxide from crystal Si Electric-field-enhanced oxidation
Nano-oxidation
HF development
Nanotrench on Silicon
Local Electrodeposition
Dip-Pen Lithography
Tip of an atomic force microscope is used to deposit molecules through the water meniscus that forms naturally between the tip and the substrate
The tip-substrate contact time and thus the scan speed influence DPN resolution.
by controlling the rate of ODT transport from the tip to the substrate.
Diagram illustrating thermal dip pen nanolithography. When the cantilever is cold (left) no ink is deposited. When the cantilever is heated (right), the ink melts and is deposited onto the surface. (Journal of the American Chemical Society, 128(21) pp 6774 - 6775 , 2006)
Polystyrene Beads
as Mask Si Substrate
2. Deposit Metal
3. Bead Removal
(toluene, tape)
Top View
Side View
Targeted Pattern
Soft lithography
Soft lithography represents a nonphotolithographic strategy based on self assembly and replica molding for carrying out micro- and nanofabrication 1. Generate patterns and structures with feature sizes ranging from 30 nm to 100 mm 2. Convenient, effective, and low-cost
Xia, Y. N. and Whitesides, G. M. Soft Lithography. Annu. Rev. Mater. Sci. 28, 153-184 (1998)
Process Schematic
A prepolymer (2) covering the master (1) is cured by heat or light and demolded to form an elastomeric stamp (3), which is inked by immersion (4) or with an ink pad (5) and printed onto the substrate (6), forming a selfassembled monolayer, which is transferred into the substrate by a selective etch. Scanning electron micrographs show the master, image of the stamp, and the printed and etched pattern.
Nano-Imprint Technology
Nanoimprintlithography patterns a resist by deforming the resist shape through embossing (with a mold), rather than by altering resist chemical structures through radiation (with particle beams). After imprinting the resist, an anisotropicetching is used to remove the residue resist in the compressed area to expose the underneath substrate. 10nm diameter holes and 40nm pitch in PMMA can be achieved on Sior a metal substrate and excellent uniformity over 1 square inch.
Ko, S. H., et. al, Nano letters, Vol. 7, No. 7, p1869, 2007
Issues
Production of templates Defect control
Magnetolithography
Nanostencil Lithography
Stencil lithography is a novel method of fabricating nanometer scale patterns using nanostencils, stencils (shadow mask) with nanometer size apertures. It is a resist-less, simple, parallel nanolithography process, and it does not involve any heat or chemical treatment of the substrates (unlike resist-based techniques).
AFM Lithography
Undercut
AFM Bulldozing
Developing
The AFM tip is used to "bulldoze" through a top layer of resist. Submersion in developer produces an undercut in the lower layer of resist. The top layer then serves as a shadow mask for deposition. After removal of resist, the deposited nanostructure remains. For nanocontact printing, the initial structuring is performed in parallel with a contact mask.
Depositing
Lift Off
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