Presented By: harsh patel

INTRODUCTION

Electronics with out silicon is unbelievable, but

it will come true with evolution of diamond or
carbon chip. Now-a-days we are using silicon
for manufacturing of electronic chips. It has
many disadvantages when it is used in power
electronic applications, such as bulk size, slow
operating speeds, etc By using carbon as
manufacturing material, we can achieve
smaller, faster and stronger chips

What isDiamond chip?

Diamond

chipis nothing
but carbon chip.

Carbon chip is an electronic

chip manufactured on a
diamond structural carbon
wafer.

The major component using

carbon isCARBON
NANOTUBE

WHAT IS A CARBON
NANOTUBE?
Carbon nanotubes were
discovered in 1991.
It is a nano - size cylinder
of carbon atoms.
They are made of one or
several concentric walls
in which carbon atoms
are arranged in
hexagonal pattern,
measuring several tens
of microns in length and
less than a few
nanometres in diameter

HOW NANOTECHNOLOGY
WORKS?
Imagine a sheet of
carbon atoms, which
would look like a sheet
of hexagons.
If you roll that sheet
into a tube, you'd have
a carbon nano tube.
Carbon nano tube
properties depend on
how you roll the sheet.

CARBON FEATURES.
Carbon will succeed

silicon as the
predominate
semiconducting material
for the integrated circuits
of the future.
Carbon--which sits just
above silicon on the
periodic table can
surpass silicons abilities
in thermal performance,
frequency range and
perhaps even
superconductivity.

 One-dimensional carbon-

1nm-diameter nanotubes-could solve digital silicon's

speed woes.
Nanotubes will appear
first as printable "inks"
that are 10 times faster
than competing organic
transistors.
zero-dimensional carbon-60-atom, hollow spheres
of carbon called
fullerenes--could answer
silicon's inability to attain
high-temperature
superconductivity

CARBON TRANSISTORS
Transistors less than one-quarter

the size of the tiniest silicon ones and potentially more efficient - can
be made using sheets of carbon
just one-tenth of a nanometre
thick, research shows.
The transistors are made of
graphene, a sheet of carbon atoms
in a flat honeycomb arrangement.
Graphene makes graphite when
stacked in layers, and carbon
nanotubes when rolled into a tube.
Graphene also conducts electricity
faster than most materials since
electrons can travel through in
straight lines between atoms
without being scattered. This could
ultimately mean faster, more
efficient electronic components
that also require less power.

When placed a piece of

graphene on top of
silicon and positioned
this over a metallic
grate.
Acid was used to
dissolve the silicon,
leaving graphene
suspended across 500
nm gaps.
A transmission electron
microscope then
revealed it is covered in
tiny ripples, which keep
the material stable.
The ripples extend about
1 nm up and down and
are around 25 nm
across. It's not flat at all.

Advantages
SMALLER COMPONENTS ARE POSSIBLE
As the size of the carbon atom is small compared with

that of silicon atom, it is possible to etch very smaller lines

through diamond structural carbon. We can realize a
transistor whose size is one in hundredth of silicon
transistor.
IT WORKS AT HIGHER TEMPERATURE
Diamond is very strongly bonded material. It can
withstand higher temperatures compared with that of
silicon. At very high temperature, crystal structure of the
silicon will collapse. Butdiamond chipcan function well
in these elevated temperatures.
Diamond is very good conductor of heat. So if there is any
heat dissipation inside the chip, heat will very quickly
transferred to the heat sink or other cooling mechanics.

FASTER THAN SILICON CHIP

Carbon chip works faster than silicon chip. Mobility

of the electrons inside the doped diamond structural

carbon is higher than that of in he silicon structure.
As the size of the silicon is higher than that of
carbon, the chance of collision of electrons with
larger silicon atoms increases. But the carbon atom
size is small, so the chance of collision decreases.
LARGER POWER HANDLING CAPACITY
For power electronics application silicon is used, but
it has many disadvantages such as bulk in size, slow
operating speed, less efficiency, lower band gap etc
at very high voltages silicon structure will collapse.
Diamond has a strongly bonded crystal structure. So
carbon chip can work under high power
environment.. We can connect high power circuit
direct to thediamond chip

CONCLUSION

Thusdiamond chipreplaces the need of

silicon in every aspect in future generations