WELCOME

TWO-STEPPED LASER ASSISTED

MICROGRINDING OF CERAMICS

GUIDE :
FYZAL.B
ASSISTANT PROFESSOR
MECHANICAL DEPARTMENT
YCET

PRESENTED BY:
SANOOJ.N
S7,7253

CONTENTS
INTRODUCTION
PROBLEM FORMULATION & REMEDY
TWO STEPPED LASER ASSISTED
MICRO GRINDING
MECHANISM
EXPERIMENTAL SETUP
EXPERIMENTS
RESULTS
CONCLUTIONS
REFERENCES

INTRODUCTION

Micro- components
Ceramic materials

Applications of ceramic micro- components

Micro-Grinding
Micro grinding of ceramics

PROBLEM FORMULATION AND REMEDY

PROBLEM:
Conventional grinding process is generally done at High surface
cutting speed & low depth of cut , this increases the machining time.
Tool wear is high
REMEDY:
In order to decrease the machining time & thus to increase
productivity, a two stepped grinding strategy can be adopted.
First step is Rough grinding, & second step is Finish grinding.
This can be applied only to particles at Macro level, since rough
grinding of a ceramic component will cause tool failure due to the
catastrophic failure of the fragile micro grinding tool.
So a two stepped laser assisted micro-grinding technique is used
for the micro- grinding of ceramic components.

TWO-STEPPED LASER ASSISTED

MICRO-GRINDING

A Laser is incorporated into the two stepped grinding

technique.
Grinding forces is reduced by locally weakening the
ceramic material through introduction of thermal cracks
& subsequently removing it mechanically.
Thermal cracks are induced by LASER irradiation.
Material is then removed by two stepped
Micro -grinding.

MECHANISM

EXPERIMENTAL SETUP
The laser assisted micro grinding machine used in this work.
This machine consist of :
A variable high speed spindle with
rotational speed up to 80,000 rpm.
Cutting speed up to 200 mm/min.
A relative low power laser (max 35W)
No coolant is used in this experiment.
Laser
Laser spot size 280 m
Laser power 15W

Workpiece & tool material:

workpiece size
: 25mm (L) * 25mm (W) *3.75mm (D)
workpiece material : Silicon Nitride (ceramic material)
Tool
: Abrasive diamond grinding pencil of
800m(0.8mm) diameter

o Under these conditions , the maximum thermal stress is 732 Mpa ,

which is higher than the fracture stress of 300-400 Mpa for
silicon nitride.

EXPERIMENTS
LASER SCANNING

From fig(1) : (Optical micrograph)

- The depth of heat affected region is about 30 m.
- A thin layer of amorphous material is formed.
From fig(2) : (SEM Micrograph)
- Shows laser induced crack on the surface of silicon nitride specimen.
- These cracks weaken the material locally.

Micro grinding

micro grinding at different depth of cut as listed in table (1).

The object was to grind a feature of dimensions 8 mm(L) * 0.8 mm(W) * 50 m(D).
The feed rate was kept constant 50 mm/min in all tests.
These grinding conditions were chosen from a set of preliminary tests
where maximum allowable grinding force was limited to 25N.

Measured responses
The measured response includes the maximum & average resultant grinding force,
surface roughness , tool wear & groove profile.
.

RESULTS
GRINDING FORCE

10

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SURFACE ROUGHNESS.

> fig(a) shows

significant rubbing
of the tool end face.

> fig(b) shows few rubbing is only

observed with laser assist

12
TOOL WEAR

13

GROOVE DIMENSIONS

CONCLUSIONS

14

1. The resultant grinding forces are lower with laser assist under all
conditions.
2. The groove surface roughness is comparable for the cases
with and without laser assist.
3. Tool wear is less with laser assist than without it.
4. Higher depths of cut.

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REFERENCES
1. Laser-assisted micro grinding of ceramics
M. Kumar a, S. Melkote a,*, G. Lahoti (1)b
CIRP Annals - Manufacturing Technology 60 (2011) 367370
2. Laser assisted micro grinding of high strength materials
W Chang1, a, X Luo1,b, Q Zhao2,c J Sun1,d and Y Zhao2,e
Key Engineering Materials Vol. 496 (2012) pp 44-49
3. Samant AN, Dahotre NB (2009) Laser Machining of Structural CeramicsA
Review. Journal of the European Ceramic Society
29:969993
4. Westkamper E (1995) Grinding Assisted by Nd:YAG Lasers. Annals of the CIRP
44:317320

THANK YOU.