Do Minh Nghiep

Materials Science Center

Electron Microscopy
and Diffraction
 6. Scanning Electron Microscope (SEM)
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 Content
Classification
Operating principles
Components
Characteristics
Imaging process
Applications

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 Multiform

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For research: JEOL SEM 6335F

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 Large chamber
SEM

MIRA SE for large and

non-conductive samples
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 Portable Mini SEM

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 AutoEverything

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 Mini-SEM vs OM

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 Mini-SEM vs SEM

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 Mini-SEM vs TM-1000

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Operating principles

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 Schematic principals of SEM

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 Construction schema

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 Components

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Principal components

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 Measurement system

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 Detectors

A number of different detectors can be incorporated

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 Side-mounted
detector

The shadow produced in an

SEM is determined by the
position of the detector, but the
view is a “beam’s eye” view as
if one were looking down the
column
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 In-lens detector
of LEO Gemini
Column

A detector placed within the column is known as an “in-lens”

detector and produces a very different image compared to a
conventionally located detector
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 SE detector

Side-mounted: blurred In-lens: sharf surface

surface
 SE detector

Side-mounted: blurred In-lens: sharf surface

surface
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 Scanning system
The basic premise
of an SEM is that
signal produced
from a scanned
area of the
specimen is
displayed as an
image with the
exact same scan
pattern on a CRT

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 Scan coils

The scan pattern on

the specimen is
created by a set of
deflection coils in the
column that move the
beam in a coordinated
X/Y pattern. This is
referred to as a scan
or “raster” pattern.

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 Scan generator

The scan generator

coordinates the
movement of the
primary beam with the
movement of the e-gun
in the back of the CRT

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 Cathode Ray Tube-CRT

Cathode Ray Tube accelerates electrons towards the phosphor coated screen
where they produce flashes of light upon hitting the phosphor. Deflection coils
create a scan pattern forming an image in a point by point manner
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 Color Cathode Ray Tube

Color CRTs usually have three separate e-guns, one

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each for red, green and blue (RGB) 26
 Color Cathode Ray Tube

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 SEM characteristics

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 Magnification

Magnification is accomplished by scanning a progressively smaller

portion of the specimen and displaying the image on the CRT. Thus
total magnification is square area of CRT divided by area scanned.
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 Focusing
and
sharfness
In contrast focus is
accomplished by bringing
the beam to its crossover
point on the surface of the
specimen. In this way
focus and magnification
are completely separate
from one another in the
SEM.

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 The depth of field

In the TEM the specimen lies very close to the objective lens
resulting in a relatively large half angle of illumination. In SEM since
the image is not formed by an objective lens the half angle can be
very small resulting in a large depth of field.
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 Magnification
and
sharfness

10X
110X
200X
400X
An SEM focused at high 4K
magnification will still be in 16K
focus at low magnification
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 Resolution and
depth of field

Strong lens: Weak lens:

Small probe size, high Larger probe size, low
resolution, short working resolution, long working
distance and shallow depth distance, and larger depth
of field of field
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 Aperture and
depth of field

A smaller final lens

aperture can reduce the
half angle and therefore
increase the depth of
field. This is true on a
relatively strong lens
which has a fairly short
working distance and
therefore high resolution.

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 Imaging process

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 Imaging signals

The SEM forms an

image by
generating a
number of signals
as a result of the
beam interacting
with the specimen.

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 Image quality
§Signal can be increased by:
- Creating more beam specimen interactions
§
§Noise can be reduced by:
- Cooling electronics
- Keeping detectors settings to a minimum
§
§Signal/noise ratio can be increased by:
- Placing detector closer to source of signal
- Slowing down the scan
(collect more signal per unit time)
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 The
noises

The SEM is a probe forming (e- beam) and signal detecting device.
By developing an image created in a point by point fashion an
important factor is the signal to noise (S/N) ratio. The signal being the
result of the beam interacting with the specimen and the noise being
the result of imperfections in the electronics of the detector and
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Effect of sample roughness

Although the same amount of signal is produced throughout the

specimen the topography of the surface will allow differing amounts
of signal to reach a detector placed off to the side.
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 Application of SEM

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 Observation of
microstructure
and topography
by SE1, SE3,
SE4, BSE (left)
and only SE1
(in-lens, right)

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Recrystallized twins in Cu-Sn
(BSE image)

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 Test of welding cracks

SEI: topography contrast BSEI: Z contrast

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 Distribution of Cu in welded
steels (BSEI, Z contrast)

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Element
analyze EDS
and
imaging

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Scan lines in welding zone

Cu atom diffused into stell grain boundaries due to high

welding temperature and holding time.
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 Element imaging (0-100%) of
welding zone

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Element imaging (0-20%) of welding
zone

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 Observation of multilayer
binding (SEI, TiN-AlN on steel)

50 layers of
TiN-AlN on
steel surface
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 Analyze of fracture surface

Alumina , in - lens detector ,

100 kX

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Analyze of fracture surface

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Analyze of fracture surface

Ductile
dimple
fracture

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Analyze of fracture surface

Fatigue crack

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 Analyze of fracture surface

Intragranular
ductile failure

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Techniques of surface characterization

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Techniques of surface characterization

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Resolution and information depth

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