Professional Documents
Culture Documents
Topics Covered
Whats in a name? Specification Schematic PCB Layout Assembly Testing Support Implementing Lessons Learned Questions and discussion
A Beagle is:
Like Tux, non threatening Curious Loyal Fun And gives back as much as it receives
So, we need an acronym Bring your own peripherals Entry-level ARM Cortex-A8 Graphics & DSP Linux and open source Environment for SW innovators
The Goals
Get OMAP3530 into peoples hands Low Cost <$150
Under the spousal radar Reach as many people as we can
Small Size
Keeps the cost down Cool Factor
Internally focused
Cortex-A8 + NEON DSP 3D Graphics Accelerators
S-Video Keypad 2 Serial Ports SD/MMC Ethernet Camera 128MB DDR 128MB NAND USB
Host OTG
COST: $149
The Schematic
Play It Safe
Leverage everything we can
Used OMAP35xx EVM as base
Keep the component count low Use what is proven to work Leave off what is not needed
Leveraged Advantages
OMAP35xx Processor Symbol/Design verified TWL4030/TPS65950 Symbol/Design verified
Removed a lot of features here
SD/MMC Verified DVI-D verified UART Verified Lowered the overall risk
PCB Layout
Rules We Used
PCB Design PCB FAB
PCB ASSEMBLY
TI
Memory Vendors
Failure to include the fab and assembly team members can prove costly since choices made early in the design will adversely impact the final cost of the assembled board
The Challenges
OMAP35xx Package
.4mm Pitch Routing
TPS65950(TWL4030)
.4mm pitch PMIC
OMAP3530 Package
Best
Via-in-Pad
Places the via directly in the BGA pad Greatly improves board routing Has special requirements for manufacturability
Given a 10mil BGA pad Use a 4mil microvia Laser drilled Via must be filled or capped to minimize void formation Via-fill Material Check with board fabricator for their preferences Fill material can be conductive or non-conductive Via fill materials particle size must be <1mil for complete penetration
You must validate your board fabricators capability to reliably build with this class of technology
.4mm Pitch
No routing between pads Use top layer routing on outside pads Use vias-in-pad wherever needed
Soldermask
Exposed pad should be the same size as the pad on the mounted device Need to make the pad larger to add stability Calls for soldermask defined pads
Surface Finish
The PCB surface finish provides a coating over the outer layer copper that prevents oxidation and provides an electrically conductive surface.
Organic Solderability Preservative (OSP) Thin layer of organic material to prevent copper oxidation. It is removed by the assembly flux. Does not tolerate multiple heat cycles. Immersion Tin (ImSn) Thin layer of tin directly on top of the copper surface. Produces an extremely flat surface for mounting of surface mount components. Downside is the possible formation of Tin whiskers. Immersion Silver (ImAg) Thin layer of silver directly on top of the copper surface. Produces a very flat surface. Compatible with no-clean assembly processes. Maintains high solderability after multiple heat cycles. Downside is that the plating will tarnish over time. Electroless Nickel Immersion Gold (ENIG) Commonly used finish that is nice and flat for fine-pitch devices. Not easily reworked and more expensive. Hot-air solder leveling (HASL) Immersing the PCB in solder. It is inexpensive and widely available, but it is not flat and therefore does not work well with fine-pitch devices
Via-In-Pad Topology
Stacked Microvia-In-Pad Pad 11mils copper (10mil SMD) BeagleBoard does not use buried vias Top-Layer2 stacked with Layer2-Layer-3 Top-Layer2 Laser Drill 6mil (0.152mm) Solder-mask defined pads Non-conductive epoxy via plugs, plated over and planarized OMAP3
Blind/Stacked 1-3
Blind 1-2
Top Soldermask Top Signal Lyr2-GND Lyr3-SIG Lyr4-SIG Lyr5-PWR Bottom Signal Bottom Soldermask
Standard Vias
Thru-hole via from top to bottom 18mil radius pad 8 mil drilled hole Plugged, plated and planarized Must be level No dimples
Bottom
Top Layer-Signal
(Area under OMAP3 Chip)
Via 1-6
V-I-P
BGA PAD
3mil trace 10mil trace
Via 1-6
Component Pad
Min trace width 3 mils
There could be an issue with shorts if soldermask not correct We were comfortable
Solderpaste Equipment
Reflow Oven
Heller EXL
X-Ray Machine
Glenbrook Technologies RTX-113
Method B
Mount back side reflow Mount top side with OMAP3530 reflow Mount Memory w/ Pick & Place reflow
Method C
Mount backside reflow Mount topside with OMAP3530 and POP reflow
Method A Process
Top GEL Hand Mount
POP
OMAP3
OMAP3
Mount w/SMT
SMT Reflow Paste Reflow
Paste
Hand Assembly
Method B Process
Paste SMT Reflow Paste SMT Reflow
Hand Assembly
Method C Process
POP Memory POP Memory
Paste
SMT
Reflow
Paste
SMT
Reflow
Hand Assembly
Method B
Final method adopted Have had excellent results
Method C
Dipping ArmPOP Memory dipped into GEL Have a lot of high volume customers doing this Did not try as we had no dipping arm
Panelization
Method A
4 boards per panel Used it on the first runs Had concerns about warping across the scoring that could cause solder shorts Nothing ever proven that this was an issue
Method B
One board per panel Method chosen
Other Parameters
Stencil thickness
.4mils
Solder Paste
AMTECH LF -4300 Lead Free Chemistry Sn96.5/Ag3.0/Cu.5
Cooldown
Time
Issues on
Always a power rail
st 1
Run
Solder Shorts under the processor 10% Yields Could it be related to.?
POP Package Profile PCB Parts Solder
Solder Shorts
nd 2
Run
rd 3
Run
Shotgun approach Changed PCB Vendor Went to single board penalization Changed POP method from A to B Kept the original profile Results
96% Yields No Shorts
Analysis of
What was the issue? Gut said PCB soldermask
nd 2
Run
Ordered more board and ran again with all other methods from Run 3
Same problem; 90% fail
Result
96% yields No shorts
Good/Bad Soldermask
GOOD BAD
Final Analysis
Soldermask is the key issue
PCB suppliers do their own thing Make sure that the thing they do is your thing!
All three POP methods should work Panalization should not be an issue, but not confirmed
It will be an issue if the soldermask is bad
Inspection Points
PCB
Visual inspection
Solder Paste
Bottom side application Top side application
Shorts
After re-flow
AOI
After final assembly
Manual inspection
Final inspection
Paste
Paste
SMT
Reflow
Reflow Shorts
AOI
Visual
Hand Assembly
PCB Check
Check soldermask
Overlap (Soldermask defined pads) Soldermask over vias
Check finish
Discoloring of finish
Check Pads
Look for dimples in the vias in pad areas
Solderpaste Inspection
Check paste for smooth application Check for missing paste (not sticking to PCB)
Shorts Test
Implemented when we had solder shorts Easy check for main issues we have seen Check across the caps using a ohmmeter
Run as a spot check Can be done at 100%
AOI Machine
Testronics 505 Machine Vision -Works off of a known good board -Check for part orientation -Check for missing parts
Final Inspection
Bad soldering Contamination Misaligned Parts Wrong parts
Functional Test
Tests all interfaces on the board Program NAND with XLoader and UBoot Tested pre and post burn-in
Burn-In
72 Hour Burn In Room temperature Running UBoot
Final Results
96%+ yield Kept single board penalization Kept assembly POP process Kept Profile Now have three suppliers of PCB
DDI (Dynamic Details, Inc) MEI Streamline
Issues to be fixed:
DC Voltage jack 1K pull-up on wait line Plated through hole issues Remove 4 test points User0 and User1 LEDS shorted
Rev B3Added a few caps back in from B2 Rev B4...Some USB HUBS not connecting on OTG Port
Noise level too highAdded a capacitor onto USB power rail
60% Failure rate Started 72 burn in process to weed out Still have 1% making it out Only solution is to move to a different package
st 1
Rev C Proto
nd 2
Rev C
Support Process
The Returns
RMA By Subsystem
Audio..0 DVI-D..2 Serial Port..19 Memory...0 S-Video...0 SD/MMC.0 USB OTG...0 User Issue..9 PMIC3 Nothing Found...1 34 Total..1.7% Serial Port..1.0%
BOM
Excel http://www.beagleboard.org/uploads/Beagle_BOM_B4.xls
PCB Files
PCB Gerber Files http://www.beagleboard.org/uploads/Beagle_Allegro_B.zip PCB Allegro Files http://www.beagleboard.org/uploads/Beagle_Gerbers_B.zip
Viewers
PDF OrCAD Gerber Allegro
Thanks To:
Contract Manufacturer CircuitCo www.circuitco.com PCB Fabricators Marcel Electronics mei4pcbs.com Dynamic Details www.ddiglobal.com Streamline www.streamlinecircuits.com PCB Layout ION Design www.iondesign.com Keith Gutierrez , Texas Instruments